MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
부품 번호: MPC8572VTAVNE ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $332 | $166,000.00 |
| 1,000 | $308 | $308,000.00 |
MPC8572VTAVNE 개요
A communications SoC (System-on-Chip) of this class integrates one or more general-purpose CPU cores, a high-throughput memory subsystem, and a flexible I/O fabric on a single die. Within the broader taxonomy, the MPC8572VTAVNE is a member of the microprocessor family (MPU), a subclass of integrated circuits, and is specifically targeted at data-plane and control-plane workloads where a single chip must terminate multiple high-speed serial links. The PowerQUICC III lineage from NXP is the third generation of the PowerQUICC architecture, designed for symmetric and asymmetric multi-core systems in networking infrastructure.
Key differentiating features include dual e500 cores with separate L1 caches, hardware table lookup and pattern-matching accelerators used for packet classification, support for DDR2 and DDR3 memory controllers with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs, Serial RapidIO (SRIO), and an integrated security engine. The 1023-ball FCBGA package exposes the full set of high-speed serial links and parallel memory buses needed for backplane routing, while a dedicated local bus controller can interface to legacy Flash and peripherals.
Architecturally, the MPC8572VTAVNE relies on the Power Architecture Book E instruction set, augmented by the Signal Processing Engine (SPE) for SIMD-style DSP operations, and a coherent CoreNet platform fabric that ties the cores, L2, and I/O together with hardware snoop and coherency. Compared with general-purpose CPUs, this design is optimized for predictable interrupt latency, DMA-driven packet movement, and tight integration with networking peripherals - which is why it has historically been preferred for line-card SoCs in switches and routers.
Typical applications include enterprise switching and routing line cards, LTE and WiMAX base-station baseband processing, industrial control and factory automation controllers, military and aerospace ruggedized networking, and storage-area network (SAN) controllers. The wide I/O mix also makes it a frequent choice for medical imaging and high-end embedded instrumentation.
When designing with this part, ensure the PCB has a sufficient copper pour and via hole stitching beneath the FCBGA land pattern to meet the 1023-ball thermal dissipation requirement; the 1.1 V core rail demands a low-noise multi-phase regulator. Avoid signal routing under the package and place the DDR2/DDR3 memory as close as possible to the controller pins to maintain timing margins.
This page synthesizes distributor stock levels, official NXP documentation, and a same-package cross-reference list that is not aggregated anywhere else, providing engineers a one-stop view for MPC8572VTAVNE selection, sourcing, and lifecycle planning.
드롭인 대체품: MPC8572VTAVNE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8572VTAVNE (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Package, Ethernet, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8572EVTAVNE
✅ 드롭인✓ 재고 있음
$125 / 개
데이터시트 보기 →MPC8572ELVTAVND
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →MPC8572VTAVND
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572EVTATLD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8572ECVTAVNE
✅ 드롭인✓ 재고 있음
$308.55 / 개
데이터시트 보기 →MPC8572VTAVNE 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) |
| Number of Cores | 2 |
| Core Clock Frequency (max) | 1.5 GHz |
| 동작 온도 범위 | 0 C to +105 C |
| Core Voltage | 1.1 V |
| L2 Cache | 1 MB (shared) |
| Memory Controller | DDR2 / DDR3 with ECC |
| PCI Express | 3 x PCIe interfaces |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) |
| Serial RapidIO | Yes |
| Security Engine | Integrated |
| 패키지 | 1023-ball FCBGA, 33 mm x 33 mm |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | compliant |
| Product Family | PowerQUICC III (MPC85xx) |
MPC8572VTAVNE 1023-ball fcbga, 33 mm x 33 mm 핀 구성 가이드
MPC8572VTAVNE(1023-ball fcbga, 33 mm x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8572VTAVNE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8572VTAVNE 적합 용도: 6 애플리케이션s: Enterprise Switching and Routing Line Cards, LTE and WiMAX Base Station Baseband, Industrial Control and Factory Automation, Storage Area Network (SAN) and RAID Controllers, Military and Aerospace Ruggedized Networking, Medical Imaging and High-End Embedded Instrumentation.
Enterprise Switching and Routing Line Cards
The MPC8572VTAVNE's dual 1.5 GHz PowerPC e500 cores and three PCI Express interfaces make it ideal for line cards in enterprise switches and routers. The cores run forwarding tables, ACLs, and routing protocols, while the integrated Triple-Speed Gigabit Ethernet MACs terminate multiple copper or SGMII uplinks without an external PHY controller. Hardware pattern-matching engines accelerate IPsec and packet classification at line rate, while the 1023-ball FCBGA exposes full 64-bit DDR2/DDR3 with ECC for routing-table memory. Compared with a discrete CPU-plus-NPU design, this SoC reduces BOM, PCB area, and certification cost for a multi-gigabit line card.
추천
LTE and WiMAX Base Station Baseband
Wireless base-station baseband processing demands deterministic packet throughput, hardware-accelerated encryption, and high-bandwidth memory. The MPC8572VTAVNE delivers all three: dual e500 cores run Layer 2/3 stack and MAC scheduling, the Signal Processing Engine (SPE) accelerates FFT and turbo-decoding primitives, and the integrated security engine terminates IPsec traffic to the core network. The 1 MB shared L2 cache and 64-bit DDR2/DDR3 controller with ECC handle the high packet-rate bursts typical of LTE PHY layer queues. Serial RapidIO connects cleanly to DSP clusters or RF front-end cards without an external bridge.
추천
Industrial Control and Factory Automation
Factory automation controllers require deterministic real-time response, deterministic Ethernet, and a robust operating temperature range. The MPC8572VTAVNE's two e500 cores can be partitioned between a real-time control loop (VxWorks or QNX) and an HMI or scripting engine, sharing memory through the coherent CoreNet fabric. Dual Gigabit Ethernet MACs support deterministic protocols such as EtherCAT, Profinet, or TSN bridges via external PHYs. The 0 to +105 C extended commercial temperature rating, plus ECC-protected memory, supports long-life factory-floor installations where downtime is costly.
추천
Storage Area Network (SAN) and RAID Controllers
External RAID controllers and SAN fabric switches need high-throughput DMA, ECC-protected memory, and multiple high-speed serial links. The MPC8572VTAVNE's three PCI Express interfaces map directly to a SAS/SATA HBA, an FC HBA, and an external management link, while the Serial RapidIO port provides an alternative fabric for tightly-coupled storage clustering. ECC on the DDR2/DDR3 controller protects against silent bit errors that would otherwise corrupt large-capacity storage arrays. The dual e500 cores run a real-time I/O scheduler and management UI simultaneously.
추천
Military and Aerospace Ruggedized Networking
Defense and aerospace networking systems need long lifecycle, extended temperature operation, and high-bandwidth deterministic processing. The MPC8572VTAVNE is qualified for 0 to +105 C operation, with the MPC8572ELVTAVND variant pushing this to -40 to +105 C for harsher platforms. The FCBGA package is compatible with PCB staking and underfill processes used for vibration resistance. Its hardware encryption accelerators offload AES, DES, and SHA workloads from the cores, freeing CPU cycles for protocol processing and situational-awareness tasks on tactical networks.
추천
Medical Imaging and High-End Embedded Instrumentation
Ultrasound and CT imaging systems need high-throughput data acquisition, real-time DSP, and reliable data links to a host PC. The MPC8572VTAVNE combines dual 1.5 GHz e500 cores with the Signal Processing Engine, allowing beamforming and reconstruction algorithms to be partitioned efficiently across cores. The three PCI Express interfaces connect to FPGAs or analog front-end digitizers, and the dual Gigabit Ethernet MACs stream processed images to the host at line rate. ECC memory protects diagnostic integrity, while the FCBGA package simplifies thermal management in compact enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8572VTAVNE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8572EVTAVNE | MPC8572ELVTAVND | MPC8572VTAVND | MPC8572ECVTAVNE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) |
| Core Clock Frequency (max) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| L2 Cache | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) |
| Security Engine | Integrated SEC 3.x | Enhanced SEC 4.x (improved) | Enhanced SEC 4.x (improved) | Integrated SEC 3.x (same) | Encryption-disabled 'C' variant |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (industrial) | 0 C to +105 C | 0 C to +105 C |
| PCI Express Interfaces | 3 | 3 | 3 | 3 | 3 |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
주요 차별점
- Enhanced security engine in the E variant (vs MPC8572EVTAVNE)
- Industrial temperature grade with ECC in the ELVTAVND variant (vs MPC8572ELVTAVND)
- Encryption-disabled 'C' revision variant for export-controlled designs (vs MPC8572ECVTAVNE)
설계 노트
Estimated: the 1023-ball FCBGA at 33 x 33 mm has a typical theta_JA in the 8-12 C/W range when mounted on a 4-layer JEDEC test PCB. At full dual-core 1.5 GHz operation the part dissipates approximately 12-15 W; ensure at least 1 oz copper planes plus thermal vias under the die, and consider a small heatsink or forced airflow for fanless enclosures. Junction temperature must stay below 105 C to match the operating spec.
Use a 0.4 mm ball-pitch escape pattern with 0.4 mm laser-drilled microvias in a sequential lamination stack-up. The FCBGA land pads must be NSMD (Non-Solder Mask Defined) per JEDEC recommendations for fine-pitch BGA to reduce pad cracking. Match the DDR2/DDR3 trace lengths to within 50 mils and place the memory chips within 50 mm of the SoC for clean signal integrity.
The 1.1 V core rail should be supplied by a multi-phase buck regulator with at least 20 A peak capability. Use 22 uF X5R ceramic bulk plus 470 uF polymer bulk decoupling at the FCBGA. The DDR termination rail (VTT) needs to track VDDQ within +/-50 mV; a dedicated VTT LDO is recommended. Decouple every supply pin with a 100 nF X7R cap as close to the ball as layout allows.
Do not route high-speed SERDES (PCIe, SRIO, SGMII) signals under the FCBGA or across reference plane splits - this destroys signal integrity and causes link training failures. Always boot from a NAND Flash or NOR Flash image verified on the actual board rev; the MPC8572VTAVNE does not have internal ROM, so an invalid boot image causes silent no-boot. Confirm the board's RCW (Reset Configuration Word) matches your boot source selection.
Place the 125 MHz system reference clock oscillator within 5 cm of the MPC8572VTAVNE clock inputs, guarded by a continuous GND plane and routed length-matched to other clocks. Use 4-mil 50-ohm controlled-impedance traces for PCIe and SGMII SERDES, with ground stitching vias every 200 mils. Match intra-pair skew to within 5 mils and inter-pair skew to within 20 mils for proper eye margins.
규정 준수 정보
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this part is intended for networking and industrial applications, not automotive. Halogen-free status was not confirmed in the Verified Web Data and is listed as unknown.
