MX30LF1G18AC-TI-T - 1Gbit 3V SLC NAND Flash, TSOP-48 | Macronix
N.º de pieza: MX30LF1G18AC-TI-T ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.52 | $35,20 |
| 100 | $2.98 | $298,00 |
| 500 | $2.61 | $1.305,00 |
| 1.000 | $2.34 | $2.340,00 |
MX30LF1G18AC-TI-T Descripción general
An SLC (Single-Level Cell) NAND Flash is a non-volatile memory that stores one bit per cell, giving it higher endurance (typically 100k P/E cycles), faster write speeds, and longer data retention than MLC/TLC counterparts. SLC NAND sits within the broader taxonomy of non-volatile memory -> flash memory -> NAND flash -> SLC NAND -> boot/storage media. It is commonly used for code storage, boot media, and industrial data logging where reliability over bit density matters.
Key features include an internal 1K+64-byte page architecture with 64-byte spare area, multi-plane operation for higher throughput, hardware block protection (PT pin) with internal weak pull-down, and support for standard ONFI command set including read, program, erase, and block protection. The 4-bit ECC requirement per 512-byte sector enables robust error correction in demanding environments.
The architecture uses a charge-trap floating gate cell technology, and the device supports dual CE operations, status register readback, and ID page read for unique device identification. Sequential read throughput scales with the bus width and ONFI timing mode selected.
Typical applications include industrial embedded systems, automotive infotainment boot media, networking equipment firmware storage, point-of-sale terminals, and factory automation controllers requiring long-term reliable non-volatile code storage.
Design consideration: ensure the host controller supports 4-bit ECC hardware engine to handle the 4-bit ECC requirement per 512-byte page, and respect the WP and PT pin pull-down behavior during power-on to avoid unintended protection lock.
This page synthesizes distributor pricing, drop-in compatible SLC NAND alternatives, and practical design notes not consolidated in any single manufacturer datasheet.
Alternativas directas para MX30LF1G18AC-TI-T — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MX30LF1G18AC-TI-T (mismo factor de forma y huella) — difiere en Access Time, Interface, Operating Temperature, Organization, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MX30LF1G18AC-XKI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30LF1G08AA-TI
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
K9F1G08U0D-PIB0
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TC58NVG0S3HTA00
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MT29F1G08ABAEAWP-IT:E
✅ Sustitución directa✓ En stock
$1.6 / unidad
Ver hoja de datos →W29N01GVSIAA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX30LF1G18AC-TI-T Valores máximos y características eléctricas
| Tipo de memoria | Non-volatile NAND Flash (SLC) |
| Density | 1 Gbit (128 M x 8) |
| Organización de memoria | 128M x 8 bit |
| Interfaz | Asynchronous Parallel |
| Access Time | 20 ns |
| VCC Supply | 2.7 V to 3.6 V |
| ECC Requirement | 4-bit ECC per 512 bytes |
| Page Size | 1 K + 64 bytes (data + spare) |
| Block Protection | Hardware PT pin, active high at power-on, internal weak pull-down |
| ONFI Compliance | ONFI 1.0 |
| Encapsulado | 48-pin TSOP-I (Type I) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount |
| Compliance | RoHS compliant |
Configuración de pines de MX30LF1G18AC-TI-T
| Pin 1 | NC — Not connected (per datasheet) |
| Pin 2 | NC — Not connected (per datasheet) |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | NC — Not connected (per datasheet) |
| Pin 5 | NC — Not connected (per datasheet) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | R/B# — Ready/Busy output, open drain |
| Pin 8 | RE# — Read Enable, active low |
| Pin 9 | CE# — Chip Enable, active low |
| Pin 10 | NC — Not connected (per datasheet) |
| Pin 11 | NC — Not connected (per datasheet) |
| Pin 12 | NC — Not connected (per datasheet) |
| Pin 13 | NC — Not connected (per datasheet) |
| Pin 14 | NC — Not connected (per datasheet) |
| Pin 15 | NC — Not connected (per datasheet) |
| Pin 16 | NC — Not connected (per datasheet) |
| Pin 17 | NC — Not connected (per datasheet) |
| Pin 18 | NC — Not connected (per datasheet) |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | DQ0 — Data I/O 0 |
| Pin 27 | DQ1 — Data I/O 1 |
| Pin 28 | DQ2 — Data I/O 2 |
| Pin 29 | DQ3 — Data I/O 3 |
| Pin 30 | DQ4 — Data I/O 4 |
| Pin 31 | DQ5 — Data I/O 5 |
| Pin 32 | DQ6 — Data I/O 6 |
| Pin 33 | DQ7 — Data I/O 7 |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | VSS — Ground |
| Pin 37 | VCC — Power supply (2.7V to 3.6V) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | WE# — Write Enable, active low |
| Pin 48 | WP# — Write Protect, active low |
Aplicaciones típicas
MX30LF1G18AC-TI-T es adecuado para 6 aplicacións: Industrial Embedded Boot Media, Automotive Infotainment Code Storage, Networking Equipment Firmware Storage, Point-of-Sale Terminals, Industrial Data Logging, Set-Top Box and Smart Home Gateway.
Industrial Embedded Boot Media
The MX30LF1G18AC-TI-T is widely used as boot media in industrial embedded systems where reliable, long-term code storage is required. Its 1 Gbit SLC density and 20 ns access time support fast firmware load at power-on, while 4-bit ECC per 512-byte page ensures robust error correction over the part's operational lifetime. The hardware PT pin allows instant write-protection of the boot region during production, preventing accidental in-field reprogramming. Designers typically pair this NAND with an embedded MPU (e.g. NXP i.MX, TI Sitara, or Rockchip) that has a 4-bit BCH hardware ECC engine, enabling reliable boot from raw NAND without an intermediate NOR stage.
Recomendado
Automotive Infotainment Code Storage
The MX30LF1G18AC-TI-T serves as code and map data storage in automotive infotainment and telematics systems, where automotive-grade temperature tolerance and high endurance are essential. The SLC NAND architecture delivers 10x the write endurance of MLC/TLC alternatives, suiting the frequent OTA-style firmware updates typical of connected car systems. The 48-TSOP-I footprint is compatible with AEC-Q100 design flows when paired with the automotive-qualified variant; designers should pair this part with an in-vehicle SoC that supports ONFI 1.0 asynchronous NAND timing for plug-and-play boot sequencing.
Recomendado
Networking Equipment Firmware Storage
In routers, switches, and base-station equipment the MX30LF1G18AC-TI-T functions as primary firmware and configuration storage. The 1 Gbit SLC density supports typical router OS images plus persistent logs, and the 20 ns access time ensures quick boot sequencing at system startup. ONFI 1.0 compatibility simplifies controller integration with popular networking SoCs from Broadcom, Qualcomm, and Marvell. The wide -40C to +85C industrial temperature range guarantees operation in thermally uncontrolled outdoor enclosures and central-office equipment alike.
Recomendado
Point-of-Sale Terminals
POS terminals depend on reliable non-volatile storage for the terminal OS, payment application, and transaction logs; the MX30LF1G18AC-TI-T delivers this reliability through its SLC architecture and 4-bit ECC engine requirement. The 48-TSOP-I footprint fits standard POS mainboard layouts, while the 3V supply matches the typical POS SoC power tree. The hardware WP and PT pins allow secure boot flow with read-only firmware regions and protected configuration zones, helping PCI-PTS compliance efforts by isolating sensitive code.
Recomendado
Industrial Data Logging
Factory automation and process-control systems use the MX30LF1G18AC-TI-T as long-term storage for sensor data, alarm logs, and machine telemetry. Its SLC endurance of typically 100k P/E cycles per block supports years of continuous write activity at industrial logging rates, while the 1K + 64-byte page architecture enables efficient small-record writes. The hardware PT protection prevents accidental erase of historical data in the field, and the wide -40C to +85C temperature range tolerates factory floor thermal conditions. Engineers typically add wear-leveling firmware to maximize device longevity.
Recomendado
Set-Top Box and Smart Home Gateway
Smart-home gateways, set-top boxes, and connected appliances use the MX30LF1G18AC-TI-T for OS image, settings, and application data storage. Its parallel 8-bit interface plugs directly into the address/data bus of cost-optimized IoT SoCs without requiring an SPI bridge, lowering BOM cost. The 20 ns read access time supports reasonably responsive boot and app launch, and the ONFI 1.0 standard simplifies porting firmware stacks across consumer and industrial variants of the same SoC family.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MX30LF1G18AC-TI-T — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MX30LF1G18AC-XKI | MX30LF1G08AA-TI | K9F1G08U0D-PIB0 | TC58NVG0S3HTA00 | MT29F1G08ABAEAWP | W29N01GVSIAA |
|---|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Samsung | Toshiba | Micron Technology | Winbond |
| Package | 48-TSOP-I | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same | 48-TSOP-I - same |
| Density | 1 Gbit | 1 Gbit | 512 Mbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Organization | 128M x 8 | 128M x 8 | 64M x 8 | 128M x 8 | 128M x 8 | 128M x 8 | 128M x 8 |
| VCC Range | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V |
| Access Time (tRC) | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| ECC Requirement | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes | 4-bit per 512 bytes |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
Diferenciadores clave
- Macronix 3V SLC NAND family with broad density range (frente a K9F1G08U0D-PIB0)
- 20 ns access time matches fastest in class (frente a TC58NVG0S3HTA00)
- Lower cost position vs equivalent Samsung/Toshiba parts (frente a MT29F1G08ABAEAWP)
Notas de diseño
Place decoupling capacitors (typically 0.1uF ceramic in parallel with 4.7uF bulk) within 5 mm of the VCC pin. The 48-TSOP-I package is a fine-pitch SMD; follow JEDEC MSL-3 moisture sensitivity handling and use a 4-layer PCB with continuous ground plane beneath the NAND to minimize digital switching noise coupling into the host controller. Keep DQ0-DQ7 trace lengths matched within 1 mm to preserve bus timing margins.
Series-terminate each DQ line with 33 ohm resistors placed close to the NAND when the bus length exceeds 50 mm on FR-4. The R/B# pin is open-drain and requires an external pull-up to VCC (typically 4.7k ohm). Avoid running DQ traces parallel to noisy switching power rails; maintain at least 3x trace spacing separation to limit crosstalk on the 8-bit parallel bus.
Do not leave the WP# pin floating - it must be tied high (inactive) or low (write-protect) per application intent. The PT (protection) pin is active high at power-on with an internal weak pull-down; if left NC the entire chip is protected from write/erase until PT is driven low. Ensure your host controller initializes PT to low after reset to enable normal operation. Always include a 4-bit ECC engine in the host; skipping ECC will accumulate bit errors over device lifetime.
The MX30LF1G18AC-TI-T is rated -40C to +85C for industrial operation. Program/erase operations generate transient current spikes; ensure VCC bulk capacitance is sized to hold VCC within spec during peak Icc (consult Macronix datasheet for peak Icc vs tPROG/tERS). For high-altitude or enclosed designs, derate maximum ambient temperature by 5C per 1000 m above sea level per standard thermal design practice.
Información de cumplimiento
RoHS compliant per Macronix product page. Standard industrial grade (-40C to +85C); for AEC-Q100 automotive applications the dedicated automotive-grade variant should be selected. Halogen-free status not explicitly stated in the verified web data.
