PIC24FJ64GA412T-I/BG - 16-bit 32MHz XLP MCU w/ 64KB Flash | Microchip
N.º de pieza: PIC24FJ64GA412T-I/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.96 | $4,96 |
| 10 | $4.46 | $44,60 |
| 100 | $3.84 | $384,00 |
| 500 | $3.25 | $1.625,00 |
| 1.000 | $2.79 | $2.790,00 |
| 2.500 | $2.45 | $6.125,00 |
PIC24FJ64GA412T-I/BG Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals onto one die. The PIC24FJ family is a 16-bit modified Harvard architecture microcontroller line within the broader PIC MCU family tree (MCU -> microcontroller -> embedded controller -> semiconductor). The "FJ" suffix denotes the use of Microchip's nanoWatt XLP technology for ultra-low sleep currents in battery-powered applications, while the GA412 subset adds segmented LCD support and a dedicated crypto module for AES/SHA acceleration.
Key features include 64 KB (22K x 24 instruction words) dual-partition Flash, 8 KB RAM, segmented LCD driver supporting up to 96 segments, 16-channel 10-bit ADC, five 16-bit timers, six UART, three I2C, three SPI, an RTCC with calendar mode, and a hardware AES/SHA crypto accelerator. The TFBGA-121 (10x10 mm) package provides a thin-profile surface-mount footprint for space-constrained designs. Power consumption is rated in the microampere range during sleep, supporting coin-cell and energy-harvesting applications.
The architecture is built on a 16-bit modified Harvard core with a 24-bit instruction word that improves code density versus typical 32-bit MCUs. Wide 16-bit data paths and DSP-class instructions accelerate sensor-fusion and signal-processing tasks. The integrated segmented-LCD charge-pump driver eliminates the need for an external LCD bias generator. The hardware crypto engine offloads AES-128/192/256 and SHA-256 from the CPU, enabling secure firmware updates and tamper-resistant communications.
Typical applications include secure IoT sensor nodes, low-power medical monitors with LCD readouts, electronic shelf labels, secure token-based authentication devices, fitness wearables with on-glass displays, and industrial HMI panels. The integrated LCD and crypto blocks allow a single chip to replace a multi-component discrete solution.
When designing, plan for I/O multiplexing carefully: the high pin count concentrates peripherals on shared pins. Use the segmented LCD charge pump with proper bypass capacitors per the datasheet, and verify pin assignments for your chosen LCD glass. For low-power designs, leverage the deep-sleep and sleep modes with peripheral wake-up sources rather than polling loops.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes not found on any single distributor page.
Alternativas directas para PIC24FJ64GA412T-I/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC24FJ64GA412T-I/BG (mismo factor de forma y huella) — difiere en Package, ADC, Core Architecture, Mounting Type, LCD Driver.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC24FJ64GA412-I/BG
✅ Sustitución directa✓ En stock
$3.95 / unidad
Ver hoja de datos →PIC24FJ128GA412T-I/BG
✅ Sustitución directa✓ En stock
$3.18 / unidad
Ver hoja de datos →PIC24FJ256GB412T-I/BG
✅ Sustitución directa✓ En stock
$5.85 / unidad
Ver hoja de datos →PIC24FJ512GB610T-I/BG
✅ Sustitución directa✓ En stock
$8.1 / unidad
Ver hoja de datos →PIC24FJ256GA610T-I/BG
✅ Sustitución directa✓ En stock
$5.36 / unidad
Ver hoja de datos →PIC24FJ64GA412T-I/BG Valores máximos y características eléctricas
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Family | PIC® XLP™ 24F |
| CPU Clock Speed | 32 MHz (16 MIPS / 32 MHz = 16 MIPS instruction rate, 32 MHz with Doze) |
| Program Memory (Flash) | 64 KB (22K x 24 instruction words) |
| RAM | 8 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| ADC | 10-bit, multi-channel |
| LCD Driver | Segmented LCD, up to 96 segments |
| Crypto Engine | Hardware AES/SHA accelerator |
| Communication Peripherals | 6x UART, 3x I2C, 3x SPI |
| Timers | Five 16-bit timers |
| RTCC | Real-Time Clock with calendar |
| Encapsulado | 121-ball TFBGA (10x10 mm) |
| Temperatura de funcionamiento | -40C to +85C (industrial grade) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| XLP Sleep Current | nanoWatt XLP technology (sleep current in microampere range, see datasheet) |
Guía de configuración de pines de PIC24FJ64GA412T-I/BG 121-ball tfbga (10x10 mm)
Configuración de pines para PIC24FJ64GA412T-I/BG (encapsulado 121-ball tfbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC24FJ64GA412T-I/BG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC24FJ64GA412T-I/BG es adecuado para 6 aplicacións: Secure IoT Sensor Nodes, Battery-Powered Medical Monitors with LCD Display, Electronic Shelf Labels (ESL), Industrial HMI Panels with Secure Access, Fitness Wearables with On-Glass Displays, Secure Token-Based Authentication Devices.
Secure IoT Sensor Nodes
The PIC24FJ64GA412T-I/BG's hardware AES/SHA crypto engine and nanoWatt XLP sleep currents make it ideal for secure IoT sensor nodes that need TLS-style encryption with multi-year battery life. The 32 MHz CPU executes 16-bit MAC-layer cryptography efficiently, while the 64 KB Flash accommodates TLS stacks, sensor drivers, and application logic. Deep-sleep currents in the microampere range allow CR2032 coin-cell operation for years with duty-cycled wake-ups. Designers can pair it with Microchip's RN2483 LoRa or ATWINC1500 Wi-Fi modules for cloud connectivity.
Recomendado
Battery-Powered Medical Monitors with LCD Display
The PIC24FJ64GA412T-I/BG integrates a segmented LCD driver supporting up to 96 segments and nanoWatt XLP sleep modes, making it a single-chip solution for portable medical devices such as glucose meters, pulse oximeters, and digital thermometers. The hardware crypto engine protects patient data per HIPAA-style requirements, while the 10-bit ADC captures analog biosensor signals with 1 mV resolution. The TFBGA-121 package fits inside compact handheld enclosures, and the 2.0V to 3.6V range supports 2x AAA or coin-cell battery packs. Validated over -40C to +85C industrial range for home and clinical environments.
Recomendado
Electronic Shelf Labels (ESL)
The PIC24FJ64GA412T-I/BG's integrated segmented LCD driver and XLP sleep currents suit electronic shelf label applications requiring years of battery life on coin cells with infrequent RF updates. The 32 MHz CPU processes display updates and RF protocol frames fast enough to enter deep-sleep quickly between updates. The hardware crypto engine secures price-update commands against tampering, a critical feature for retail chains. Combined with a sub-GHz RF transceiver like Microchip's MRF89XA, an ESL node can run 5+ years on a CR2032 with hourly price-refresh duty cycles.
Recomendado
Industrial HMI Panels with Secure Access
The PIC24FJ64GA412T-I/BG drives segmented LCD HMIs while the AES/SHA engine authenticates operators via secure tokens or password hashes. The 6 UARTs support multi-drop RS-485 industrial networks, and the 3 SPI channels interface with capacitive touch controllers. The industrial -40C to +85C temperature rating allows deployment in factory floors and outdoor kiosks. With 64 KB Flash, the device runs Microchip's MLA TCP/IP stack or Modbus libraries plus custom HMI logic without external memory expansion.
Recomendado
Fitness Wearables with On-Glass Displays
The PIC24FJ64GA412T-I/BG's integrated segmented LCD driver eliminates the need for a separate display driver IC in fitness bands and watches, reducing BOM cost and PCB area. The XLP technology delivers sleep currents low enough for coin-cell operation, while the 32 MHz CPU handles step counting, heart-rate sampling, and BLE radio management via UART. The hardware crypto engine secures Bluetooth pairing keys and protects stored fitness data. The 121-ball TFBGA package is thin enough to fit inside a 10 mm thick wearable enclosure.
Recomendado
Secure Token-Based Authentication Devices
The PIC24FJ64GA412T-I/BG's dedicated AES-128/192/256 and SHA-256 hardware engine accelerates cryptographic operations needed for hardware authenticators, FIDO2 security keys, and smart-card replacements. The dual-partition Flash enables secure firmware update verification, while the segmented LCD can show PIN entry feedback or transaction confirmations. With XLP sleep modes, the token can sit idle for years on a coin cell, waking only on button press for cryptographic handshakes. The wide operating voltage supports USB-powered and battery-powered variants.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC24FJ64GA412T-I/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC24FJ64GA412-I/BG | PIC24FJ128GA412T-I/BG | PIC24FJ256GB412T-I/BG | PIC24FJ512GB610T-I/BG | PIC24FJ256GA610T-I/BG |
|---|---|---|---|---|---|---|
| Package | 121-ball TFBGA (10x10 mm) | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 128 KB | 256 KB | 512 KB | 256 KB |
| RAM | 8 KB | 8 KB | 8 KB | 16 KB | 32 KB | 16 KB |
| CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| Crypto Engine | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware | AES/SHA hardware |
| Segmented LCD Driver | Yes (up to 96 segments) | Yes (up to 96 segments) | Yes (up to 96 segments) | Yes (up to 96 segments) | Yes | Yes |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Diferenciadores clave
- Same-package 100% Flash/RAM upgrade with USB connectivity (frente a PIC24FJ128GA412T-I/BG)
- Tape-and-reel factory packaging for high-volume assembly (frente a PIC24FJ64GA412-I/BG)
- Integrated hardware AES/SHA crypto engine eliminates external secure element (frente a Cortex-M0+ MCUs without crypto)
- On-chip segmented LCD driver up to 96 segments eliminates external LCD bias IC (frente a PIC24FJ256GA610T-I/BG (and similar Cortex-M competitors))
- nanoWatt XLP sleep currents extend coin-cell battery life by years (frente a Higher-performance Cortex-M4 MCUs)
Notas de diseño
The 121-ball TFBGA (10x10 mm) package has a 0.8 mm ball pitch per Microchip packaging specifications. Use a 4-layer PCB with a continuous ground plane beneath the BGA to provide controlled-impedance returns and thermal dissipation. Place at least 4 to 6 microvia-in-pad connections per ball row to the inner ground and power planes, following IPC-7093 design guidelines for BGA packages. Decoupling capacitors (100 nF + 1 uF) must be placed within 2 mm of the VDD/VSS balls to suppress switching noise.
Estimated: at 32 MHz active mode drawing 8 mA typical at 3.3V, the PIC24FJ64GA412T-I/BG consumes ~26 mW active power. In deep-sleep XLP mode at 25C the datasheet specifies current in the microampere range. For battery-life calculations, average duty cycle must include wake-time plus full deep-sleep duration. Place a bulk 4.7 uF + 100 nF decoupling pair on each VDD/VSS pair to handle inrush during oscillator startup, especially when waking from deep-sleep with the PLL enabled.
Common pitfalls when designing with PIC24FJ64GA412T-I/BG: (1) do not skip the segmented LCD charge-pump bypass capacitors - the datasheet specifies exact values (typically 1 uF + 100 nF); omitting them produces ghost segments and contrast drift. (2) The dual-partition Flash requires the live-update firmware to be A/B tested before deployment to avoid bricking. (3) The hardware AES engine needs proper key-zeroing routines to avoid leaving keys in RAM after use, important for secure-token applications.
Estimated: at maximum 32 MHz operation drawing 15 mA from 3.3V, the PIC24FJ64GA412T-I/BG dissipates ~50 mW. The TFBGA-121 package has a typical theta_JA of approximately 40-50 C/W on a 4-layer JEDEC test board, resulting in a 2-3 C junction-temperature rise above ambient - well within the 85C industrial limit. For hot environments (industrial cabinets above 70C), verify thermal performance with actual PCB copper area using the datasheet thermal model.
Route the LCD segment and common signals on the bottom or inner layers to keep the top layer free for component placement. Keep trace lengths matched within the timing tolerances specified in the PIC24FJ GA412 family datasheet to avoid segment ghosting. For the analog 10-bit ADC, isolate AVdd/AVss pins and use a ferrite bead + capacitor pi-filter to decouple the analog supply from digital noise. Place the 32.768 kHz crystal close to the SOSC pins with short, symmetric traces to minimize clock jitter.
Información de cumplimiento
RoHS compliant per Microchip product page and onlinecomponents listing. Not AEC-Q100 qualified - not intended for automotive under-hood applications. Industrial -40C to +85C grade only. Halogen-free status not specified in available data.