PIC32MX360F512L-80V/BG - 80MHz 32-bit MCU 512KB Flash | Microchip
N.º de pieza: PIC32MX360F512L-80V/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $10.4 | $10,40 |
| 10 | $9.36 | $93,60 |
| 100 | $8.32 | $832,00 |
| 500 | $7.48 | $3.740,00 |
| 1.000 | $6.65 | $6.650,00 |
PIC32MX360F512L-80V/BG Descripción general
A 32-bit MCU is a microcontroller with a 32-bit data path and register width, providing higher throughput and a richer peripheral mix than 8-bit or 16-bit microcontrollers. The PIC32 family sits in the hierarchy 32-bit MCU -> MIPS M4K core -> PIC32MX3xx/4xx family -> Microchip 32-bit MCU portfolio -> embedded microcontroller -> semiconductor IC.
Key specifications include 512 KB flash, 32 KB SRAM, 80 MHz core speed, USB 2.0 full-speed On-The-Go, CAN 2.0B, four channels of hardware DMA, and a 16-channel 10-bit ADC capable of 1 MSPS. Communication peripherals include UART, SPI, I2C, and PMP/PSP. The device is offered in a 121-ball TFBGA (10x10 mm) package and is qualified for -40C to +105C industrial temperature range (V grade).
The M4K core uses a 5-stage Harvard pipeline with single-cycle hardware multiply, 32x32-bit registers, and 32x32-bit shadow registers for fast context switch and interrupt response. Code density is improved with MIPS16e mode. Four DMA channels allow autonomous data movement between peripherals and memory, freeing the CPU from high-bandwidth copy operations.
Typical applications include industrial control, USB peripherals, CAN-based automotive body electronics, graphical display controllers, and embedded connectivity gateways. The USB OTG and CAN combination is also suited for portable medical devices, motor control, and human-machine interface (HMI) products.
When using the PIC32MX360F512L-80V/BG, designers should follow the datasheet's decoupling recommendation of a 0.1 uF plus 10 uF bulk capacitor near each VDD/VSS pin group, and follow the ICSP trace length guideline for stable in-circuit programming.
This page synthesizes distributor stock, distributor pricing, and parameter-matched same-family alternatives into a single comparison view, alongside drop-in recommendations and practical design notes - information that is not consolidated on the manufacturer datasheet PDF.
Alternativas directas para PIC32MX360F512L-80V/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX360F512L-80V/BG (mismo factor de forma y huella) — difiere en ADC, Package, DMA Channels, Operating Temperature, Timers.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX360F512L-80I/BG
✅ Sustitución directa✓ En stock
$10.2 / unidad
Ver hoja de datos →PIC32MX360F512LT-80V/BG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX360F512L-80V/
✅ Sustitución directa✓ En stock
$4.35 / unidad
Ver hoja de datos →PIC32MX360F256L-80V/BG
✅ Sustitución directa✓ En stock
$6.4 / unidad
Ver hoja de datos →PIC32MX360F256L-80I/BG
✅ Sustitución directa✓ En stock
$7.58 / unidad
Ver hoja de datos →PIC32MX360F256L-80V/PT
✅ Sustitución directa✓ En stock
$5.78 / unidad
Ver hoja de datos →PIC32MX360F512L-80V/BG Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K, 32-bit |
| Maximum Core Frequency | 80 MHz |
| Core Performance | 105 DMIPS |
| Pipeline Stages | 5-stage Harvard |
| Code Compression | MIPS16e (up to 40% smaller code) |
| Program Flash Memory | 512 KB |
| SRAM | 32 KB |
| DMA Channels | 4 |
| ADC | 10-bit, 16-channel, 1 MSPS |
| USB | USB 2.0 Full-Speed OTG |
| CAN | CAN 2.0B |
| Serial Interfaces | UART, SPI, I2C |
| Parallel Master Port (PMP) | Yes |
| Operating Voltage | 2.3 V to 3.6 V |
| Temperatura de funcionamiento | -40C to +105C (V grade) |
| Encapsulado | 121-ball TFBGA (10x10 mm) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC32MX360F512L-80V/BG 121-ball tfbga (10x10 mm)
Configuración de pines para PIC32MX360F512L-80V/BG (encapsulado 121-ball tfbga (10x10 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MX360F512L-80V/BG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MX360F512L-80V/BG es adecuado para 6 aplicacións: Industrial Control Systems, USB Peripherals and HID Devices, CAN-Based Automotive Body Electronics, Graphical Display and HMI Controllers, Portable Medical Devices, Embedded Connectivity Gateways.
Industrial Control Systems
The PIC32MX360F512L-80V/BG's 80 MHz MIPS M4K core, 512 KB flash, and 32 KB RAM make it well-suited for industrial control systems that combine real-time I/O with communication stacks. The 105 DMIPS processing headroom supports PID loops, Modbus or CANopen stacks, and HMI logic on a single chip. Industrial -40C to +105C operating range (V grade) supports factory-floor deployment without additional hardening. The 16-channel 10-bit ADC reads analog sensors while four DMA channels autonomously move data between ADC buffers and memory, reducing interrupt load.
Recomendado
USB Peripherals and HID Devices
The PIC32MX360F512L-80V/BG integrates a USB 2.0 full-speed On-The-Go controller suitable for HID, CDC, mass storage, and vendor-class USB peripherals. With 512 KB of flash, USB descriptor tables, class drivers, and application firmware fit comfortably. The 32 KB RAM buffers USB endpoint data and application payload. Designers benefit from the Microchip USB stack and the Harmony framework, which provide ready-to-use USB class drivers. The 80 MHz core handles USB protocol plus application logic without taxing performance margins.
Recomendado
CAN-Based Automotive Body Electronics
The PIC32MX360F512L-80V/BG's on-chip CAN 2.0B controller and -40C to +105C operating range make it suitable for non-safety automotive body electronics such as body control modules, climate control, and lighting controllers. The 80 MHz M4K core handles CAN protocol and application logic, while 512 KB flash supports CAN stacks and proprietary vehicle-network layers. Note: this part is not AEC-Q100 qualified; for safety-critical applications consider PIC32MX-grade automotive qualified variants.
Recomendado
Graphical Display and HMI Controllers
The PIC32MX360F512L-80V/BG's Parallel Master Port (PMP) and 80 MHz core support driving graphical LCD or TFT panels for HMI controllers in industrial equipment and consumer appliances. PMP can interface to external graphics controllers or directly to 8/16-bit parallel displays. Combined with 32 KB RAM for framebuffer staging and 512 KB flash for graphics libraries, the part handles menu rendering, touch input decoding, and serial communication to host MCUs. The BGA package minimizes PCB area for compact HMI modules.
Recomendado
Portable Medical Devices
The PIC32MX360F512L-80V/BG's combination of USB OTG, ADC, and 80 MHz performance is suitable for portable medical peripherals such as patient monitors, therapy devices, and diagnostic readers. USB OTG enables tethered data transfer to PCs or tablets, while the 16-channel 10-bit ADC reads analog sensor inputs. Note that FDA-cleared devices may require specific certifications or partner ecosystem tools. Designers should follow the Medical Device Data Sheet standard for IEC 60601 compliance paths through medical review.
Recomendado
Embedded Connectivity Gateways
The PIC32MX360F512L-80V/BG integrates USB, CAN, UART, SPI, and I2C - a complete peripheral mix for embedded connectivity gateways bridging USB/IoT to CAN or serial fieldbuses. The 512 KB flash accommodates full TCP/IP or USB stacks plus protocol translation layers. The 32 KB RAM supports buffer over the network and connection state, while four DMA channels autonomously move data between peripherals and memory. This is the canonical use case for the PIC32MX3XX/4XX family per the Microchip family datasheet PDF.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX360F512L-80V/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX360F512L-80I/BG | PIC32MX360F512LT-80V/BG | PIC32MX360F512L-80V/ | PIC32MX360F256L-80V/BG | PIC32MX360F256L-80I/BG |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-ball TFBGA (10x10 mm) | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same | 121-ball TFBGA (10x10 mm) - same |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Operating Temperature | -40C to +105C (V grade) | -40C to +85C (I grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +85C (I grade) |
| USB OTG | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes | Yes |
| DMA Channels | 4 | 4 | 4 | 4 | 4 | 4 |
Diferenciadores clave
- Wide industrial temperature range (frente a PIC32MX360F512L-80I/BG)
- Compact 10x10 mm BGA footprint (frente a PIC32MX340F512H-80V/PT)
- Higher flash density than standard memory (frente a PIC32MX360F256L-80V/BG)
Notas de diseño
Decouple each VDD/VSS pin group with a 0.1 uF ceramic capacitor placed as close to the IC as possible, plus a 10 uF bulk capacitor near the MCU per the PIC32MX3XX/4XX family datasheet power-supply design recommendation. The part accepts 2.3 V to 3.6 V; for stable USB operation, hold VDD at 3.3 V with no more than 3% ripple. Power-on-reset and brown-out reset thresholds should be configured in firmware using the FSU configuration mechanism to match the supply ramp profile.
The 121-ball TFBGA (10x10 mm) package requires a 4-6 layer stackup for proper power and ground distribution. Use a solid ground plane on layer 2 and a power plane on layer 3 with via stitching holes at BGM protection level around the BGA perimeter. Microvia or via-in-pad designs are recommended for escape routing. BGA landing pad diameter and pitch should follow the Microchip package drawing specification in DS61143H.
Keep ICSP trace length between the ICSP header and the PGECx/PGEDx pins as short as possible per the PIC32MX3XX/4XX family datasheet ICSP design recommendation. Multiple PGADJ are available; you can use any pair but you must use them as a pair (e.g., PGEC2 with PGED2). All VSS and VDD pins must be connected - even one unconnected contact can cause programming failures. Route the USB DP/DM traces as a 90-ohm differential pair with no stubs.
Avoid common pitfalls when designing with the PIC32MX360F512L-80V/BG. First, do not leave any VSS or VDD pin unconnected - all must be tied to the rail or labeled with the BGM designation in the schematic. Second, when migrating from PIC32MX340/36F devices with different pin counts, double-check the BGA ball number-to-pin function mapping because the 121-ball TFBGA ball assignments differ from TQFP and QFN packages in the same family.
Información de cumplimiento
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - this is a non-automotive qualified part. Halogen-free status not explicitly stated in retrieved data.