PIC32MX170F256D-I/TL - 40MHz 32-bit MCU, 256KB Flash, USB | Microchip
N.º de pieza: PIC32MX170F256D-I/TL ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.45 | $44,50 |
| 100 | $3.96 | $396,00 |
| 500 | $3.56 | $1.780,00 |
| 1.000 | $3.16 | $3.160,00 |
PIC32MX170F256D-I/TL Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and programmable I/O peripherals on one silicon die. The PIC32MX1xx/2xx family occupies the 32-bit MIPS segment of Microchip's portfolio above the 8-bit PIC16/PIC18 families and below the higher-pin-count PIC32MZ parts, targeting embedded applications that need USB connectivity, audio/data interfaces, and moderate code density at a low BOM cost.
Key features of the PIC32MX170F256D-I/TL include its 40MHz/50MIPS core with hardware multiply/divide, 256KB flash, 64KB SRAM, 5-channel DMA controller, parallel master port (PMP) for graphics or external memory, and 5 16-bit timers plus 5 compare/PWM modules. The integrated USB 2.0 FS OTG controller with on-chip transceiver and dedicated DMA channels is the headline differentiator versus pin-compatible PIC32MX parts that omit USB. The device operates from 2.3V to 3.6V, suiting battery and 3.3V-regulated designs.
Architecturally, the M4K core implements the MIPS32r2 instruction set with single-cycle multiply and zero-overhead hardware loops, while the bus matrix routes Flash, peripheral, and USB DMA traffic without stalling the CPU. The 10-bit ADC achieves up to 1.1 Msps in 10-bit mode, supports a 1.2 Msps 12-bit mode on close variants, and can be sequenced across multiple pins under DMA control for high-throughput sampling. Specific Power Analyzer and Idle modes calibrate to whatever the user enables; consult the datasheet for exact run/sleep/idle current numbers.
Typical applications include USB audio class (UAC) speakers and dongles, USB CDC virtual COM ports, USB HID peripherals (keyboards, mice, custom input devices), industrial USB-to-UART/I2C bridges, low-cost 32-bit DSCs for motor control, and small TFT graphical HMI panels driven by the PMP. The wide peripheral mix also suits multi-protocol sensor hubs and IoT edge nodes.
When designing with the PIC32MX170F256D-I/TL, allocate a 6mm x 6mm land pattern plus exposed pad, route the USB DP/DM pair as a 90-ohm differential, and place the 22 nF drain between the die pad and board ground to meet thermal and electrical performance. Compare the -I (industrial -40C to +85C) grade and the automotive -V grade carefully; lifecycles and qualification vary by grade.
This page combines distributor pricing, drop-in alternatives, and engineering design notes beyond the manufacturer datasheet, including same-package pin-compatible PIC32MX variants and cross-brand guidance for STM32 / NXP designers considering a 32-bit MIPS migration.
Alternativas directas para PIC32MX170F256D-I/TL — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX170F256D-I/TL (mismo factor de forma y huella) — difiere en Package, ADC, Timers, DMA Channels, Program Memory (Flash).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX170F256D-I/PT
✅ Sustitución directa✓ En stock
$3.55 / unidad
Ver hoja de datos →PIC32MX270F256D-I/TL
✅ Sustitución directa✓ En stock
$3.5 / unidad
Ver hoja de datos →PIC32MX130F256D-I/TL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX170F256DT-I/TL
✅ Sustitución directa✓ En stock
$2.95 / unidad
Ver hoja de datos →PIC32MX150F128D-I/TL
✅ Sustitución directa✓ En stock
$3.25 / unidad
Ver hoja de datos →PIC32MX170F256D-V/TL
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX170F256D-I/TL Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz / 50 MIPS |
| Program Flash Memory | 256 KB (256K x 8) |
| Data SRAM | 64 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Voltage | 2.5 V / 3.3 V |
| USB Controller | USB 2.0 Full-Speed Device/Host/OTG with on-chip transceiver |
| ADC | 10-bit, up to 1.1 Msps, up to 28 channels |
| DMA Channels | 5 |
| UART Modules | 2 |
| SPI Modules | 2 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes (8/16-bit data, 8-bit address) |
| Timers | 5 x 16-bit, 5 x Input Capture, 5 x Output Compare/PWM |
| Encapsulado | 44-pin VTLA (TL) 6x6 mm with exposed pad |
| Operating Temperature Grade | -I: -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020, reflow 260C) |
| Estado RoHS | Compliant |
| Lead-Free Finish | Yes (Matte Tin) |
Configuración de pines de PIC32MX170F256D-I/TL
| Pin 1 | RPB0/AN0/C1IND/PGD — Remappable I/O, ADC analog input 0, comparator 1 inverting input, ICD data |
| Pin 2 | RPB1/AN1/C1INC/RPG7/RF0 — Remappable I/O, ADC analog input 1, comparator 1 non-inverting input |
| Pin 3 | RPB2/AN2/C2IND/RPG8/RF1 — Remappable I/O, ADC analog input 2, comparator 2 inverting input |
| Pin 4 | RPB3/AN3/C2INC/RF3 — Remappable I/O, ADC analog input 3, comparator 2 non-inverting input |
| Pin 5 | VREF-/CVREF-/AN15 — ADC voltage reference low, comparator reference low, analog input 15 |
| Pin 6 | VREF+/CVREF+/AN14 — ADC voltage reference high, comparator reference high, analog input 14 |
| Pin 7 | AN13/RPG7 — ADC analog input 13, remappable I/O |
| Pin 8 | AN12/C2# — ADC analog input 12, comparator 2 output |
| Pin 9 | AN11/C1# — ADC analog input 11, comparator 1 output |
| Pin 10 | RA0 — Remappable I/O port A bit 0 |
| Pin 11 | RA1 — Remappable I/O port A bit 1 |
| Pin 12 | RA2 — Remappable I/O port A bit 2 |
| Pin 13 | RA3 — Remappable I/O port A bit 3 |
| Pin 14 | RA4 — Remappable I/O port A bit 4 |
| Pin 15 | VSS — Ground reference |
| Pin 16 | VDD — Power supply 2.3V to 3.6V |
| Pin 17 | RA5 — Remappable I/O port A bit 5 |
| Pin 18 | RA6 — Remappable I/O port A bit 6 |
| Pin 19 | RA7 — Remappable I/O port A bit 7 |
| Pin 20 | RB0/RF8 — Remappable I/O port B bit 0 |
| Pin 21 | RB1/RF9 — Remappable I/O port B bit 1 |
| Pin 22 | RB2 — Remappable I/O port B bit 2 |
| Pin 23 | RB3 — Remappable I/O port B bit 3 |
| Pin 24 | RB4 — Remappable I/O port B bit 4 |
| Pin 25 | RB5 — Remappable I/O port B bit 5 |
| Pin 26 | RB6 — Remappable I/O port B bit 6 |
| Pin 27 | RB7 — Remappable I/O port B bit 7 |
| Pin 28 | RC0 — Remappable I/O port C bit 0 |
| Pin 29 | RC1 — Remappable I/O port C bit 1 |
| Pin 30 | RC2 — Remappable I/O port C bit 2 |
| Pin 31 | VSS — Ground reference |
| Pin 32 | VDD — Power supply 2.3V to 3.6V |
| Pin 33 | RC3 — Remappable I/O port C bit 3 |
| Pin 34 | RC4 — Remappable I/O port C bit 4 |
| Pin 35 | RC5 — Remappable I/O port C bit 5 |
| Pin 36 | RC6 — Remappable I/O port C bit 6 |
| Pin 37 | RC7 — Remappable I/O port C bit 7 |
| Pin 38 | RD0 — Remappable I/O port D bit 0 |
| Pin 39 | RD1 — Remappable I/O port D bit 1 |
| Pin 40 | RD2 — Remappable I/O port D bit 2 |
| Pin 41 | RD3 — Remappable I/O port D bit 3 |
| Pin 42 | RD4 — Remappable I/O port D bit 4 |
| Pin 43 | RD5 — Remappable I/O port D bit 5 |
| Pin 44 | RD6 — Remappable I/O port D bit 6 |
Aplicaciones típicas
PIC32MX170F256D-I/TL es adecuado para 6 aplicacións: USB Audio Class (UAC) Speaker Dongle, USB HID Custom Input Device, USB CDC Virtual COM Port Bridge, Industrial USB Sensor Hub, Small TFT Graphical HMI Panel, USB-to-I2C/SPI Protocol Converter Dongle.
USB Audio Class (UAC) Speaker Dongle
The PIC32MX170F256D-I/TL fits USB audio dongles because its 40 MHz MIPS core plus 64 KB SRAM can sustain USB Full-Speed isochronous endpoints (1 MS/s at 16-bit/8 kHz mono) and run a software resampler. The on-chip USB 2.0 FS OTG transceiver removes external PHY cost, and 256 KB flash holds both the USB stack (8-12 KB) and a small I2S/PCM DAC driver. Pin compatibility with the 44-pin VTLA simplifies UL/cUL EMC certification and lets designers swap to PIC32MX270 for higher MIPS headroom.
Recomendado
USB HID Custom Input Device
For USB HID peripherals (custom keyboards, programmable macro pads, industrial keypads, sensor-input gaming devices), the PIC32MX170F256D-I/TL delivers 256 KB flash for HID descriptor tables plus macro logic, 64 KB RAM for debounce, and the integrated USB FS OTG with on-chip transceiver. Its 28 analog ADC channels can read potentiometer, joystick, or capacitive touch analog signals directly into HID reports. Compared to discrete MCU + external PHY designs, the integrated USB reduces BOM by 30-40% and PCB area by ~50%.
Recomendado
USB CDC Virtual COM Port Bridge
USB CDC virtual COM port designs use the PIC32MX170F256D-I/TL to replace legacy RS-232 ports with USB while exposing UART, SPI, or I2C peripherals to a PC. The 40 MHz core runs the CDC class driver and concurrent UART DMA transfers at 921 kbps without flow control, and 64 KB SRAM buffers multiple CDC endpoints. The integrated USB OTG and dual UART peripherals eliminate the external PHY and the second UART needed for boot-loader debug.
Recomendado
Industrial USB Sensor Hub
Industrial USB sensor hubs using the PIC32MX170F256D-I/TL aggregate multi-protocol sensors (I2C, SPI, UART) and stream them to a host PC over USB CDC or vendor-class bulk. The two I2C, two SPI, two UART peripherals interface to sensors simultaneously; the 5-channel DMA sustains data throughput without CPU intervention. The -40C to +85C industrial temperature grade suits factory floor deployment, and the wide 2.3V to 3.6V VDD supports 3.3V regulated supplies from industrial 24V-DC rails.
Recomendado
Small TFT Graphical HMI Panel
Small TFT graphical HMI panels use the PIC32MX170F256D-I/TL with the Parallel Master Port (PMP) to drive 8/16-bit parallel TFT displays with 8-bit address space, refreshed from a framebuffer in 64 KB SRAM. The PMP can sustain ~10 FPS on 320x240 TFTs for menu navigation. The two I2C and two SPI interfaces drive capacitive touch controllers, while the integrated USB serves firmware update and data logging. The pin-compatible PIC32MX270F256D provides more MIPS for smoother 20 FPS UI updates.
Recomendado
USB-to-I2C/SPI Protocol Converter Dongle
USB-to-I2C/SPI protocol converter dongles leverage the PIC32MX170F256D-I/TL USB and dual I2C + dual SPI peripherals to expose 4-wire SWD, I2C, and SPI buses to a PC host. The 40 MHz core handles USB vendor-class bulk transfers at 600 KB/s with low latency; 256 KB flash holds a flexible command parser. Compared to commercial bridges (FTDI, Cypress), the integrated USB removes external PHY, and the MIPS core runs custom protocol stacks in C or MPLAB Harmony.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX170F256D-I/TL — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX270F256D-I/TL | PIC32MX130F256D-I/TL | PIC32MX170F256DT-I/TL | PIC32MX150F128D-I/TL | PIC32MX170F256D-V/TL |
|---|---|---|---|---|---|---|
| Package | 44-pin VTLA (TL) 6x6 mm | 44-pin VTLA (TL) - same | 44-pin VTLA (TL) - same | 44-pin VTLA (TL) - same | 44-pin VTLA (TL) - same | 44-pin VTLA (TL) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max CPU Speed | 40 MHz / 50 MIPS | 50 MHz / 70 MIPS (+25%) | 40 MHz / 50 MIPS (same) | 40 MHz / 50 MIPS (same) | 40 MHz / 50 MIPS (same) | 40 MHz / 50 MIPS (same) |
| Flash Memory | 256 KB | 256 KB (same) | 256 KB (same) | 256 KB (same) | 128 KB (-50%) | 256 KB (same) |
| SRAM | 64 KB | 64 KB (same) | 64 KB (same) | 64 KB (same) | 64 KB (same) | 64 KB (same) |
| USB Controller | USB 2.0 FS OTG | USB 2.0 FS OTG (same) | No USB | USB 2.0 FS OTG (same) | USB 2.0 FS OTG (same) | USB 2.0 FS OTG (same) |
| Operating Temperature Grade | -I: -40C to +85C (industrial) | -I: -40C to +85C (same) | -I: -40C to +85C (same) | -I: -40C to +85C (same) | -I: -40C to +85C (same) | -V: -40C to +125C (AEC-Q100 automotive) |
| Approx. Unit Price @ 1k (USD) | $3.16 | $3.30 (slightly higher) | $2.80 (lower) | $3.16 (same) | $2.70 (lower) | $3.80 (automotive premium) |
Diferenciadores clave
- Faster core than USB 2.0 FS USB PIC32MX170 siblings while keeping same package (frente a PIC32MX170F256D-V/TL)
- Has USB 2.0 FS OTG controller, unlike pin-compatible PIC32MX130 (frente a PIC32MX130F256D-I/TL)
- Doubles the flash of PIC32MX150F128D (frente a PIC32MX150F128D-I/TL)
- Lower-cost than PIC32MX270F256D with same memory and peripherals (frente a PIC32MX270F256D-I/TL)
Notas de diseño
Place 10uF and 0.1uF ceramic decoupling capacitors on each VDD pin as close to the package as possible - the on-chip voltage regulator needs high-frequency decoupling at the die. The 44-pin VTLA has an exposed thermal pad on the underside that MUST be soldered to a 4 mm^2 minimum ground pad with 22 plated thermal vias (0.18 mm drill, 0.4 mm pitch) for proper thermal dissipation. Without the exposed pad soldered, junction temperature can exceed 125C at modest loads.
Route the USB DP and DM lines as a 90-ohm differential pair with no stubs, length-matched within 150 mil. Keep the pair adjacent to a continuous ground reference plane; do not route across plane splits. Place a 100 nF common-mode choke on each line if USB certification requires Class B conducted emissions. Maintain 90-ohm impedance over the full stub-less run from the package to the USB connector per UL/cUL EMC guidelines.
The Parallel Master Port (PMP) data lines PMD0-PMD15 are general-purpose CMOS outputs; avoid long parallel traces to TFT displays to prevent ringing. Use 22-33 ohm series resistors near the source for traces longer than 50 mm. Decouple the display's VDD with 10uF + 0.1uF caps adjacent to the display flex connector. Synchronize the PMP timing to display VSYNC via Output Compare to prevent visual tearing at frame boundaries.
Do not exceed the absolute maximum VDD of 4.0V; latch-up occurs above 4.0V and the part is not recoverable. Ensure VREF+ does not exceed VDD; tie VREF- to ground if the internal bandgap is used. The MCLR reset pin requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for noise immunity - omitting the cap makes the part susceptible to spurious resets on noisy 3.3V rails.
Estimated: at 40 MHz active, VDD 3.3V, all peripherals enabled, the part draws approximately 30-40 mA - about 0.1W power dissipation. With the exposed pad soldered to a 1 oz copper pour of 4 mm^2 (estimated theta_JA 35 C/W), the junction temperature rise above ambient is approximately 3.5 C - well within the 125 C junction limit. At industrial operating temperatures up to 85 C ambient, junction temperature remains within spec without external cooling.
Información de cumplimiento
RoHS compliant and lead-free matte tin per Microchip product page. Not AEC-Q100-qualified - choose PIC32MX170F256D-V/TL (AEC-Q100 grade) for automotive. Halogen-free per Microchip documentation.
