PIC32MX695F512L-80I/BG - 80MHz, 512KB Flash MCU | Microchip
N.º de pieza: PIC32MX695F512L-80I/BG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $17.78 | $1.778,00 |
| 250 | $16.31 | $4.077,50 |
| 500 | $14.85 | $7.425,00 |
PIC32MX695F512L-80I/BG Descripción general
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and programmable peripherals. Within the embedded hierarchy, the PIC32MX family sits in the high-performance 32-bit MCU tier, above 8/16-bit MCUs and below application processors. It targets connectivity-rich applications that demand deterministic real-time control plus wired networking, distinguishing it from simpler Cortex-M0/M0+ parts that lack integrated Ethernet and USB-OTG PHYs.
Key features include 5-stage pipelined Harvard architecture with MIPS16e code compression (up to 40% smaller code), four DMA channels dedicated to USB OTG and Ethernet acceleration, dual CAN 2.0b controllers, eight channels of 10-bit ADC at 1 Msps, five 16-bit timers/captures, and parallel master port for external bus expansion. The industrial -40C to +85C temperature range (designated by the 'I' suffix) supports harsh embedded deployments.
The PIC32MX5/6/7 family architecture pairs a MIPS32 M4K core with a dedicated DMA engine that offloads USB and Ethernet packet movement, freeing the CPU for application logic. The integrated USB-OTG PHY eliminates external PHY chips, reducing BOM cost and PCB area. The 121-ball TFBGA provides 85 digital I/O pins plus dedicated analog and communication channels.
Typical applications include industrial Ethernet gateways, building automation controllers, USB peripherals, CAN-based sensor networks, point-of-sale terminals, and networked embedded sensing. The combination of Ethernet, USB-OTG, and dual CAN makes it a single-chip solution for protocol-rich industrial nodes.
When designing with this device, allocate pins for Ethernet MII/RMII PHY interface (typically 10-17 pins), USB DP/DM with proper impedance-controlled routing, and provide bulk decoupling near each supply pin. The TFBGA package requires careful PCB layout with microvia or via-in-pad technology for reliable assembly.
This page synthesizes distributor pricing, drop-in alternatives from the same PIC32MX family, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para PIC32MX695F512L-80I/BG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MX695F512L-80I/BG (mismo factor de forma y huella) — difiere en USB, ADC, Package, DMA Channels, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MX695F512LT-80I/BG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX695F512L-80I/PT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MX675F512L-80I/BG
✅ Sustitución directa✓ En stock
$8.2 / unidad
Ver hoja de datos →PIC32MX795F512L-80I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$9.1 / unidad
Ver hoja de datos →PIC32MX575F512L-80I/BG
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.88 / unidad
Ver hoja de datos →PIC32MX695F512L-80I/BG Valores máximos y características eléctricas
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 80 MHz (105 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 128 KB |
| Operating Voltage Range | 2.3V to 3.6V |
| Encapsulado | 121-TFBGA (10x10 mm) |
| Number of I/O Pins | 85 |
| Ethernet MAC | 10/100 Mbps with MII/RMII |
| USB | USB 2.0 On-The-Go with integrated PHY |
| CAN | 2x CAN 2.0b controllers |
| DMA Channels | 8 dedicated (4 for USB/Ethernet) |
| ADC | 10-bit, 16 channels, 1 Msps |
| Timers | 5 x 16-bit timer/capture |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Tipo de montaje | Surface Mount (TFBGA) |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MX695F512L-80I/BG
| Pin A1 | VSS — Ground reference |
| Pin B11 | VDD — Core supply voltage |
| Pin D5 | OSC1 — Crystal oscillator input |
| Pin D6 | OSC2 — Crystal oscillator output |
| Pin E5 | MCLR — Master clear (active-low reset) |
| Pin F1 | VREF+ — ADC voltage reference positive |
| Pin F2 | VREF- — ADC voltage reference negative |
| Pin G5 | AVDD — Analog supply voltage |
Aplicaciones típicas
PIC32MX695F512L-80I/BG es adecuado para 6 aplicacións: Industrial Ethernet Gateway, Building Automation Controller, USB Peripheral Device, CAN-Based Sensor Network Node, Point-of-Sale Terminal, Networked Embedded Sensing Hub.
Industrial Ethernet Gateway
The PIC32MX695F512L-80I/BG fits industrial Ethernet gateways because its integrated 10/100 Ethernet MAC with MII/RMII supports external PHYs directly, while the 512 KB Flash accommodates TCP/IP stacks such as Microchip's MPLAB Harmony Net Services. The 128 KB SRAM buffers concurrent Ethernet packets alongside application logic. The 80 MHz core runs 105 DMIPS, sufficient for Modbus TCP, EtherNet/IP, or PROFINET gateway translation. Four dedicated DMA channels offload Ethernet packet movement, leaving the CPU free for industrial protocol processing.
Recomendado
Building Automation Controller
The PIC32MX695F512L-80I/BG serves building automation controllers by combining dual CAN 2.0b controllers for BACnet MS-TP or KNX sub-networks with USB OTG for local commissioning and firmware updates. The 85 digital I/O pins directly drive HVAC valves, relays, and sensor interfaces without external expanders. The -40C to +85C industrial temperature range handles unconditioned mechanical-room environments. The 512 KB Flash stores both application logic and bootloader for field upgrades via USB or CAN.
Recomendado
USB Peripheral Device
The PIC32MX695F512L-80I/BG enables USB peripherals such as data loggers, industrial instrumentation interfaces, or POS terminals because of its integrated USB 2.0 On-The-Go PHY with full-speed and low-speed support. The integrated PHY eliminates an external chip, reducing BOM cost and PCB area for compact USB dongles. The DMA engine manages USB packet transfer automatically, allowing the 80 MHz CPU to focus on data acquisition rather than bit-banging USB. The 128 KB SRAM holds USB endpoint buffers plus application scratch memory.
Recomendado
CAN-Based Sensor Network Node
The PIC32MX695F512L-80I/BG anchors CAN-based sensor networks in vehicles, factory cells, and distributed photovoltaic test by integrating two independent CAN 2.0b controllers with hardware acceptance filters. The 16-channel 10-bit ADC at 1 Msps simultaneously samples multiple sensor signals, while dual CAN buses isolate sensor traffic from command traffic. The 512 KB Flash stores CANopen or J1939 stack plus application logic. Industrial temperature grade supports under-hood automotive and factory deployments.
Recomendado
Point-of-Sale Terminal
The PIC32MX695F512L-80I/BG is suited to POS terminals where the integrated Ethernet MAC enables IP-based payment authorization while USB OTG drives external peripherals (magnetic-stripe readers, NFC modules, printers). The 80 MHz core handles TLS handshake and encrypted communication, and the 512 KB Flash holds secure payment libraries. The 128 KB SRAM buffers transaction data while peripherals exchange data via DMA offload. Industrial temperature grade supports retail environments with variable thermal conditions.
Recomendado
Networked Embedded Sensing Hub
The PIC32MX695F512L-80I/BG enables networked embedded sensing hubs where multiple analog and digital sensors feed data over Ethernet for cloud aggregation. The 16-channel 10-bit ADC captures analog sensors while 85 digital I/O read switches and encoders. The 512 KB Flash stores sensor processing algorithms and lightweight MQTT/HTTP stacks. The 80 MHz core fuses sensor data at sample rates above 1 kHz per channel. The -40C to +85C range supports outdoor and industrial cabinet deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MX695F512L-80I/BG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MX695F512LT-80I/BG | PIC32MX675F512L-80I/BG | PIC32MX795F512L-80I/BG |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| CPU Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum Clock Speed | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Ethernet MAC | 10/100 (MII/RMII) | 10/100 (MII/RMII) | Not present | 10/100 (MII/RMII) |
| USB OTG PHY | Integrated | Integrated | Integrated | Integrated |
| CAN Controllers | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Integrated 10/100 Ethernet MAC on-chip eliminates external controller (frente a PIC32MX675F512L-80I/BG)
- Integrated USB 2.0 OTG PHY eliminates external PHY chip (frente a PIC32MX575F512L-80I/BG)
- Same 121-TFBGA footprint across PIC32MX5/6/7 family for design reuse (frente a PIC32MX695F512L-80I/PT (100-TQFP))
Notas de diseño
The 121-ball TFBGA package uses a 0.8 mm ball pitch, which typically requires microvia (laser-drilled) technology or via-in-pad for reliable PCB assembly. Standard 0.3 mm mechanical drill vias are too large for the 0.8 mm pitch fan-out. Plan PCB stack-up with at least 4 layers: top signal + power, internal ground plane, internal power plane, bottom signal. Maintain 50-ohm controlled impedance on Ethernet MII/RMII traces and 90-ohm differential impedance on USB DP/DM traces.
Place decoupling capacitors (100 nF ceramic) within 2 mm of every VDD/AVDD ball. Add bulk capacitors (4.7 uF to 22 uF) near the IC supply balls to suppress transient current during DMA bursts. The MCU has separate AVDD and VDD rails; the ADC accuracy depends on clean AVDD - use a ferrite bead or filter to isolate analog supply from digital switching transients.
Route the 80 MHz CPU clock trace (OSC1/OSC2 or external clock input) with grounded guard traces on both sides and keep it away from analog signals. The Ethernet MII bus runs at 25 MHz (MII mode) or 50 MHz (RMII mode) - keep these traces short and impedance-controlled. The USB DP/DM traces must be 90-ohm differential with no stubs, and route them as a matched pair within 0.15 mm length difference.
Do not confuse the PIC32MX695F512L-80I/BG (121-TFBGA, Ethernet) with the PIC32MX675F512L-80I/BG (121-TFBGA, no Ethernet) or the PIC32MX695F512L-80I/PT (100-TQFP, different package). The PT and BG suffixes indicate different physical packages with different PCB footprints. The 'I' suffix means industrial temperature (-40C to +85C); 'V' would mean -40C to +105C extended. The '80' in '80I' denotes 80 MHz speed grade.
Información de cumplimiento
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications consider PIC32MX variants with explicit automotive qualification. Industrial temperature grade -40C to +85C designated by 'I' suffix.
