PIC32MZ2025DAS169T-I/6J - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip
N.º de pieza: PIC32MZ2025DAS169T-I/6J ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.89 | $7,89 |
| 10 | $7.42 | $74,20 |
| 100 | $6.85 | $685,00 |
| 500 | $6.31 | $3.155,00 |
| 1.000 | $5.74 | $5.740,00 |
PIC32MZ2025DAS169T-I/6J Descripción general
Background Knowledge - What is a 32-bit MCU with integrated graphics? A microcontroller (MCU) is a single-chip computer integrating a CPU core, memory and peripherals. A 32-bit MCU such as the PIC32MZ executes instructions on a 32-bit datapath, allowing MPU-like performance at MCU complexity. The PIC32MZ DA family further integrates a Graphics Processing Unit (GPU) and DDR2 memory controller, eliminating the need for an external MPU + LCD controller in graphical Human-Machine Interface (HMI) designs. The product hierarchy is: PIC32MZ DA -> PIC32 family -> 32-bit MCU -> microcontroller -> semiconductor.
Key Features - The PIC32MZ2025DAS169T-I/6J combines 200 MHz core throughput with 2MB Flash and 256KB SRAM, supplying ample headroom for full GUI stacks and connectivity protocols simultaneously. The 12-bit 18 MSPS ADC with up to 45 analog inputs enables high-speed sensor aggregation. High-speed USB, CAN, and 120 GPIO deliver multi-bus industrial connectivity in a single chip.
Technical Depth - The microAptiv core uses a 5-stage pipeline with DSP extensions; the integrated DDR2 controller supports up to 128MB external DRAM, effectively giving the MCU an MPU-class memory footprint for frame buffers. The 169-LFBGA package has a 0.80mm ball pitch (JESD-30 S-PBGA-B169).
Typical Applications - Industrial HMI panels, automotive dashboards, home appliance touch controllers, medical GUI displays, and connected point-of-sale terminals.
Design Consideration - Use the DDR2 controller carefully: PCB layout of 169-LFBGA requires 4-layer minimum stack-up and matched-length traces to preserve signal integrity. Always refer to the PIC32MZ DA family datasheet for DDR2 routing guidelines.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas directas para PIC32MZ2025DAS169T-I/6J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ2025DAS169T-I/6J (mismo factor de forma y huella) — difiere en Operating Temperature, Graphics Controller, ADC, Package, CAN.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ2025DAR169T-V/6J
✅ Sustitución directa✓ En stock
$12.1 / unidad
Ver hoja de datos →PIC32MZ2025DAH169T-I/6J
✅ Sustitución directa✓ En stock
$11.85 / unidad
Ver hoja de datos →PIC32MZ2025DAG169T-I/6J
✅ Sustitución directa✓ En stock
$11.85 / unidad
Ver hoja de datos →PIC32MZ2025DAB169T-I/HF
✅ Sustitución directa✓ En stock
$12.62 / unidad
Ver hoja de datos →PIC32MZ1025DAR169T-I/6J
✅ Sustitución directa✓ En stock
$11.88 / unidad
Ver hoja de datos →PIC32MZ1064DAB169T-I/HF
✅ Sustitución directa✓ En stock
$4.52 / unidad
Ver hoja de datos →PIC32MZ2025DAS169T-I/6J Valores máximos y características eléctricas
| Core | MIPS32 microAptiv |
| Ancho del bus de datos | 32 bit |
| Frecuencia de reloj máxima | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| Data RAM Size | 256 KB |
| External Memory Interface | DDR2 DRAM controller, up to 128 MB addressable |
| ADC Resolution | 12 bit |
| ADC Sampling Rate | 18 MSPS |
| Number of ADC Inputs | Up to 45 analog inputs |
| Number of I/O | 120 I/O |
| Tensión de alimentación de funcionamiento | 1.8 V |
| Temperatura de funcionamiento | -40C to +85C |
| Encapsulado / Carcasa | 169-LFBGA (11x11 mm, 0.80mm pitch) |
| Estilo de montaje | SMD/SMT |
| Connectivity | HS USB, CAN, I2C, SPI, UART |
| Graphics | Integrated Graphics Controller + GPU |
| Estado RoHS | Compliant |
Guía de configuración de pines de PIC32MZ2025DAS169T-I/6J 169-lfbga (11x11 mm, 0.80mm pitch)
Configuración de pines para PIC32MZ2025DAS169T-I/6J (encapsulado 169-lfbga (11x11 mm, 0.80mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para PIC32MZ2025DAS169T-I/6J.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
PIC32MZ2025DAS169T-I/6J es adecuado para 6 aplicacións: Industrial HMI Touch Panels, Automotive Dashboard Displays, Home Appliance Touch Controllers, Medical Infusion Pump GUI, Connected Point-of-Sale Terminals, Smart Building Access Panels.
Industrial HMI Touch Panels
The PIC32MZ2025DAS169T-I/6J fits industrial HMI panels because its integrated GPU and DDR2 controller (up to 128MB) eliminate the need for an external MPU + frame-buffer memory. The 12-bit 18 MSPS ADC with up to 45 inputs aggregates analog touch + sensor signals concurrently. At 200 MHz the microAptiv core drives full LVGL graphics stacks with headroom for Modbus/CAN communication. Use the 169-LFBGA with 4-layer PCB stack-up and matched-length DDR2 traces for reliable touchscreen rendering in factory environments.
Recomendado
Automotive Dashboard Displays
Automotive dashboards benefit from the PIC32MZ2025DAS169T-I/6J's 120 GPIO and HS USB / CAN connectivity, enabling gauge-cluster rendering and vehicle bus integration in one chip. The integrated GPU offloads LVGL rendering from the 200 MHz microAptiv core, leaving CPU headroom for CAN stack and OBD-II processing. Industrial -40C to +85C temperature rating covers most cabin environments; for under-hood use, choose the V-temp PIC32MZ2025DAH169T-I/6J. Matched-length DDR2 layout is critical for flicker-free dashboard graphics at automotive EMI levels.
Recomendado
Home Appliance Touch Controllers
Home appliances such as smart ovens and washing machines benefit from the PIC32MZ2025DAS169T-I/6J's integrated graphics and HS USB for firmware updates. The 256KB SRAM holds LVGL frame descriptors while DDR2 stores full-color icons; 12-bit 18 MSPS ADC reads temperature and humidity sensors directly. 120 GPIO drives relays, motors, and LEDs without external I/O expanders. Use the 169-LFBGA in a 4-layer PCB with proper ground pour to meet household EMI/ESD requirements per IEC 61000-4-2.
Recomendado
Medical Infusion Pump GUI
Medical infusion pumps benefit from the PIC32MZ2025DAS169T-I/6J's 200 MHz microAptiv core running safety-critical GUI stacks plus 12-bit 18 MSPS ADC for precise flow-rate measurement. The integrated GPU renders alarm and dosage graphics smoothly without burdening the CPU. CAN connectivity enables integration with hospital nurse-call systems. Industrial -40C to +85C temperature range supports clinical environments. DDR2 layout must follow medical EMI/EMC standards (IEC 60601-1) and use controlled-impedance routing.
Recomendado
Connected Point-of-Sale Terminals
Point-of-sale (POS) terminals use the PIC32MZ2025DAS169T-I/6J to drive color touchscreen UIs while concurrently running payment stacks over HS USB and inventory comms over CAN or UART. The 2MB Flash holds full GUI assets and crypto libraries; the integrated GPU accelerates QR/barcode rendering. 120 GPIO supports keypad, printer, and card-reader handshaking. The 169-LFBGA package enables slim terminal enclosures; route DDR2 with 4-layer controlled-impedance stack-up for EMC compliance.
Recomendado
Smart Building Access Panels
Smart-building access panels use the PIC32MZ2025DAS169T-I/6J to drive face/card UI screens while simultaneously controlling door strikes via GPIO and reading RFID/NFC over SPI. The 200 MHz microAptiv core plus integrated GPU renders UI animations smoothly; 12-bit ADC reads biometric sensors directly. CAN bus ties panels into the building automation network, and HS USB supports local firmware updates by maintenance staff. Industrial -40C to +85C temperature range handles lobby and outdoor-vestibule deployments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ2025DAS169T-I/6J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAH169T-I/6J | PIC32MZ2025DAG169T-I/6J | PIC32MZ1025DAR169T-I/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same | 169-LFBGA (11x11) - same |
| Core | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) |
| Integrated GPU | Yes | No (R variant) | Yes | Yes | No (R variant) |
| DDR2 Controller | Up to 128 MB | Up to 128 MB | Up to 128 MB | Up to 128 MB | Up to 128 MB |
| GPIO Count | 120 | 120 | 120 | 120 | 120 |
| Operating Temperature | -40C to +85C | -40C to +105C (V-temp) | -40C to +85C | -40C to +85C | -40C to +85C |
Diferenciadores clave
- Integrated GPU plus DDR2 controller in MCU form factor (frente a PIC32MX795F512L-80I/PT)
- 2MB Flash and 12-bit 18 MSPS ADC (frente a PIC32MZ1025DAR169T-I/6J)
- Industrial -40C to +85C temperature range (frente a PIC32MZ2025DAR169T-V/6J (V-temp -40C to +105C))
Notas de diseño
Estimated: the 169-LFBGA package with 0.80mm ball pitch requires at least a 4-layer PCB stack-up with microvia or via-in-pad construction to fan out signals. Matched-length DDR2 traces (within 50 mil tolerance) are mandatory for reliable operation at 200 MHz. Place decoupling capacitors directly under the BGA on the opposite side of the PCB using 0201 or 0402 footprints; a minimum of 10x 100nF plus 4x 4.7uF bulk caps is recommended.
Estimated: at 200 MHz with DDR2 active and GPU under load, the PIC32MZ2025DAS169T-I/6J can dissipate 0.8-1.2W. The LFBGA package has a theta_JA of approximately 25 C/W on a standard 4-layer JEDEC test board. With 1W dissipation, junction temperature rises 25C above ambient. For sealed enclosures with no airflow, derate clock speed or use thermal vias under the exposed die pad to keep Tj below 125C.
Do not skip the DDR2 reference voltage (VREF) and termination resistor networks - they are required for DDR2 signal integrity at 200 MHz. Always configure the FPLL (system PLL) using the manufacturer-supplied Harmony configuration; incorrect PLL settings are the most common cause of MCU boot failures. Verify the boot configuration fuses match the application's startup vector (e.g., boot from Flash vs boot from external DDR2).
Estimated: the PIC32MZ2025DAS169T-I/6J requires a clean 1.8V core supply plus 3.3V I/O. Use a low-dropout regulator with at least 300 mA headroom for the MCU core plus DDR2. Sequence the supplies so that 1.8V comes up before 3.3V to avoid I/O latch-up. Add a 10uF bulk + 100nF decoupling cap within 5 mm of each VDDCORE pin.
Información de cumplimiento
RoHS and REACH compliance per Microchip product page; industrial -40C to +85C temperature grade; AEC-Q100 not qualified - choose V-temp or automotive-grade variant for automotive.
