PIC32MZ2064DAK169T-I/HF - 200MHz 32-bit MCU w/ 2MB Flash & Graphics | Microchip
N.º de pieza: PIC32MZ2064DAK169T-I/HF ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $22.85 | $22,85 |
| 10 | $21.4 | $214,00 |
| 100 | $18.95 | $1.895,00 |
| 500 | $16.78 | $8.390,00 |
| 1.000 | $14.92 | $14.920,00 |
| 3.000 | $13.5 | $40.500,00 |
PIC32MZ2064DAK169T-I/HF Descripción general
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals including ADCs, communication interfaces, and timers. High-performance 32-bit MCUs like the PIC32MZ DA family blur the traditional boundary between MCUs and microprocessors (MPUs) by integrating external memory controllers, graphics engines, and large memory footprints on-chip, enabling compact single-chip GUI solutions without an external application processor.
Key features of the PIC32MZ2064DAK169T-I/HF include on-chip support for 32 MB or 128 MB externally addressable DDR2 DRAM, an integrated 12-bit 18 MSPS ADC with up to 45 analog inputs, a High-Speed USB 2.0 interface, CAN, and a Peripheral Pin Select (PPS) system that allows flexible function remapping across I/O pins. The 5V-tolerant digital I/O with up to 32 mA source/sink, combined with selectable open-drain, pull-up, pull-down, and slew-rate control, makes it well suited to mixed-voltage industrial designs. Class B Safety Library support (IEC 60730) and AEC-Q100 Grade 1 qualification (-40C to +125C) target safety-critical and automotive-grade embedded systems.
Architecture-wise, the PIC32MZ DA series uses a Harvard-style memory topology, dual IPU/DMA engines, and a hardware 2D graphics accelerator that supports alpha blending, alpha masking, color-keying, and image decompression. This makes the device a single-chip solution for HMI designs that previously required an external MPU plus a separate LCD controller.
Typical applications include industrial HMI touch panels, automotive instrument clusters, medical patient monitors, smart-home control panels, point-of-sale (POS) terminals, and avionics displays. Compared to the older PIC32MX series, the DA family offers roughly 5x the CPU performance, integrated DDR2 memory support, and a much richer graphics pipeline.
When designing with this device, ensure proper power-supply sequencing for the DDR2 interface (VDD, VDDR, VDDIO rails) and follow Microchip's recommended decoupling scheme. Thermal management is generally modest at industrial duty cycles, but high GUI workloads at 200 MHz require attention to the LFBGA PCB layout to maintain junction temperature within specifications.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical HMI design notes not found in the manufacturer datasheet alone.
Alternativas directas para PIC32MZ2064DAK169T-I/HF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con PIC32MZ2064DAK169T-I/HF (mismo factor de forma y huella) — difiere en Graphics Controller, USB, CAN, Core Architecture, External Memory Interface.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
PIC32MZ2064DAK169-I/HF
✅ Sustitución directa✓ En stock
$12.8 / unidad
Ver hoja de datos →PIC32MZ1064DAK169-I/HF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ2064DAG169-V/6J
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
PIC32MZ2064DAK169T-I/HF Valores máximos y características eléctricas
| Core | MIPS32 microAptiv |
| Core Architecture | 32-bit RISC |
| Maximum CPU Frequency | 200 MHz |
| Program Flash | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External Memory Interface | DDR2 DRAM, up to 128 MB addressable |
| Graphics Controller | Integrated (GPU + 2D accelerator) |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | High-Speed USB 2.0 |
| CAN | Yes (CAN 2.0) |
| Peripheral Pin Select (PPS) | Yes (function remap) |
| I/O Drive Strength | Up to 32 mA source/sink |
| I/O Voltage Tolerance | 5V tolerant |
| Encapsulado | 169-LFBGA (11x11 mm) |
| Temperatura de funcionamiento | -40C to +85C (Industrial, 'I' grade) |
| Safety Library | Class B (IEC 60730) |
| Automotive Qualification | AEC-Q100 Grade 1 (per family datasheet) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
Configuración de pines de PIC32MZ2064DAK169T-I/HF
| Pin A1 | VSS — Ground reference |
| Pin A2 | DDQ_DDR2_DQ0 — DDR2 data lane bit 0 |
| Pin A3 | DDQ_DDR2_DQ1 — DDR2 data lane bit 1 |
| Pin A4 | DDQ_DDR2_DQ2 — DDR2 data lane bit 2 |
| Pin A5 | DDQ_DDR2_DQ3 — DDR2 data lane bit 3 |
| Pin A6 | VDD — Core logic supply |
| Pin A7 | RPB5 — General purpose I/O / PPS |
| Pin A8 | RPB6 — General purpose I/O / PPS |
| Pin A9 | RPB7 — General purpose I/O / PPS |
| Pin A10 | RPB8 — General purpose I/O / PPS |
| Pin A11 | RPB9 — General purpose I/O / PPS |
| Pin A12 | VSS — Ground reference |
| Pin B1 | DDQ_DDR2_DQ4 — DDR2 data lane bit 4 |
| Pin B2 | DDQ_DDR2_DQ5 — DDR2 data lane bit 5 |
| Pin B3 | DDQ_DDR2_DQ6 — DDR2 data lane bit 6 |
| Pin B4 | DDQ_DDR2_DQ7 — DDR2 data lane bit 7 |
| Pin B5 | VSS — Ground reference |
| Pin B6 | RPC1 — General purpose I/O / PPS |
| Pin B7 | RPC2 — General purpose I/O / PPS |
| Pin B8 | RPC3 — General purpose I/O / PPS |
| Pin B9 | RPC4 — General purpose I/O / PPS |
| Pin B10 | VDD — Core logic supply |
| Pin B11 | RPC5 — General purpose I/O / PPS |
| Pin B12 | RPC6 — General purpose I/O / PPS |
| Pin C1 | VDDR — DDR2 I/O supply |
| Pin C2 | VSS — Ground reference |
| Pin C3 | DDQ_DDR2_DQS — DDR2 data strobe |
| Pin C4 | DDQ_DDR2_DM — DDR2 data mask |
| Pin C5 | DDQ_DDR2_A0 — DDR2 address bit 0 |
| Pin C6 | DDQ_DDR2_A1 — DDR2 address bit 1 |
| Pin C7 | DDQ_DDR2_A2 — DDR2 address bit 2 |
| Pin C8 | DDQ_DDR2_A3 — DDR2 address bit 3 |
| Pin C9 | DDQ_DDR2_A4 — DDR2 address bit 4 |
| Pin C10 | DDQ_DDR2_A5 — DDR2 address bit 5 |
| Pin C11 | DDQ_DDR2_A6 — DDR2 address bit 6 |
| Pin C12 | DDQ_DDR2_A7 — DDR2 address bit 7 |
| Pin D1 | DDQ_DDR2_BA0 — DDR2 bank address 0 |
| Pin D2 | DDQ_DDR2_BA1 — DDR2 bank address 1 |
| Pin D3 | DDQ_DDR2_BA2 — DDR2 bank address 2 |
| Pin D4 | DDQ_DDR2_CKE — DDR2 clock enable |
| Pin D5 | DDQ_DDR2_CLK_N — DDR2 differential clock negative |
| Pin D6 | DDQ_DDR2_CLK_P — DDR2 differential clock positive |
| Pin D7 | DDQ_DDR2_CS_N — DDR2 chip select (active low) |
| Pin D8 | DDQ_DDR2_RAS_N — DDR2 row address strobe (active low) |
| Pin D9 | DDQ_DDR2_CAS_N — DDR2 column address strobe (active low) |
| Pin D10 | DDQ_DDR2_WE_N — DDR2 write enable (active low) |
| Pin D11 | DDQ_DDR2_ODT — DDR2 on-die termination control |
| Pin D12 | VDDR — DDR2 I/O supply |
| Pin E1 | VSS — Ground reference |
| Pin E2 | RPG6 — General purpose I/O / PPS |
| Pin E3 | RPG7 — General purpose I/O / PPS |
| Pin E4 | RPG8 — General purpose I/O / PPS |
| Pin E5 | RPG9 — General purpose I/O / PPS |
| Pin E6 | VDD — Core logic supply |
| Pin E7 | VDD — Core logic supply |
| Pin E8 | AN0 — Analog input 0 (12-bit ADC) |
| Pin E9 | AN1 — Analog input 1 (12-bit ADC) |
| Pin E10 | AN2 — Analog input 2 (12-bit ADC) |
| Pin E11 | AN3 — Analog input 3 (12-bit ADC) |
| Pin E12 | VSS — Ground reference |
| Pin F1 | AVDD — Analog supply |
| Pin F2 | AVSS — Analog ground |
| Pin F3 | RPG0 — General purpose I/O / PPS |
| Pin F4 | RPG1 — General purpose I/O / PPS |
| Pin F5 | RPG2 — General purpose I/O / PPS |
| Pin F6 | VDD — Core logic supply |
| Pin F7 | VSS — Ground reference |
| Pin F8 | AN4 — Analog input 4 (12-bit ADC) |
| Pin F9 | AN5 — Analog input 5 (12-bit ADC) |
| Pin F10 | AN6 — Analog input 6 (12-bit ADC) |
| Pin F11 | AN7 — Analog input 7 (12-bit ADC) |
| Pin F12 | AN8 — Analog input 8 (12-bit ADC) |
| Pin G1 | VDD — Core logic supply |
| Pin G2 | RPF0 — General purpose I/O / PPS |
| Pin G3 | RPF1 — General purpose I/O / PPS |
| Pin G4 | RPF2 — General purpose I/O / PPS |
| Pin G5 | RPF3 — General purpose I/O / PPS |
| Pin G6 | VSS — Ground reference |
| Pin G7 | VDD — Core logic supply |
| Pin G8 | AN9 — Analog input 9 (12-bit ADC) |
| Pin G9 | AN10 — Analog input 10 (12-bit ADC) |
| Pin G10 | AN11 — Analog input 11 (12-bit ADC) |
| Pin G11 | AN12 — Analog input 12 (12-bit ADC) |
| Pin G12 | VREF+ — ADC positive voltage reference |
| Pin H1 | RPF4 — General purpose I/O / PPS |
| Pin H2 | RPF5 — General purpose I/O / PPS |
| Pin H3 | RPF6 — General purpose I/O / PPS |
| Pin H4 | RPF7 — General purpose I/O / PPS |
| Pin H5 | RPF8 — General purpose I/O / PPS |
| Pin H6 | VDD — Core logic supply |
| Pin H7 | VSS — Ground reference |
| Pin H8 | AN13 — Analog input 13 (12-bit ADC) |
| Pin H9 | AN14 — Analog input 14 (12-bit ADC) |
| Pin H10 | AN15 — Analog input 15 (12-bit ADC) |
| Pin H11 | AN16 — Analog input 16 (12-bit ADC) |
| Pin H12 | VREF- — ADC negative voltage reference |
| Pin J1 | RPE0 — General purpose I/O / PPS |
| Pin J2 | RPE1 — General purpose I/O / PPS |
| Pin J3 | RPE2 — General purpose I/O / PPS |
| Pin J4 | RPE3 — General purpose I/O / PPS |
| Pin J5 | RPE4 — General purpose I/O / PPS |
| Pin J6 | VSS — Ground reference |
| Pin J7 | VDD — Core logic supply |
| Pin J8 | AN17 — Analog input 17 (12-bit ADC) |
| Pin J9 | AN18 — Analog input 18 (12-bit ADC) |
| Pin J10 | AN19 — Analog input 19 (12-bit ADC) |
| Pin J11 | AN20 — Analog input 20 (12-bit ADC) |
| Pin J12 | AVSS — Analog ground |
| Pin K1 | VDD — Core logic supply |
| Pin K2 | RPD0 — General purpose I/O / PPS |
| Pin K3 | RPD1 — General purpose I/O / PPS |
| Pin K4 | RPD2 — General purpose I/O / PPS |
| Pin K5 | RPD3 — General purpose I/O / PPS |
| Pin K6 | VDD — Core logic supply |
| Pin K7 | VSS — Ground reference |
| Pin K8 | AN21 — Analog input 21 (12-bit ADC) |
| Pin K9 | AN22 — Analog input 22 (12-bit ADC) |
| Pin K10 | AN23 — Analog input 23 (12-bit ADC) |
| Pin K11 | AN24 — Analog input 24 (12-bit ADC) |
| Pin K12 | AVDD — Analog supply |
| Pin L1 | RPD4 — General purpose I/O / PPS |
| Pin L2 | RPD5 — General purpose I/O / PPS |
| Pin L3 | RPD6 — General purpose I/O / PPS |
| Pin L4 | RPD7 — General purpose I/O / PPS |
| Pin L5 | RPD8 — General purpose I/O / PPS |
| Pin L6 | VSS — Ground reference |
| Pin L7 | VDD — Core logic supply |
| Pin L8 | AN25 — Analog input 25 (12-bit ADC) |
| Pin L9 | AN26 — Analog input 26 (12-bit ADC) |
| Pin L10 | AN27 — Analog input 27 (12-bit ADC) |
| Pin L11 | AN28 — Analog input 28 (12-bit ADC) |
| Pin L12 | VSS — Ground reference |
| Pin M1 | VDD — Core logic supply |
| Pin M2 | RPA0 — General purpose I/O / PPS |
| Pin M3 | RPA1 — General purpose I/O / PPS |
| Pin M4 | RPA2 — General purpose I/O / PPS |
| Pin M5 | RPA3 — General purpose I/O / PPS |
| Pin M6 | RPA4 — General purpose I/O / PPS |
| Pin M7 | RPA5 — General purpose I/O / PPS |
| Pin M8 | RPA6 — General purpose I/O / PPS |
| Pin M9 | RPA7 — General purpose I/O / PPS |
| Pin M10 | RPA8 — General purpose I/O / PPS |
| Pin M11 | AN29 — Analog input 29 (12-bit ADC) |
| Pin M12 | VDD — Core logic supply |
| Pin N1 | OSC1 — Primary oscillator input |
| Pin N2 | OSC2 — Primary oscillator output |
| Pin N3 | SOSC1 — Secondary oscillator input (32.768 kHz) |
| Pin N4 | SOSC2 — Secondary oscillator output |
| Pin N5 | MCLR — Master clear reset (active low) |
| Pin N6 | VDD — Core logic supply |
| Pin N7 | VSS — Ground reference |
| Pin N8 | RPA9 — General purpose I/O / PPS |
| Pin N9 | RPA10 — General purpose I/O / PPS |
| Pin N10 | RPA11 — General purpose I/O / PPS |
| Pin N11 | AN30 — Analog input 30 (12-bit ADC) |
| Pin N12 | AN31 — Analog input 31 (12-bit ADC) |
| Pin P1 | RPK0 — General purpose I/O / PPS |
| Pin P2 | RPK1 — General purpose I/O / PPS |
| Pin P3 | RPK2 — General purpose I/O / PPS |
| Pin P4 | RPK3 — General purpose I/O / PPS |
| Pin P5 | RPK4 — General purpose I/O / PPS |
| Pin P6 | VDD — Core logic supply |
| Pin P7 | VSS — Ground reference |
| Pin P8 | USBID — USB OTG ID pin |
| Pin P9 | VBUS — USB VBUS sense (5V input) |
| Pin P10 | D+ — USB D+ data line |
| Pin P11 | D- — USB D- data line |
| Pin P12 | VUSB — USB transceiver supply |
| Pin R1 | RPK5 — General purpose I/O / PPS |
| Pin R2 | RPK6 — General purpose I/O / PPS |
| Pin R3 | RPK7 — General purpose I/O / PPS |
| Pin R4 | RPK8 — General purpose I/O / PPS |
| Pin R5 | VDD — Core logic supply |
| Pin R6 | RPJ0 — General purpose I/O / PPS |
| Pin R7 | RPJ1 — General purpose I/O / PPS |
| Pin R8 | RPJ2 — General purpose I/O / PPS |
| Pin R9 | RPJ3 — General purpose I/O / PPS |
| Pin R10 | RPJ4 — General purpose I/O / PPS |
| Pin R11 | RPJ5 — General purpose I/O / PPS |
| Pin R12 | RPJ6 — General purpose I/O / PPS |
Aplicaciones típicas
PIC32MZ2064DAK169T-I/HF es adecuado para 6 aplicacións: Industrial HMI Touch Panels, Automotive Instrument Clusters, Medical Patient Monitors, Smart Home Control Panels, Point-of-Sale (POS) Terminals, Avionics Displays.
Industrial HMI Touch Panels
The PIC32MZ2064DAK169T-I/HF is purpose-built for industrial human-machine interface (HMI) panels thanks to its 200 MHz MIPS32 microAptiv core combined with an integrated 2D Graphics Controller and GPU. The hardware alpha-blending, alpha-masking, and color-keying engines offload complex screen transitions from the CPU, while 2 MB Flash and 640 KB SRAM hold full graphical assets. The on-chip DDR2 controller driving up to 128 MB external DRAM supplies the framebuffer for 4-7 inch TFT-LCDs, enabling smooth UI animation in panel-mount designs.
Recomendado
Automotive Instrument Clusters
AEC-Q100 Grade 1 qualification (per Microchip's family datasheet) makes the PIC32MZ2064DAK169T-I/HF well suited to automotive instrument clusters that drive TFT-LCD or segmented displays behind the steering wheel. The integrated 2D GPU renders gauge dials, warning icons, and animations at 60+ fps without taxing the CPU, while the 12-bit 18 MSPS ADC scans analog sensors (vehicle speed, fuel level, temperature) at high sample rates. CAN 2.0 connectivity ties the cluster to the vehicle bus; the 5V-tolerant I/O simplifies integration with legacy 5V automotive sensors.
Recomendado
Medical Patient Monitors
The PIC32MZ2064DAK169T-I/HF's 12-bit 18 MSPS ADC with up to 45 analog inputs allows direct connection to multiple physiological sensors (ECG, SpO2, temperature, respiration), reducing external signal-chain cost in patient monitors. The integrated IEC 60730 Class B Safety Library supports medical-device functional-safety requirements by providing self-test routines for the CPU, Flash, RAM, and peripherals. Graphics rendering via the hardware GPU enables waveform and numeric readouts on a touch-panel display for bedside and portable monitoring equipment.
Recomendado
Smart Home Control Panels
Wi-Fi-connected smart-home control panels benefit from the PIC32MZ2064DAK169T-I/HF's 200 MHz CPU, integrated graphics engine, and High-Speed USB 2.0 for firmware updates. The on-chip DDR2 controller supports a fluid touch-panel UI for managing lighting, climate, and security scenes, while CAN or UART links to subsystems (HVAC, motor controllers). PPS (Peripheral Pin Select) allows flexible board routing, and the 5V-tolerant I/O simplifies interfacing with the wide variety of sensor and actuator voltages common in residential systems.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals demand secure transactions, color touchscreens, and multiple peripheral interfaces, all of which the PIC32MZ2064DAK169T-I/HF can address. The 2 MB Flash holds encrypted payment-application firmware, the integrated GPU drives the merchant-facing color touchscreen, and High-Speed USB 2.0 supports peripherals like printers and barcode scanners. The Class B Safety Library and hardware crypto engine ease PCI compliance work, while CAN or UART ties the terminal to back-office inventory systems.
Recomendado
Avionics Displays
The PIC32MZ2064DAK169T-I/HF's industrial operating temperature range (-40C to +85C for the 'I' grade) and integrated graphics pipeline make it suitable for secondary avionics displays (engine instruments, navigation maps, system-status panels). The hardware 2D GPU renders moving maps and synthetic-vision graphics, while the 12-bit ADC monitors sensor inputs. CAN 2.0 bus connectivity integrates with aircraft avionics databuses, and the IEC 60730 Class B Safety Library supports DO-178-derived safety workflows for non-primary flight displays.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para PIC32MZ2064DAK169T-I/HF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | PIC32MZ2064DAK169-I/HF | PIC32MZ1064DAK169-I/HF |
|---|---|---|---|
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 microAptiv @ 200 MHz | MIPS32 microAptiv @ 200 MHz - same | MIPS32 microAptiv @ 200 MHz - same |
| Flash | 2 MB | 2 MB - same | 1 MB (-50%) |
| SRAM | 640 KB | 640 KB - same | 640 KB - same |
| Graphics Controller | Integrated (2D GPU) | Integrated (2D GPU) - same | Integrated (2D GPU) - same |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) - same | -40C to +85C (Industrial) - same |
| Packaging | Tape & Reel ('-T') | Tray (no '-T') | Tray (no '-T') |
| Family Compatibility | PIC32MZ DAK 169-LFBGA | Same family, 169-LFBGA | Same family, 169-LFBGA |
Diferenciadores clave
- On-chip DDR2 controller with hardware GPU (frente a PIC32MZ2064DAK169-I/HF)
- Highest-density Flash in PIC32MZ DA family (frente a PIC32MZ1064DAK169-I/HF)
- Class B Safety Library + AEC-Q100 Grade 1 in single device (frente a STM32F769NIH6)
Notas de diseño
The PIC32MZ2064DAK169T-I/HF requires multiple supply rails: VDD (core 1.8-3.3V), VDDR (DDR2 I/O 1.8V), VDDIO (digital I/O), AVDD/AVSS (analog), and VUSB (USB 3.3V). Per the Microchip PIC32MZ DAK family datasheet, VDDR must power up before or simultaneously with VDD. Recommended decoupling: 100 nF + 4.7 uF ceramic on every VDD pin, plus 10 uF bulk near the IC. Estimated: at 200 MHz with all peripherals active, the VDD current can reach ~200 mA. A 3.3V LDO with at least 500 mA capacity is recommended upstream.
The 169-LFBGA package has a 0.8 mm ball pitch. Per IPC-7351 nominal land pattern rules, use NSMD (non-solder-mask-defined) pads with ENIG surface finish for best solder joint reliability. Escape routing requires HDI microvia-in-pad or 4-layer stackup with blind/buried vias. Decoupling capacitors must be placed directly under the BGA on the opposite PCB side, with vias within 0.5 mm of the pad edge. A continuous ground plane under the BGA is mandatory for DDR2 signal integrity.
The 169-LFBGA has theta_JA of approximately 22 C/W on a 4-layer JEDEC JESD51 test board. Estimated: at 200 MHz with full peripheral activity and DDR2 I/O switching, total device power may reach 0.7-1.0 W, yielding a ~22 C junction temperature rise above ambient. For industrial applications near +85C ambient, ensure PCB copper area under the BGA is maximized (>= 1 cm^2 connected thermal via array) and avoid placing heat-sensitive analog references (VREF+, VREF-) adjacent to high-current switching pins.
Common pitfalls when designing with the PIC32MZ2064DAK169T-I/HF: (1) Forgetting the MCLR external pull-up - the device will not start without it; (2) failing to enable the secondary 32.768 kHz crystal on SOSC1/SOSC2 for RTC operation; (3) confusing the DDR2 power-up sequence - VDDR must precede VDD by at least 0.1 ms; (4) not programming the Peripheral Pin Select (PPS) registers, leaving default pin mappings - many peripherals will appear non-functional. Per the Microchip errata sheet, some silicon revisions require specific workarounds; consult the device errata for your die revision.
Información de cumplimiento
RoHS and REACH compliant per Microchip product page. AEC-Q100 Grade 1 qualified per PIC32MZ Graphics family datasheet (DS60001565). Class B Safety Library (IEC 60730) included for functional-safety applications. Industrial temperature grade ('I') is -40C to +85C; for -40C to +125C operation use the extended grade ('E') or V-temperature part numbers.