TMS32C6416EZLZA6E3 - 600MHz Fixed-Point DSP 532-FCBGA | TI
N.º de pieza: TMS32C6416EZLZA6E3 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $152.75 | $15.275,00 |
| 250 | $142 | $35.500,00 |
| 500 | $131.5 | $65.750,00 |
TMS32C6416EZLZA6E3 Descripción general
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is optimized for the mathematical operations common in signal processing - multiply-accumulate (MAC), FIR/IIR filtering, FFT, and convolution. Compared with general-purpose microcontrollers, DSPs feature wider datapaths, hardware MAC units, deterministic instruction cycles, and specialized memory architectures that sustain high data throughput. The C64x family specifically uses a VelociTI.2 Very Long Instruction Word (VLIW) architecture capable of issuing eight 32-bit instructions per clock cycle, making the C64x part of a hierarchy that runs: DSP -> VLIW DSP -> C6000 series -> C64x family -> TI digital signal processors.
Key features include a VelociTI.2 VLIW core with eight functional units, dual 64-bit data paths per CPU on the C64x, integrated L1/L2 memory controller, a 32-bit EMIF for external SDRAM/SRAM, three multi-channel buffered serial ports (McBSPs), a 33-bit PCI interface, and dedicated VCP/TCP co-processors that accelerate 3G wireless channel decoding. According to TI product documentation, the ZLZ variant combines the C64x DSP core with on-chip L2 SRAM and a flexible set of peripherals.
Typical applications include software-defined radio (SDR), 3G/4G baseband channel cards, real-time video transcoding, high-density voice/fax channel banks, professional audio processing, medical imaging front-ends, and military/aerospace signal intelligence. The PCI interface allows direct plug-in deployment on CompactPCI/cPCI carrier boards, while the EMIF and HPI support host-processor coupling.
When designing with this device, allocate PCB area for the 532-ball FCBGA (1.0 mm pitch), provide at least four PCB layers with a continuous ground plane for thermal spreading, and follow TI's SPRA433 / SPRU401 guidance for JTAG, clock, and EMIF signal integrity. For new designs, consider the TMS320C6416T family which offers higher clock rates and is the recommended successor.
Alternativas directas para TMS32C6416EZLZA6E3 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
TMS320C6416TBCLZA6
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
TMS320C6416TBCLZA7
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TMS32C6416EGLZA6E3
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TMS32C6414EGLZA5E0
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TMS320C6415TBCLZA6
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TMS32C6416EZLZA6E3 Especificaciones
| Core Architecture | C64x fixed-point DSP (VelociTI.2 VLIW) |
| Frecuencia de reloj máxima | 600 MHz |
| Peak Performance | 4800 MIPS |
| Data Path Width | 32-bit fixed-point (dual 64-bit datapaths per CPU on C64x) |
| External Memory Interface (EMIF) | 32-bit EMIF, SDRAM/SRAM compatible |
| Serial Ports | 3x McBSP (Multi-channel Buffered Serial Port) |
| PCI Interface | 33 MHz, 32-bit PCI |
| Co-processors | VCP (Viterbi) + TCP (Turbo) |
| Host Port Interface | HPI (16/32-bit host port) |
| Operating Voltage (Core) | 1.2 V (typical) |
| Operating Voltage (I/O) | 3.3 V |
| Encapsulado | 532-ball FCBGA (ZLZ), 23x23 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +105C (extended industrial) |
| Estado RoHS | Compliant |
| Lead-Free / Halogen-Free | Lead-free (per TI product page) |
| Series | TMS320C6416 (C64x family) |
Guía de configuración de pines de TMS32C6416EZLZA6E3 532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch
Configuración de pines para TMS32C6416EZLZA6E3 (encapsulado 532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para TMS32C6416EZLZA6E3.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
TMS32C6416EZLZA6E3 es adecuado para 6 aplicacións: Software Defined Radio (SDR) Baseband, 3G/4G Channel Decoding Card, Real-Time Video Transcoding, Medical Imaging Front-End, Professional Audio Processing, Military / SIGINT Signal Processing.
Software Defined Radio (SDR) Baseband
The TMS32C6416EZLZA6E3's 4800 MIPS at 600 MHz give it the headroom to run multi-carrier OFDM demodulation, channel estimation, and synchronization in a wideband SDR baseband card. Its on-chip VCP/TCP accelerators offload the turbo and Viterbi decoding that 3G/4G waveforms require, freeing CPU cycles for the FFT/iFFT-heavy physical layer. Designers place the ZLZ package on a cPCI carrier so the PCI interface can stream baseband I/Q into host memory at line rate.
Recomendado
3G/4G Channel Decoding Card
Channel decoding on UMTS, HSPA, and LTE base stations is dominated by turbo and convolutional codes that map directly onto the TMS32C6416EZLZA6E3's VCP and TCP co-processors. The C64x core handles the surrounding rate-matching, CRC, and HARQ protocol work while the accelerators sustain real-time peak throughput. Combined with three McBSP links and the PCI host interface, a single DSP can serve multiple users per board slot.
Recomendado
Real-Time Video Transcoding
Video transcoding engines benefit from the C64x SIMD-style packed-data instructions and the determinism of a VLIW pipeline. The 4800 MIPS figure sustains multiple SD-to-HD or HD-to-mobile transcode tasks in parallel, with the 32-bit EMIF providing the bandwidth to external DDR buffers used as frame stores. The 1.0 mm-pitch FCBGA package allows a compact mezzanine footprint that drops into existing transcoder cards.
Recomendado
Medical Imaging Front-End
Ultrasound, CT, and MRI front-ends stream raw RF/k-space data through a real-time beamformer or back-projection kernel - exactly the workloads that benefit from the TMS32C6416EZLZA6E3's wide data paths and deterministic instruction timing. A cPCI form factor using the on-chip PCI is a common deployment pattern in cart-based imaging systems, and the extended -40C to +105C temperature range supports the warm enclosure environment of imaging racks.
Recomendado
Professional Audio Processing
Studio-grade effects processors and high-channel-count mixing consoles lean on a DSP to run convolution reverbs, dynamics, and matrix mixing at sample rates up to 192 kHz. The TMS32C6416EZLZA6E3's three McBSP ports accept multiple AES/EBU or I2S audio streams, while the EMIF buffers audio frames in external SDRAM. Compared with a generic microcontroller, the C64x's eight-issue VLIW pipeline runs large FIR kernels with far lower latency.
Recomendado
Military / SIGINT Signal Processing
Electronic warfare and signal-intelligence platforms demand deterministic execution and high throughput to demodulate, classify, and geolocate emitters in dense RF environments. The TMS32C6416EZLZA6E3's extended -40C to +105C temperature grade and the rugged FCBGA package support deployed SIGINT payloads. PCI plug-in cards based on the C6416 family have been a long-standing building block of cPCI-based EW chassis.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para TMS32C6416EZLZA6E3 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | TMS320C6416TBCLZA6 | TMS320C6416TBCLZA7 | TMS32C6416EGLZA6E3 | TMS32C6414EGLZA5E0 | TMS320C6415TBCLZA6 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 532-ball FCBGA (ZLZ), 23x23 mm | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same |
| Core | C64x fixed-point | C6416T fixed-point | C6416T fixed-point | C64x fixed-point | C6414 fixed-point | C6415T fixed-point |
| Maximum Clock | 600 MHz | 720 MHz | 1 GHz | 600 MHz | 500 MHz | 720 MHz |
| Peak MIPS | 4800 MIPS | 5760 MIPS | 8000 MIPS | 4800 MIPS | 4000 MIPS | 5760 MIPS |
| PCI Interface | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | No | Yes (33 MHz, 32-bit) |
| VCP/TCP Coprocessors | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | No | No |
| Operating Temperature | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +90C (commercial) | -40C to +90C (commercial) | -40C to +105C (extended) |
Diferenciadores clave
- PCI + VCP/TCP in a single 532-ball ZLZ package at 600 MHz (frente a TMS32C6414EGLZA5E0)
- Extended -40C to +105C temperature grade at the same ZLZ footprint (frente a TMS32C6416EGLZA6E3)
- Lower power vs higher-speed C6416T grade at the same ZLZ footprint (frente a TMS320C6416TBCLZA7)
Notas de diseño
The 532-ball FCBGA uses a 1.0 mm ball pitch and a multi-layer substrate; TI recommends at least four PCB layers with a continuous ground plane directly beneath the package to spread heat. Use NSMD (non-solder-mask-defined) land pads with a 0.5 mm pad diameter, follow TI's SPRA433 escape routing guidelines for the EMIF bus, and place decoupling within 5 mm of each power/ground ball pair. A microvia-in-pad stack-up is the standard approach for this family.
Estimated: at 600 MHz and the typical 1.2 V core supply, the C64x core dissipates roughly 1.5 to 2.5 W, with full-board dissipation including EMIF traffic and PCI I/O adding another 0.5 W. Provide at least 9 sq cm of unbroken top-side copper tied to the thermal balls and consider a 10x10x5 mm heatsink attached via thermal interface material for enclosed chassis. Confirm against TI's SPRS146 thermal model for your specific layout.
EMIF traces should be length-matched within +/- 2 mm for SDRAM operations and routed on an inner stripline layer referenced to a continuous ground plane. PCI signals require 90 ohm differential impedance for the PCI bus; route them on the same layer and avoid splitting the reference plane. Series-stuff 33 ohm resistors on PCI clock and high-speed EMIF clocks if length matching leaves excessive skew.
Do not assume any ZLZ-suffix orderable part number is a true drop-in replacement - the A6/A7/A5 suffix is the clock grade, the E vs T vs non-E suffix denotes peripheral and core revisions, and the GL vs ZL suffix denotes temperature grade. Always cross-reference the orderable part number against the TI C6416 datasheet SPRS146 (latest revision) and check errata SPRZ173 before locking down a design. Verify BOOTMODE strap settings against your flash / host-loader configuration.
Información de cumplimiento
RoHS and lead-free compliance confirmed via TI product page and DigiKey environmental data. REACH, halogen-free, and conflict-minerals declarations were not present in the verified web data; consult TI directly for those flags.
