TMS32C6416EZLZA6E3 - 600MHz Fixed-Point DSP 532-FCBGA | TI
料号： TMS32C6416EZLZA6E3 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152.75 | $15,275.00 |
| 250 | $142 | $35,500.00 |
| 500 | $131.5 | $65,750.00 |
TMS32C6416EZLZA6E3 概述
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is optimized for the mathematical operations common in signal processing - multiply-accumulate (MAC), FIR/IIR filtering, FFT, and convolution. Compared with general-purpose microcontrollers, DSPs feature wider datapaths, hardware MAC units, deterministic instruction cycles, and specialized memory architectures that sustain high data throughput. The C64x family specifically uses a VelociTI.2 Very Long Instruction Word (VLIW) architecture capable of issuing eight 32-bit instructions per clock cycle, making the C64x part of a hierarchy that runs: DSP -> VLIW DSP -> C6000 series -> C64x family -> TI digital signal processors.
Key features include a VelociTI.2 VLIW core with eight functional units, dual 64-bit data paths per CPU on the C64x, integrated L1/L2 memory controller, a 32-bit EMIF for external SDRAM/SRAM, three multi-channel buffered serial ports (McBSPs), a 33-bit PCI interface, and dedicated VCP/TCP co-processors that accelerate 3G wireless channel decoding. According to TI product documentation, the ZLZ variant combines the C64x DSP core with on-chip L2 SRAM and a flexible set of peripherals.
Typical applications include software-defined radio (SDR), 3G/4G baseband channel cards, real-time video transcoding, high-density voice/fax channel banks, professional audio processing, medical imaging front-ends, and military/aerospace signal intelligence. The PCI interface allows direct plug-in deployment on CompactPCI/cPCI carrier boards, while the EMIF and HPI support host-processor coupling.
When designing with this device, allocate PCB area for the 532-ball FCBGA (1.0 mm pitch), provide at least four PCB layers with a continuous ground plane for thermal spreading, and follow TI's SPRA433 / SPRU401 guidance for JTAG, clock, and EMIF signal integrity. For new designs, consider the TMS320C6416T family which offers higher clock rates and is the recommended successor.
直接替换替代料： TMS32C6416EZLZA6E3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
TMS320C6416TBCLZA6
✅ 直接替换📋 参考替代料（不在目录中）
TMS320C6416TBCLZA7
✅ 直接替换📋 参考替代料（不在目录中）
TMS32C6416EGLZA6E3
✅ 直接替换📋 参考替代料（不在目录中）
TMS32C6414EGLZA5E0
✅ 直接替换📋 参考替代料（不在目录中）
TMS320C6415TBCLZA6
✅ 直接替换📋 参考替代料（不在目录中）
TMS32C6416EZLZA6E3 规格参数
| Core Architecture | C64x fixed-point DSP (VelociTI.2 VLIW) |
| 最大时钟频率 | 600 MHz |
| Peak Performance | 4800 MIPS |
| Data Path Width | 32-bit fixed-point (dual 64-bit datapaths per CPU on C64x) |
| External Memory Interface (EMIF) | 32-bit EMIF, SDRAM/SRAM compatible |
| Serial Ports | 3x McBSP (Multi-channel Buffered Serial Port) |
| PCI Interface | 33 MHz, 32-bit PCI |
| Co-processors | VCP (Viterbi) + TCP (Turbo) |
| Host Port Interface | HPI (16/32-bit host port) |
| Operating Voltage (Core) | 1.2 V (typical) |
| Operating Voltage (I/O) | 3.3 V |
| 封装 | 532-ball FCBGA (ZLZ), 23x23 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +105C (extended industrial) |
| RoHS 状态 | Compliant |
| Lead-Free / Halogen-Free | Lead-free (per TI product page) |
| Series | TMS320C6416 (C64x family) |
TMS32C6416EZLZA6E3 532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch 引脚配置指南
TMS32C6416EZLZA6E3（532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： TMS32C6416EZLZA6E3.
请参阅 数据手册 以查看完整引脚配置。
典型应用
TMS32C6416EZLZA6E3 适用于 6 应用s: Software Defined Radio (SDR) Baseband, 3G/4G Channel Decoding Card, Real-Time Video Transcoding, Medical Imaging Front-End, Professional Audio Processing, Military / SIGINT Signal Processing.
Software Defined Radio (SDR) Baseband
The TMS32C6416EZLZA6E3's 4800 MIPS at 600 MHz give it the headroom to run multi-carrier OFDM demodulation, channel estimation, and synchronization in a wideband SDR baseband card. Its on-chip VCP/TCP accelerators offload the turbo and Viterbi decoding that 3G/4G waveforms require, freeing CPU cycles for the FFT/iFFT-heavy physical layer. Designers place the ZLZ package on a cPCI carrier so the PCI interface can stream baseband I/Q into host memory at line rate.
推荐
3G/4G Channel Decoding Card
Channel decoding on UMTS, HSPA, and LTE base stations is dominated by turbo and convolutional codes that map directly onto the TMS32C6416EZLZA6E3's VCP and TCP co-processors. The C64x core handles the surrounding rate-matching, CRC, and HARQ protocol work while the accelerators sustain real-time peak throughput. Combined with three McBSP links and the PCI host interface, a single DSP can serve multiple users per board slot.
推荐
Real-Time Video Transcoding
Video transcoding engines benefit from the C64x SIMD-style packed-data instructions and the determinism of a VLIW pipeline. The 4800 MIPS figure sustains multiple SD-to-HD or HD-to-mobile transcode tasks in parallel, with the 32-bit EMIF providing the bandwidth to external DDR buffers used as frame stores. The 1.0 mm-pitch FCBGA package allows a compact mezzanine footprint that drops into existing transcoder cards.
推荐
Medical Imaging Front-End
Ultrasound, CT, and MRI front-ends stream raw RF/k-space data through a real-time beamformer or back-projection kernel - exactly the workloads that benefit from the TMS32C6416EZLZA6E3's wide data paths and deterministic instruction timing. A cPCI form factor using the on-chip PCI is a common deployment pattern in cart-based imaging systems, and the extended -40C to +105C temperature range supports the warm enclosure environment of imaging racks.
推荐
Professional Audio Processing
Studio-grade effects processors and high-channel-count mixing consoles lean on a DSP to run convolution reverbs, dynamics, and matrix mixing at sample rates up to 192 kHz. The TMS32C6416EZLZA6E3's three McBSP ports accept multiple AES/EBU or I2S audio streams, while the EMIF buffers audio frames in external SDRAM. Compared with a generic microcontroller, the C64x's eight-issue VLIW pipeline runs large FIR kernels with far lower latency.
推荐
Military / SIGINT Signal Processing
Electronic warfare and signal-intelligence platforms demand deterministic execution and high throughput to demodulate, classify, and geolocate emitters in dense RF environments. The TMS32C6416EZLZA6E3's extended -40C to +105C temperature grade and the rugged FCBGA package support deployed SIGINT payloads. PCI plug-in cards based on the C6416 family have been a long-standing building block of cPCI-based EW chassis.
推荐
推荐产品汇总
工程参考数据： TMS32C6416EZLZA6E3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TMS320C6416TBCLZA6 | TMS320C6416TBCLZA7 | TMS32C6416EGLZA6E3 | TMS32C6414EGLZA5E0 | TMS320C6415TBCLZA6 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 532-ball FCBGA (ZLZ), 23x23 mm | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same |
| Core | C64x fixed-point | C6416T fixed-point | C6416T fixed-point | C64x fixed-point | C6414 fixed-point | C6415T fixed-point |
| Maximum Clock | 600 MHz | 720 MHz | 1 GHz | 600 MHz | 500 MHz | 720 MHz |
| Peak MIPS | 4800 MIPS | 5760 MIPS | 8000 MIPS | 4800 MIPS | 4000 MIPS | 5760 MIPS |
| PCI Interface | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | No | Yes (33 MHz, 32-bit) |
| VCP/TCP Coprocessors | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | No | No |
| Operating Temperature | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +90C (commercial) | -40C to +90C (commercial) | -40C to +105C (extended) |
关键差异点
- PCI + VCP/TCP in a single 532-ball ZLZ package at 600 MHz （对比 TMS32C6414EGLZA5E0)
- Extended -40C to +105C temperature grade at the same ZLZ footprint （对比 TMS32C6416EGLZA6E3)
- Lower power vs higher-speed C6416T grade at the same ZLZ footprint （对比 TMS320C6416TBCLZA7)
设计说明
The 532-ball FCBGA uses a 1.0 mm ball pitch and a multi-layer substrate; TI recommends at least four PCB layers with a continuous ground plane directly beneath the package to spread heat. Use NSMD (non-solder-mask-defined) land pads with a 0.5 mm pad diameter, follow TI's SPRA433 escape routing guidelines for the EMIF bus, and place decoupling within 5 mm of each power/ground ball pair. A microvia-in-pad stack-up is the standard approach for this family.
Estimated: at 600 MHz and the typical 1.2 V core supply, the C64x core dissipates roughly 1.5 to 2.5 W, with full-board dissipation including EMIF traffic and PCI I/O adding another 0.5 W. Provide at least 9 sq cm of unbroken top-side copper tied to the thermal balls and consider a 10x10x5 mm heatsink attached via thermal interface material for enclosed chassis. Confirm against TI's SPRS146 thermal model for your specific layout.
EMIF traces should be length-matched within +/- 2 mm for SDRAM operations and routed on an inner stripline layer referenced to a continuous ground plane. PCI signals require 90 ohm differential impedance for the PCI bus; route them on the same layer and avoid splitting the reference plane. Series-stuff 33 ohm resistors on PCI clock and high-speed EMIF clocks if length matching leaves excessive skew.
Do not assume any ZLZ-suffix orderable part number is a true drop-in replacement - the A6/A7/A5 suffix is the clock grade, the E vs T vs non-E suffix denotes peripheral and core revisions, and the GL vs ZL suffix denotes temperature grade. Always cross-reference the orderable part number against the TI C6416 datasheet SPRS146 (latest revision) and check errata SPRZ173 before locking down a design. Verify BOOTMODE strap settings against your flash / host-loader configuration.
合规信息
RoHS and lead-free compliance confirmed via TI product page and DigiKey environmental data. REACH, halogen-free, and conflict-minerals declarations were not present in the verified web data; consult TI directly for those flags.
