TMS32C6416EZLZA6E3 - 600MHz Fixed-Point DSP 532-FCBGA | TI
부품 번호: TMS32C6416EZLZA6E3 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152.75 | $15,275.00 |
| 250 | $142 | $35,500.00 |
| 500 | $131.5 | $65,750.00 |
TMS32C6416EZLZA6E3 개요
A DSP (Digital Signal Processor) is a specialized microprocessor whose architecture is optimized for the mathematical operations common in signal processing - multiply-accumulate (MAC), FIR/IIR filtering, FFT, and convolution. Compared with general-purpose microcontrollers, DSPs feature wider datapaths, hardware MAC units, deterministic instruction cycles, and specialized memory architectures that sustain high data throughput. The C64x family specifically uses a VelociTI.2 Very Long Instruction Word (VLIW) architecture capable of issuing eight 32-bit instructions per clock cycle, making the C64x part of a hierarchy that runs: DSP -> VLIW DSP -> C6000 series -> C64x family -> TI digital signal processors.
Key features include a VelociTI.2 VLIW core with eight functional units, dual 64-bit data paths per CPU on the C64x, integrated L1/L2 memory controller, a 32-bit EMIF for external SDRAM/SRAM, three multi-channel buffered serial ports (McBSPs), a 33-bit PCI interface, and dedicated VCP/TCP co-processors that accelerate 3G wireless channel decoding. According to TI product documentation, the ZLZ variant combines the C64x DSP core with on-chip L2 SRAM and a flexible set of peripherals.
Typical applications include software-defined radio (SDR), 3G/4G baseband channel cards, real-time video transcoding, high-density voice/fax channel banks, professional audio processing, medical imaging front-ends, and military/aerospace signal intelligence. The PCI interface allows direct plug-in deployment on CompactPCI/cPCI carrier boards, while the EMIF and HPI support host-processor coupling.
When designing with this device, allocate PCB area for the 532-ball FCBGA (1.0 mm pitch), provide at least four PCB layers with a continuous ground plane for thermal spreading, and follow TI's SPRA433 / SPRU401 guidance for JTAG, clock, and EMIF signal integrity. For new designs, consider the TMS320C6416T family which offers higher clock rates and is the recommended successor.
드롭인 대체품: TMS32C6416EZLZA6E3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TMS320C6416TBCLZA6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS320C6416TBCLZA7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS32C6416EGLZA6E3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS32C6414EGLZA5E0
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS320C6415TBCLZA6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS32C6416EZLZA6E3 사양
| Core Architecture | C64x fixed-point DSP (VelociTI.2 VLIW) |
| 최대 클록 주파수 | 600 MHz |
| Peak Performance | 4800 MIPS |
| Data Path Width | 32-bit fixed-point (dual 64-bit datapaths per CPU on C64x) |
| External Memory Interface (EMIF) | 32-bit EMIF, SDRAM/SRAM compatible |
| Serial Ports | 3x McBSP (Multi-channel Buffered Serial Port) |
| PCI Interface | 33 MHz, 32-bit PCI |
| Co-processors | VCP (Viterbi) + TCP (Turbo) |
| Host Port Interface | HPI (16/32-bit host port) |
| Operating Voltage (Core) | 1.2 V (typical) |
| Operating Voltage (I/O) | 3.3 V |
| 패키지 | 532-ball FCBGA (ZLZ), 23x23 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40C to +105C (extended industrial) |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Lead-free (per TI product page) |
| Series | TMS320C6416 (C64x family) |
TMS32C6416EZLZA6E3 532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch 핀 구성 가이드
TMS32C6416EZLZA6E3(532-ball fcbga (zlz), 23x23 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: TMS32C6416EZLZA6E3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
TMS32C6416EZLZA6E3 적합 용도: 6 애플리케이션s: Software Defined Radio (SDR) Baseband, 3G/4G Channel Decoding Card, Real-Time Video Transcoding, Medical Imaging Front-End, Professional Audio Processing, Military / SIGINT Signal Processing.
Software Defined Radio (SDR) Baseband
The TMS32C6416EZLZA6E3's 4800 MIPS at 600 MHz give it the headroom to run multi-carrier OFDM demodulation, channel estimation, and synchronization in a wideband SDR baseband card. Its on-chip VCP/TCP accelerators offload the turbo and Viterbi decoding that 3G/4G waveforms require, freeing CPU cycles for the FFT/iFFT-heavy physical layer. Designers place the ZLZ package on a cPCI carrier so the PCI interface can stream baseband I/Q into host memory at line rate.
추천
3G/4G Channel Decoding Card
Channel decoding on UMTS, HSPA, and LTE base stations is dominated by turbo and convolutional codes that map directly onto the TMS32C6416EZLZA6E3's VCP and TCP co-processors. The C64x core handles the surrounding rate-matching, CRC, and HARQ protocol work while the accelerators sustain real-time peak throughput. Combined with three McBSP links and the PCI host interface, a single DSP can serve multiple users per board slot.
추천
Real-Time Video Transcoding
Video transcoding engines benefit from the C64x SIMD-style packed-data instructions and the determinism of a VLIW pipeline. The 4800 MIPS figure sustains multiple SD-to-HD or HD-to-mobile transcode tasks in parallel, with the 32-bit EMIF providing the bandwidth to external DDR buffers used as frame stores. The 1.0 mm-pitch FCBGA package allows a compact mezzanine footprint that drops into existing transcoder cards.
추천
Medical Imaging Front-End
Ultrasound, CT, and MRI front-ends stream raw RF/k-space data through a real-time beamformer or back-projection kernel - exactly the workloads that benefit from the TMS32C6416EZLZA6E3's wide data paths and deterministic instruction timing. A cPCI form factor using the on-chip PCI is a common deployment pattern in cart-based imaging systems, and the extended -40C to +105C temperature range supports the warm enclosure environment of imaging racks.
추천
Professional Audio Processing
Studio-grade effects processors and high-channel-count mixing consoles lean on a DSP to run convolution reverbs, dynamics, and matrix mixing at sample rates up to 192 kHz. The TMS32C6416EZLZA6E3's three McBSP ports accept multiple AES/EBU or I2S audio streams, while the EMIF buffers audio frames in external SDRAM. Compared with a generic microcontroller, the C64x's eight-issue VLIW pipeline runs large FIR kernels with far lower latency.
추천
Military / SIGINT Signal Processing
Electronic warfare and signal-intelligence platforms demand deterministic execution and high throughput to demodulate, classify, and geolocate emitters in dense RF environments. The TMS32C6416EZLZA6E3's extended -40C to +105C temperature grade and the rugged FCBGA package support deployed SIGINT payloads. PCI plug-in cards based on the C6416 family have been a long-standing building block of cPCI-based EW chassis.
추천
추천 제품 요약
엔지니어링 참조 데이터: TMS32C6416EZLZA6E3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TMS320C6416TBCLZA6 | TMS320C6416TBCLZA7 | TMS32C6416EGLZA6E3 | TMS32C6414EGLZA5E0 | TMS320C6415TBCLZA6 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 532-ball FCBGA (ZLZ), 23x23 mm | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same | 532-ball FCBGA (ZLZ), 23x23 mm - same |
| Core | C64x fixed-point | C6416T fixed-point | C6416T fixed-point | C64x fixed-point | C6414 fixed-point | C6415T fixed-point |
| Maximum Clock | 600 MHz | 720 MHz | 1 GHz | 600 MHz | 500 MHz | 720 MHz |
| Peak MIPS | 4800 MIPS | 5760 MIPS | 8000 MIPS | 4800 MIPS | 4000 MIPS | 5760 MIPS |
| PCI Interface | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | Yes (33 MHz, 32-bit) | No | Yes (33 MHz, 32-bit) |
| VCP/TCP Coprocessors | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | Yes (VCP + TCP) | No | No |
| Operating Temperature | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +105C (extended) | -40C to +90C (commercial) | -40C to +90C (commercial) | -40C to +105C (extended) |
주요 차별점
- PCI + VCP/TCP in a single 532-ball ZLZ package at 600 MHz (vs TMS32C6414EGLZA5E0)
- Extended -40C to +105C temperature grade at the same ZLZ footprint (vs TMS32C6416EGLZA6E3)
- Lower power vs higher-speed C6416T grade at the same ZLZ footprint (vs TMS320C6416TBCLZA7)
설계 노트
The 532-ball FCBGA uses a 1.0 mm ball pitch and a multi-layer substrate; TI recommends at least four PCB layers with a continuous ground plane directly beneath the package to spread heat. Use NSMD (non-solder-mask-defined) land pads with a 0.5 mm pad diameter, follow TI's SPRA433 escape routing guidelines for the EMIF bus, and place decoupling within 5 mm of each power/ground ball pair. A microvia-in-pad stack-up is the standard approach for this family.
Estimated: at 600 MHz and the typical 1.2 V core supply, the C64x core dissipates roughly 1.5 to 2.5 W, with full-board dissipation including EMIF traffic and PCI I/O adding another 0.5 W. Provide at least 9 sq cm of unbroken top-side copper tied to the thermal balls and consider a 10x10x5 mm heatsink attached via thermal interface material for enclosed chassis. Confirm against TI's SPRS146 thermal model for your specific layout.
EMIF traces should be length-matched within +/- 2 mm for SDRAM operations and routed on an inner stripline layer referenced to a continuous ground plane. PCI signals require 90 ohm differential impedance for the PCI bus; route them on the same layer and avoid splitting the reference plane. Series-stuff 33 ohm resistors on PCI clock and high-speed EMIF clocks if length matching leaves excessive skew.
Do not assume any ZLZ-suffix orderable part number is a true drop-in replacement - the A6/A7/A5 suffix is the clock grade, the E vs T vs non-E suffix denotes peripheral and core revisions, and the GL vs ZL suffix denotes temperature grade. Always cross-reference the orderable part number against the TI C6416 datasheet SPRS146 (latest revision) and check errata SPRZ173 before locking down a design. Verify BOOTMODE strap settings against your flash / host-loader configuration.
규정 준수 정보
RoHS and lead-free compliance confirmed via TI product page and DigiKey environmental data. REACH, halogen-free, and conflict-minerals declarations were not present in the verified web data; consult TI directly for those flags.
