10AS057K4F35I3SG - Arria 10 SX SoC FPGA 570K LE | Altera | Industrial
MPN: 10AS057K4F35I3SG ✓ فعال10AS057K4F35I3SG نمای کلی
An FPGA (Field Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks, programmable interconnect, and I/O elements that engineers can re-program after manufacturing. SoC FPGAs extend this by integrating one or more hard processor cores, on-chip memory controllers, and peripherals alongside the fabric, reducing bill-of-materials, board area, and inter-chip latency versus a discrete CPU + FPGA design. The Arria 10 SX family targets mid-to-high-end applications that need ARM Cortex-A9 application processing together with high-throughput DSP, multi-gigabit transceivers, and external memory interfaces in a single device.
Key features include 570K logic elements, dual-core ARM Cortex-A9 MPCore with NEON media engine and single/double precision floating-point unit, CoreSight debug and trace, integrated hardened memory controllers, and high-speed serial transceivers. The 1152-ball FCBGA (35x35 mm) package supports the device's 396 user I/O pins and exposes multiple high-bandwidth memory and serial interfaces needed by communications, broadcast, and industrial imaging designs.
Architecturally, the device pairs a TSMC 20 nm process FPGA fabric with a hardened HPS subsystem, eliminating soft CPU latency overhead. The 20 nm node also lowers dynamic power relative to the prior 28 nm Arria V generation, enabling higher logic density at the same thermal envelope. Embedded hard IP blocks (PCIe Gen2/Gen3, multi-gigabit transceivers up to 14.1 Gbps, and DDR4 memory controllers) accelerate protocol implementation while preserving FPGA logic for differentiated design IP.
Typical applications include wireless baseband processing, radar and electronic warfare signal processing, military secure communications, medical imaging acceleration, industrial machine vision, and broadcast video processing. The integrated HPS is well suited to control-plane tasks (OS, network stack, system management) while the FPGA fabric handles data-plane DSP and packet processing.
When designing with this part, pay attention to the 1152-ball FCBGA routing complexity: a high layer-count PCB (typically 12+ layers) with microvia stack-ups and matched-length transceiver routing is required. Power sequencing for HPS and FPGA rails must follow the Intel Arria 10 Power Management User Guide to avoid inrush damage, and thermal design must assume the industrial -40C to +100C operating range.
This page synthesizes distributor inventory, drop-in Arria 10 SX device variants, and practical design considerations not found in the manufacturer datasheet, helping engineers select the correct speed/temperature/package variant for their application.
جایگزین‌های drop-in برای 10AS057K4F35I3SG — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای 10AS057K4F35I3SG (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Speed Grade, Logic Elements, Mounting Type, RoHS Status.
10AS057K4F35I3LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K4F35E3SG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K4F35E3LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K3F35I2SG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K3F35I2LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K2F35I2SG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K2F35I2LG
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←10AS057K4F35I3SG حداکثر مقادیر مجاز و مشخصات الکتریکی
| Series | Arria 10 SX |
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed | 1.5 GHz (max) |
| User I/O Count | 396 |
| Package Type | 1152-FBGA, FC (35x35 mm) |
| Operating Temperature Grade | Industrial |
| Speed Grade | -3 |
| Process Node | 20 nm |
| نوع نصب | Surface Mount |
| وضعیت RoHS | Compliant |
| Lead-Free | Yes |
راهنمای پیکربندی پین 10AS057K4F35I3SG 1152-fbga, fc (35x35 mm)
پیکربندی پین برای 10AS057K4F35I3SG (پکیج 1152-fbga, fc (35x35 mm)). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای 10AS057K4F35I3SG.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
10AS057K4F35I3SG مناسب است برای 6 کاربردs: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging Acceleration, Industrial Machine Vision, Broadcast Video Processing, Secure Military Communications.
Wireless Baseband Processing
The 10AS057K4F35I3SG is well suited to LTE and 5G NR baseband processing where the FPGA fabric implements PHY-layer channel coding, FFT/iFFT, and matrix inversion, while the dual-core ARM Cortex-A9 hard processor system runs the MAC layer and protocol stack with deterministic latency. The 570K logic elements provide sufficient capacity for 4x4 MIMO configurations, and integrated multi-gigabit transceivers handle CPRI/eCPRI fronthaul links directly. Designers benefit from reduced PCB complexity versus a discrete CPU + FPGA design, and the 20 nm process keeps dynamic power within budget for outdoor radio units.
پیشنهادی
Radar and Electronic Warfare Signal Processing
The 10AS057K4F35I3SG's 570K logic elements, hardened DSP blocks, and high-speed serial transceivers make it an excellent platform for phased-array radar and electronic countermeasure systems. The FPGA fabric executes pulse compression, MTI filtering, and beamforming FFTs in real time, while the integrated ARM Cortex-A9 subsystem handles track management, target classification, and control-plane networking. Industrial temperature grade supports deployment in ground vehicles and shipboard installations, and the F35 1152-ball FCBGA exposes enough transceivers for multi-element antenna interface connectivity.
پیشنهادی
Medical Imaging Acceleration
In ultrasound, CT, and MRI imaging systems, the 10AS057K4F35I3SG accelerates beamforming, image reconstruction, and real-time filtering pipelines. The 570K logic elements accommodate multi-channel beamforming for 64 to 128-element ultrasound probes, and the integrated ARM Cortex-A9 hard processor system handles patient interface, DICOM networking, and user interface rendering. PCIe Gen2/Gen3 hard IP enables direct attachment to host CPUs for image archival. The industrial temperature range supports operating-room and mobile clinic equipment.
پیشنهادی
Industrial Machine Vision
High-speed automated inspection lines use the 10AS057K4F35I3SG to process multi-camera image streams at line rates exceeding 10 kHz. The FPGA fabric executes Bayer demosaicing, color correction, and defect detection algorithms in parallel, while the ARM Cortex-A9 subsystem manages camera link protocols (GigE Vision, CoaXPress, Camera Link), line synchronization, and factory-floor networking via EtherCAT or PROFINET. Industrial temperature grade is essential for factory ambient temperatures that can exceed 70C near motors and ovens.
پیشنهادی
Broadcast Video Processing
The 10AS057K4F35I3SG is widely deployed in broadcast studio equipment for 4K/UHD video processing, format conversion, and contribution codec encoding. Its 570K logic elements support multiple channels of HEVC encoding or HDR/SDR conversion pipelines, and integrated multi-gigabit transceivers interface with 12G-SDI and SMPTE 2110 IP-based broadcast networks. The ARM Cortex-A9 subsystem handles ancillary data, closed-caption extraction, and studio control-plane software stacks.
پیشنهادی
Secure Military Communications
For tactical radio and secure data link applications, the 10AS057K4F35I3SG combines FPGA-accelerated cryptographic processing with an ARM Cortex-A9 subsystem running the secure operating system. Integrated transceivers support tactical data link waveforms such as Link 16 and Link 22, and the 570K logic elements allow software-defined radio waveform porting. Industrial temperature grade is sufficient for many ground vehicle applications; the 10AS057H4F35 family should be selected for full -55C to +125C military temperature requirements.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای 10AS057K4F35I3SG — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | 10AS057K4F35I3LG | 10AS057K4F35E3SG | 10AS057K3F35I2SG | 10AS057K2F35I2SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 570K | 570K | 570K | 570K | 570K |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Processor Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| User I/O Count | 396 | 396 | 396 | 396 | 396 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
تفاوت‌های کلیدی
- Hardened dual-core ARM Cortex-A9 MPCore subsystem (در مقابلXilinx XCKU060 (Kintex UltraScale))
- Higher logic density in same F35 package footprint (در مقابل10AS048K4F35I3SG (480K LE))
- 20 nm process technology for lower dynamic power (در مقابلArria V 28 nm family)
- Industrial temperature grade availability in this density (در مقابلXilinx XCVU440 Virtex UltraScale)
یادداشت‌های طراحی
Estimated: The 1152-ball FCBGA at 35x35 mm requires a high-density PCB with microvia stack-ups and a minimum of 12 routing layers. Use a 1.0 mm or 1.27 mm ball pitch escape strategy with via-in-pad or dog-bone fan-outs, and follow Intel's Arria 10 PCB Design Guidelines for trace width, impedance control (100 ohm differential for transceivers, 50 ohm single-ended for general I/O), and length matching for DDR4 interfaces.
Estimated: The Arria 10 SX 570K device draws between 15W and 40W typical depending on logic utilization and transceiver count. A multi-rail PMIC solution (such as the Intel Enpirion EM11x or compatible) is required to sequence VCC, VCCPT, VCCPGM, VCCR, VCCT, and HPS-specific rails in the order specified by the Arria 10 Power Management User Guide. Inrush current during configuration can exceed 3A; bulk decoupling must include 470uF polymer or electrolytic capacitors plus 22uF ceramic per rail.
Industrial temperature grade requires the junction-to-ambient thermal resistance (theta_JA) design to keep junction temperatures below 100C at maximum ambient. The F35 35x35 mm FCBGA has an estimated theta_JA of approximately 14 C/W with a properly designed thermal via array and heat sink. Forced-air cooling or a heat sink is strongly recommended for designs with high transceiver utilization, as multi-gigabit transceivers can each dissipate 1-2W.
Do not confuse the F35 package (35x35 mm) with the F34 package (34x34 mm); they have different ball maps and require different PCB layouts even though both are 1152-ball FCBGAs. Also ensure MSL handling matches the JEDEC J-STD-020 rating - typical Arria 10 FPGAs are MSL3, requiring bake-out before assembly if the floor-life is exceeded.
Multi-gigabit transceivers operating up to 14.1 Gbps require matched-length routing with controlled impedance and continuous reference planes. Place AC-coupling capacitors as close to the transmitter pins as possible, follow Intel's recommended S-parameter models for the F35 package, and validate signal integrity with 3D EM simulation or Intel's Quartus Prime Signal Integrity Analysis tool before committing to PCB fabrication.
اطلاعات انطباق
RoHS and lead-free per Altera/Intel product page. AEC-Q100 is not applicable - FPGAs are not automotive-grade qualified components in the conventional AEC-Q100 sense. Conflict minerals compliance per Intel corporate policy.