10AS057K4F35I3SG - Arria 10 SX SoC FPGA 570K LE | Altera | Industrial
MPN: 10AS057K4F35I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3071.8 | $3,071.80 |
| 10 | $2880.5 | $28,805.00 |
| 50 | $2640 | $132,000.00 |
| 100 | $2410 | $241,000.00 |
| 500 | $2185 | $1,092,500.00 |
Drop-in alternatives for 10AS057K4F35I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057K4F35I3LG
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View Datasheet →10AS057K4F35E3SG
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View Datasheet →10AS057K3F35I2SG
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View Datasheet →10AS057K3F35I2LG
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View Datasheet →10AS057K2F35I2SG
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View Datasheet →10AS057K4F35I3SG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 570K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Clock Speed | 1.5 GHz (max) |
| User I/O Count | 396 |
| Package Type | 1152-FBGA, FC (35x35 mm) |
| Operating Temperature Grade | Industrial |
| Speed Grade | -3 |
| Process Node | 20 nm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AS057K4F35I3SG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS057K4F35I3SG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057K4F35I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057K4F35I3SG is suitable for 6 applications: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Medical Imaging Acceleration, Industrial Machine Vision, Broadcast Video Processing, Secure Military Communications.
Wireless Baseband Processing
The 10AS057K4F35I3SG is well suited to LTE and 5G NR baseband processing where the FPGA fabric implements PHY-layer channel coding, FFT/iFFT, and matrix inversion, while the dual-core ARM Cortex-A9 hard processor system runs the MAC layer and protocol stack with deterministic latency. The 570K logic elements provide sufficient capacity for 4x4 MIMO configurations, and integrated multi-gigabit transceivers handle CPRI/eCPRI fronthaul links directly. Designers benefit from reduced PCB complexity versus a discrete CPU + FPGA design, and the 20 nm process keeps dynamic power within budget for outdoor radio units.
Recommended
Radar and Electronic Warfare Signal Processing
The 10AS057K4F35I3SG's 570K logic elements, hardened DSP blocks, and high-speed serial transceivers make it an excellent platform for phased-array radar and electronic countermeasure systems. The FPGA fabric executes pulse compression, MTI filtering, and beamforming FFTs in real time, while the integrated ARM Cortex-A9 subsystem handles track management, target classification, and control-plane networking. Industrial temperature grade supports deployment in ground vehicles and shipboard installations, and the F35 1152-ball FCBGA exposes enough transceivers for multi-element antenna interface connectivity.
Recommended
Medical Imaging Acceleration
In ultrasound, CT, and MRI imaging systems, the 10AS057K4F35I3SG accelerates beamforming, image reconstruction, and real-time filtering pipelines. The 570K logic elements accommodate multi-channel beamforming for 64 to 128-element ultrasound probes, and the integrated ARM Cortex-A9 hard processor system handles patient interface, DICOM networking, and user interface rendering. PCIe Gen2/Gen3 hard IP enables direct attachment to host CPUs for image archival. The industrial temperature range supports operating-room and mobile clinic equipment.
Recommended
Industrial Machine Vision
High-speed automated inspection lines use the 10AS057K4F35I3SG to process multi-camera image streams at line rates exceeding 10 kHz. The FPGA fabric executes Bayer demosaicing, color correction, and defect detection algorithms in parallel, while the ARM Cortex-A9 subsystem manages camera link protocols (GigE Vision, CoaXPress, Camera Link), line synchronization, and factory-floor networking via EtherCAT or PROFINET. Industrial temperature grade is essential for factory ambient temperatures that can exceed 70C near motors and ovens.
Recommended
Broadcast Video Processing
The 10AS057K4F35I3SG is widely deployed in broadcast studio equipment for 4K/UHD video processing, format conversion, and contribution codec encoding. Its 570K logic elements support multiple channels of HEVC encoding or HDR/SDR conversion pipelines, and integrated multi-gigabit transceivers interface with 12G-SDI and SMPTE 2110 IP-based broadcast networks. The ARM Cortex-A9 subsystem handles ancillary data, closed-caption extraction, and studio control-plane software stacks.
Recommended
Secure Military Communications
For tactical radio and secure data link applications, the 10AS057K4F35I3SG combines FPGA-accelerated cryptographic processing with an ARM Cortex-A9 subsystem running the secure operating system. Integrated transceivers support tactical data link waveforms such as Link 16 and Link 22, and the 570K logic elements allow software-defined radio waveform porting. Industrial temperature grade is sufficient for many ground vehicle applications; the 10AS057H4F35 family should be selected for full -55C to +125C military temperature requirements.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057K4F35I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057K4F35I3LG | 10AS057K4F35E3SG | 10AS057K3F35I2SG | 10AS057K2F35I2SG |
|---|---|---|---|---|---|
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 570K | 570K | 570K | 570K | 570K |
| Speed Grade | -3 | -3 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Processor Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| User I/O Count | 396 | 396 | 396 | 396 | 396 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Hardened dual-core ARM Cortex-A9 MPCore subsystem (vs Xilinx XCKU060 (Kintex UltraScale))
- Higher logic density in same F35 package footprint (vs 10AS048K4F35I3SG (480K LE))
- 20 nm process technology for lower dynamic power (vs Arria V 28 nm family)
- Industrial temperature grade availability in this density (vs Xilinx XCVU440 Virtex UltraScale)
Design Notes
Estimated: The 1152-ball FCBGA at 35x35 mm requires a high-density PCB with microvia stack-ups and a minimum of 12 routing layers. Use a 1.0 mm or 1.27 mm ball pitch escape strategy with via-in-pad or dog-bone fan-outs, and follow Intel's Arria 10 PCB Design Guidelines for trace width, impedance control (100 ohm differential for transceivers, 50 ohm single-ended for general I/O), and length matching for DDR4 interfaces.
Estimated: The Arria 10 SX 570K device draws between 15W and 40W typical depending on logic utilization and transceiver count. A multi-rail PMIC solution (such as the Intel Enpirion EM11x or compatible) is required to sequence VCC, VCCPT, VCCPGM, VCCR, VCCT, and HPS-specific rails in the order specified by the Arria 10 Power Management User Guide. Inrush current during configuration can exceed 3A; bulk decoupling must include 470uF polymer or electrolytic capacitors plus 22uF ceramic per rail.
Industrial temperature grade requires the junction-to-ambient thermal resistance (theta_JA) design to keep junction temperatures below 100C at maximum ambient. The F35 35x35 mm FCBGA has an estimated theta_JA of approximately 14 C/W with a properly designed thermal via array and heat sink. Forced-air cooling or a heat sink is strongly recommended for designs with high transceiver utilization, as multi-gigabit transceivers can each dissipate 1-2W.
Do not confuse the F35 package (35x35 mm) with the F34 package (34x34 mm); they have different ball maps and require different PCB layouts even though both are 1152-ball FCBGAs. Also ensure MSL handling matches the JEDEC J-STD-020 rating - typical Arria 10 FPGAs are MSL3, requiring bake-out before assembly if the floor-life is exceeded.
Multi-gigabit transceivers operating up to 14.1 Gbps require matched-length routing with controlled impedance and continuous reference planes. Place AC-coupling capacitors as close to the transmitter pins as possible, follow Intel's recommended S-parameter models for the F35 package, and validate signal integrity with 3D EM simulation or Intel's Quartus Prime Signal Integrity Analysis tool before committing to PCB fabrication.
Compliance Information
RoHS and lead-free per Altera/Intel product page. AEC-Q100 is not applicable - FPGAs are not automotive-grade qualified components in the conventional AEC-Q100 sense. Conflict minerals compliance per Intel corporate policy.
