EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
MPN: EP2AGZ350HF40I2N ✗ پایان تولیدEP2AGZ350HF40I2N نمای کلی
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient.
Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts.
Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links.
Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels.
Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA.
This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.
جایگزین‌های drop-in برای EP2AGZ350HF40I2N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP2AGZ350HF40I2N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, RoHS Status, Speed Grade, Transceivers, Logic Elements.
EP2AGZ350HF40I3N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2AGZ350HF40I4N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2AGZ350HF40C2N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2AGZ350HF40C3N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2AGZ350HF40C4N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP2AGZ300HF40I2N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EP2AGZ350HF40I2N حداکثر مقادیر مجاز و مشخصات الکتریکی
| Family | Arria II GZ |
| Logic Elements | 350000 |
| بسته‌بندی | 1517-pin FBGA (HF40) |
| دمای کاری | -40C to +100C (Industrial) |
| Transceivers | Embedded multi-gigabit transceivers |
| Max Transceiver Data Rate | 6.375 Gbps |
| وضعیت RoHS | Compliant |
| Lead-Free | Yes |
| نوع نصب | Surface Mount (BGA) |
| AEC-Q100 | not_applicable |
راهنمای پیکربندی پین EP2AGZ350HF40I2N 1517-pin fbga (hf40)
پیکربندی پین برای EP2AGZ350HF40I2N (پکیج 1517-pin fbga (hf40)). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EP2AGZ350HF40I2N.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EP2AGZ350HF40I2N مناسب است برای 7 کاربردs: Wireless Base Station Digital Front-End, Software Defined Radio (SDR) Platforms, Military Radar and Electronic Warfare, ASIC Prototyping and Emulation, Broadcast Video Processing and Conversion, High-Performance Computing Accelerator Card, Industrial Machine Vision and Inspection.
Wireless Base Station Digital Front-End
The EP2AGZ350HF40I2N fits wireless base-station digital front-end designs where multi-gigabit CPRI or OBSAI links and high-density signal processing are required. Its 6.375 Gbps transceivers handle CPRI Option 3 through Option 5 fronthaul, while the 350K logic elements and dedicated DSP blocks implement channel cards, crest-factor reduction, and digital predistortion. The HF40 1517-pin BGA delivers the I/O and signal-integrity margin needed for multiple SFP/SFP+ cages and parallel antenna data paths. Industrial temperature grade suits outdoor small-cell enclosures.
پیشنهادی
Software Defined Radio (SDR) Platforms
Software-defined radio platforms benefit from the EP2AGZ350HF40I2N's combination of 6.375 Gbps transceivers for ADC/DAC data capture and 350K logic elements for wideband FFTs, channelizers, and modem waveforms. The HF40 flip-chip BGA provides the signal integrity required for 12-bit+ JESD204B ADC links at multi-GSPS rates, while dedicated DSP blocks accelerate polyphase filter banks. Industrial temperature grade supports tactical and vehicular SDR chassis operating from -40C to +100C without thermal derating.
پیشنهادی
Military Radar and Electronic Warfare
The EP2AGZ350HF40I2N suits military radar and electronic-warfare platforms that demand high-density FPGA logic and ruggedized temperature operation in the same package. With 350K logic elements and 6.375 Gbps transceivers the device can ingest multi-channel phased-array data, run pulse compression, and generate arbitrary waveforms for EW jammers. The industrial temperature grade and lead-free HF40 BGA meet the long-term reliability and RoHS requirements of modern defense programs requiring ITAR-controlled supply chains.
پیشنهادی
ASIC Prototyping and Emulation
ASIC prototyping and emulation harness the EP2AGZ350HF40I2N's 350K logic-element fabric to map large ASIC RTL blocks partition-by-partition for pre-silicon software development. The HF40 1517-pin BGA exposes enough I/O to bridge to DDR3 SODIMMs, high-speed mezzanine connectors (HSMC/FMC), and PCIe Gen2 slots for host bring-up. Multi-FPGA partitioning benefits from the device's 6.375 Gbps transceivers for chip-to-chip serial links, avoiding parallel-pin bottlenecks across the prototyping backplane.
پیشنهادی
Broadcast Video Processing and Conversion
Broadcast video processing and format conversion make use of the EP2AGZ350HF40I2N's parallel I/O bandwidth and DSP blocks to handle SDI/HDMI ingest, up/down/cross-conversion, and color-space transforms at 4K and 8K resolutions. The 350K logic elements support multi-channel frame buffers and PIP/POP compositing, while the 6.375 Gbps transceivers provide 12G-SDI and SMPTE 2110 IP transport. The HF40 BGA's signal-integrity margin preserves eye-diagrams on long PCB traces.
پیشنهادی
High-Performance Computing Accelerator Card
The EP2AGZ350HF40I2N serves as a co-processor on HPC accelerator cards where 350K logic elements plus 6.375 Gbps transceivers implement low-latency on-board networks, memory controllers, and PCIe Gen2 host bridges. The HF40 1517-pin BGA delivers enough balls for multi-channel DDR3 with ECC, multiple QSFP+ cages, and expansion headers. Industrial temperature grade fits hyperscale-out edge nodes deployed in non-datacenter environments with wider thermal envelopes.
پیشنهادی
Industrial Machine Vision and Inspection
Industrial machine vision systems leverage the EP2AGZ350HF40I2N for high-throughput Camera Link, CoaXPress, and GigE Vision aggregation with on-FPGA preprocessing before forwarding to host processors. The 6.375 Gbps transceivers handle CoaXPress 1.1 links up to 6.25 Gbps per channel, while the 350K logic elements run Bayer demosaicing, HDR merging, and defect-detection CNN accelerators. Industrial temperature grade and lead-free build suit factory-floor deployments with strict compliance and uptime requirements.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP2AGZ350HF40I2N — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP2AGZ350HF40I3N | EP2AGZ350HF40I4N | EP2AGZ350HF40C2N | EP2AGZ350HF40C4N | EP2AGZ300HF40I2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-pin FBGA (HF40) | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 350000 | 350000 | 350000 | 350000 | 300000 |
| Speed Grade | I2 (industrial, speed grade 2) | I3 | I4 | C2 (commercial) | C4 (commercial) | I2 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
تفاوت‌های کلیدی
- Highest logic density in Arria II GZ family (در مقابلEP2AGZ300HF40I2N)
- Industrial temperature grade with lead-free build (در مقابلEP2AGZ350HF40C2N)
- Lower speed grade = better timing margin headroom (در مقابلEP2AGZ350HF40I4N)
یادداشت‌های طراحی
The EP2AGZ350HF40I2N requires multiple separate supply rails: VCCINT (core), VCCAUX (auxiliary), VCCIO (I/O banks), and VCCR/VCCT for transceiver analog supplies. Each rail must be decoupled with at least one bulk capacitor per 10 power pins and a 0.1 uF / 0.01 uF high-frequency pair adjacent to each power-ball group. Estimated total power consumption for a fully utilized 350K design with all transceivers active can exceed 15 W - derate the PCB thermal budget accordingly.
Use a high-layer-count stackup (at least 10 layers) with dedicated ground and power planes. The HF40 1 mm pitch flip-chip BGA requires microvia-in-pad or sub-75 um laser-drilled vias on inner layers to break out all signal balls without dog-bone traces that violate return-current paths. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O.
Estimated: with theta-JA of approximately 8 C/W for the HF40 flip-chip BGA and 15 W typical dissipation, the junction temperature rise above ambient is roughly 120 C - thermal management is essential. Use a heat spreader or heatsink with thermal interface material rated for industrial temperature, and ensure adequate airflow in the chassis. Industrial-grade parts (-40C to +100C ambient) still require junction temperatures to stay below 100C for long-term reliability.
Transceiver channels require matched-length routing within tight tolerances (typically within 5 mils intra-pair, 25 mils inter-pair) and clean reference planes. The HF40 BGA escape pattern must avoid crossing transceiver lanes with noisy I/O signals, and AC-coupling capacitors must be placed within 200 mils of the FPGA balls. Reference Intel's Arria II GZ Transceiver User Guide for per-protocol PHY settings.
Do not reuse configuration files generated for one speed grade (I2 vs I3/I4) on another without re-running Quartus timing analysis - the place-and-route result is speed-grade dependent. Avoid mixing the NRND EP2AGZ350HF40I2N with newer Arria 10 / Cyclone 10 parts on the same design - they require different Quartus libraries, different pinouts, and different power rails.
اطلاعات انطباق
Lead-free per 'N' suffix in order code. NRND lifecycle status as of 2026-09-08. RoHS compliant.
