EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
MPN： EP2AGZ350HF40I2N ✗ 停產EP2AGZ350HF40I2N 概覽
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient.
Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts.
Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links.
Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels.
Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA.
This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.
直接替換替代品，適用於 EP2AGZ350HF40I2N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGZ350HF40I2N （相同外形與佔位） — 差異在於 Package, RoHS Status, Speed Grade, Transceivers, Logic Elements.
EP2AGZ350HF40I3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ350HF40I4N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ350HF40C2N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ350HF40C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ350HF40C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGZ300HF40I2N
✅ 直接替換📋 參考替代品（不在目錄中）
EP2AGZ350HF40I2N 最大額定值與電氣特性
| Family | Arria II GZ |
| Logic Elements | 350000 |
| 封裝 | 1517-pin FBGA (HF40) |
| 工作溫度 | -40C to +100C (Industrial) |
| Transceivers | Embedded multi-gigabit transceivers |
| Max Transceiver Data Rate | 6.375 Gbps |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| 安裝類型 | Surface Mount (BGA) |
| AEC-Q100 | not_applicable |
EP2AGZ350HF40I2N 1517-pin fbga (hf40) 腳位配置指南
EP2AGZ350HF40I2N（1517-pin fbga (hf40) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGZ350HF40I2N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGZ350HF40I2N 適用於 7 應用s: Wireless Base Station Digital Front-End, Software Defined Radio (SDR) Platforms, Military Radar and Electronic Warfare, ASIC Prototyping and Emulation, Broadcast Video Processing and Conversion, High-Performance Computing Accelerator Card, Industrial Machine Vision and Inspection.
Wireless Base Station Digital Front-End
The EP2AGZ350HF40I2N fits wireless base-station digital front-end designs where multi-gigabit CPRI or OBSAI links and high-density signal processing are required. Its 6.375 Gbps transceivers handle CPRI Option 3 through Option 5 fronthaul, while the 350K logic elements and dedicated DSP blocks implement channel cards, crest-factor reduction, and digital predistortion. The HF40 1517-pin BGA delivers the I/O and signal-integrity margin needed for multiple SFP/SFP+ cages and parallel antenna data paths. Industrial temperature grade suits outdoor small-cell enclosures.
推薦
Software Defined Radio (SDR) Platforms
Software-defined radio platforms benefit from the EP2AGZ350HF40I2N's combination of 6.375 Gbps transceivers for ADC/DAC data capture and 350K logic elements for wideband FFTs, channelizers, and modem waveforms. The HF40 flip-chip BGA provides the signal integrity required for 12-bit+ JESD204B ADC links at multi-GSPS rates, while dedicated DSP blocks accelerate polyphase filter banks. Industrial temperature grade supports tactical and vehicular SDR chassis operating from -40C to +100C without thermal derating.
推薦
Military Radar and Electronic Warfare
The EP2AGZ350HF40I2N suits military radar and electronic-warfare platforms that demand high-density FPGA logic and ruggedized temperature operation in the same package. With 350K logic elements and 6.375 Gbps transceivers the device can ingest multi-channel phased-array data, run pulse compression, and generate arbitrary waveforms for EW jammers. The industrial temperature grade and lead-free HF40 BGA meet the long-term reliability and RoHS requirements of modern defense programs requiring ITAR-controlled supply chains.
推薦
ASIC Prototyping and Emulation
ASIC prototyping and emulation harness the EP2AGZ350HF40I2N's 350K logic-element fabric to map large ASIC RTL blocks partition-by-partition for pre-silicon software development. The HF40 1517-pin BGA exposes enough I/O to bridge to DDR3 SODIMMs, high-speed mezzanine connectors (HSMC/FMC), and PCIe Gen2 slots for host bring-up. Multi-FPGA partitioning benefits from the device's 6.375 Gbps transceivers for chip-to-chip serial links, avoiding parallel-pin bottlenecks across the prototyping backplane.
推薦
Broadcast Video Processing and Conversion
Broadcast video processing and format conversion make use of the EP2AGZ350HF40I2N's parallel I/O bandwidth and DSP blocks to handle SDI/HDMI ingest, up/down/cross-conversion, and color-space transforms at 4K and 8K resolutions. The 350K logic elements support multi-channel frame buffers and PIP/POP compositing, while the 6.375 Gbps transceivers provide 12G-SDI and SMPTE 2110 IP transport. The HF40 BGA's signal-integrity margin preserves eye-diagrams on long PCB traces.
推薦
High-Performance Computing Accelerator Card
The EP2AGZ350HF40I2N serves as a co-processor on HPC accelerator cards where 350K logic elements plus 6.375 Gbps transceivers implement low-latency on-board networks, memory controllers, and PCIe Gen2 host bridges. The HF40 1517-pin BGA delivers enough balls for multi-channel DDR3 with ECC, multiple QSFP+ cages, and expansion headers. Industrial temperature grade fits hyperscale-out edge nodes deployed in non-datacenter environments with wider thermal envelopes.
推薦
Industrial Machine Vision and Inspection
Industrial machine vision systems leverage the EP2AGZ350HF40I2N for high-throughput Camera Link, CoaXPress, and GigE Vision aggregation with on-FPGA preprocessing before forwarding to host processors. The 6.375 Gbps transceivers handle CoaXPress 1.1 links up to 6.25 Gbps per channel, while the 350K logic elements run Bayer demosaicing, HDR merging, and defect-detection CNN accelerators. Industrial temperature grade and lead-free build suit factory-floor deployments with strict compliance and uptime requirements.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGZ350HF40I2N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGZ350HF40I3N | EP2AGZ350HF40I4N | EP2AGZ350HF40C2N | EP2AGZ350HF40C4N | EP2AGZ300HF40I2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-pin FBGA (HF40) | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 350000 | 350000 | 350000 | 350000 | 300000 |
| Speed Grade | I2 (industrial, speed grade 2) | I3 | I4 | C2 (commercial) | C4 (commercial) | I2 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Highest logic density in Arria II GZ family (對比EP2AGZ300HF40I2N)
- Industrial temperature grade with lead-free build (對比EP2AGZ350HF40C2N)
- Lower speed grade = better timing margin headroom (對比EP2AGZ350HF40I4N)
設計說明
The EP2AGZ350HF40I2N requires multiple separate supply rails: VCCINT (core), VCCAUX (auxiliary), VCCIO (I/O banks), and VCCR/VCCT for transceiver analog supplies. Each rail must be decoupled with at least one bulk capacitor per 10 power pins and a 0.1 uF / 0.01 uF high-frequency pair adjacent to each power-ball group. Estimated total power consumption for a fully utilized 350K design with all transceivers active can exceed 15 W - derate the PCB thermal budget accordingly.
Use a high-layer-count stackup (at least 10 layers) with dedicated ground and power planes. The HF40 1 mm pitch flip-chip BGA requires microvia-in-pad or sub-75 um laser-drilled vias on inner layers to break out all signal balls without dog-bone traces that violate return-current paths. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O.
Estimated: with theta-JA of approximately 8 C/W for the HF40 flip-chip BGA and 15 W typical dissipation, the junction temperature rise above ambient is roughly 120 C - thermal management is essential. Use a heat spreader or heatsink with thermal interface material rated for industrial temperature, and ensure adequate airflow in the chassis. Industrial-grade parts (-40C to +100C ambient) still require junction temperatures to stay below 100C for long-term reliability.
Transceiver channels require matched-length routing within tight tolerances (typically within 5 mils intra-pair, 25 mils inter-pair) and clean reference planes. The HF40 BGA escape pattern must avoid crossing transceiver lanes with noisy I/O signals, and AC-coupling capacitors must be placed within 200 mils of the FPGA balls. Reference Intel's Arria II GZ Transceiver User Guide for per-protocol PHY settings.
Do not reuse configuration files generated for one speed grade (I2 vs I3/I4) on another without re-running Quartus timing analysis - the place-and-route result is speed-grade dependent. Avoid mixing the NRND EP2AGZ350HF40I2N with newer Arria 10 / Cyclone 10 parts on the same design - they require different Quartus libraries, different pinouts, and different power rails.
合規資訊
Lead-free per 'N' suffix in order code. NRND lifecycle status as of 2026-09-08. RoHS compliant.
