EP2AGZ350HF40I2N - 350K LE Arria II GZ FPGA, 1517-Pin FBGA | Intel
부품 번호: EP2AGZ350HF40I2N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1595 | $159,500.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP2AGZ350HF40I2N 개요
An FPGA (field-programmable gate array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and hardened peripherals that can be reconfigured by the customer after manufacture. FPGAs sit in the programmable-logic hierarchy above CPLDs and below custom silicon, providing ASIC-class performance with mask-set-free time-to-market. The Arria II GZ family specifically targets transceiver-rich applications such as wireless baseband, broadcast video, and defense signal processing where mid-range density and 6.375 Gbps transceivers are sufficient.
Key features of the EP2AGZ350HF40I2N include the 350K logic-element fabric, embedded 6.375 Gbps multi-gigabit transceivers, on-chip memory, phase-locked loops for clock management, and a high-pin-count flip-chip BGA package that supports the wide parallel and serial I/O required by the largest device in the family. The industrial temperature grade (-40C to +100C) and lead-free solder-free build make it suitable for harsher environments than commercial Arria II GZ parts.
Architecturally the device combines a logic fabric synthesized from 8-input adaptive look-up tables, embedded memory blocks, DSP blocks with 18x18 multipliers, and hardened PCIe and memory controllers. The transceiver physical media attachment layer supports multiple protocols including CPRI, OBSAI, Serial RapidIO, and 10G Ethernet MAC integration for backplane and fronthaul links.
Typical applications include wireless base-station digital front-end, software-defined radio, high-performance computing accelerators, military radar and electronic-warfare platforms, broadcast video processing, and ASIC prototyping. The HF40 1517-pin FBGA package provides the signal integrity and pin budget required for parallel data paths and multiple transceiver channels.
Designers should plan power-rail decoupling carefully; the EP2AGZ350HF40I2N draws significant transient current and requires multiple bulk and high-frequency ceramic capacitors around the periphery of the package, along with a multilayer PCB stackup dedicated to the FPGA.
This page synthesizes distributor availability, drop-in alternative Arria II GZ variants, and FPGA design considerations that are not aggregated in any single distributor listing, providing a faster path from datasheet to design review.
드롭인 대체품: EP2AGZ350HF40I2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350HF40I2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Speed Grade, Transceivers, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350HF40I3N
✅ 드롭인✓ 재고 있음
$1985 / 개
데이터시트 보기 →EP2AGZ350HF40I4N
✅ 드롭인✓ 재고 있음
$2280 / 개
데이터시트 보기 →EP2AGZ350HF40C2N
✅ 드롭인✓ 재고 있음
$2645 / 개
데이터시트 보기 →EP2AGZ350HF40C3N
✅ 드롭인✓ 재고 있음
$2150 / 개
데이터시트 보기 →EP2AGZ350HF40C4N
✅ 드롭인✓ 재고 있음
$3540 / 개
데이터시트 보기 →EP2AGZ300HF40I2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2AGZ350HF40I2N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Logic Elements | 350000 |
| 패키지 | 1517-pin FBGA (HF40) |
| 동작 온도 | -40C to +100C (Industrial) |
| Transceivers | Embedded multi-gigabit transceivers |
| Max Transceiver Data Rate | 6.375 Gbps |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 실장 유형 | Surface Mount (BGA) |
| AEC-Q100 | not_applicable |
EP2AGZ350HF40I2N 1517-pin fbga (hf40) 핀 구성 가이드
EP2AGZ350HF40I2N(1517-pin fbga (hf40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350HF40I2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350HF40I2N 적합 용도: 7 애플리케이션s: Wireless Base Station Digital Front-End, Software Defined Radio (SDR) Platforms, Military Radar and Electronic Warfare, ASIC Prototyping and Emulation, Broadcast Video Processing and Conversion, High-Performance Computing Accelerator Card, Industrial Machine Vision and Inspection.
Wireless Base Station Digital Front-End
The EP2AGZ350HF40I2N fits wireless base-station digital front-end designs where multi-gigabit CPRI or OBSAI links and high-density signal processing are required. Its 6.375 Gbps transceivers handle CPRI Option 3 through Option 5 fronthaul, while the 350K logic elements and dedicated DSP blocks implement channel cards, crest-factor reduction, and digital predistortion. The HF40 1517-pin BGA delivers the I/O and signal-integrity margin needed for multiple SFP/SFP+ cages and parallel antenna data paths. Industrial temperature grade suits outdoor small-cell enclosures.
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Software Defined Radio (SDR) Platforms
Software-defined radio platforms benefit from the EP2AGZ350HF40I2N's combination of 6.375 Gbps transceivers for ADC/DAC data capture and 350K logic elements for wideband FFTs, channelizers, and modem waveforms. The HF40 flip-chip BGA provides the signal integrity required for 12-bit+ JESD204B ADC links at multi-GSPS rates, while dedicated DSP blocks accelerate polyphase filter banks. Industrial temperature grade supports tactical and vehicular SDR chassis operating from -40C to +100C without thermal derating.
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Military Radar and Electronic Warfare
The EP2AGZ350HF40I2N suits military radar and electronic-warfare platforms that demand high-density FPGA logic and ruggedized temperature operation in the same package. With 350K logic elements and 6.375 Gbps transceivers the device can ingest multi-channel phased-array data, run pulse compression, and generate arbitrary waveforms for EW jammers. The industrial temperature grade and lead-free HF40 BGA meet the long-term reliability and RoHS requirements of modern defense programs requiring ITAR-controlled supply chains.
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ASIC Prototyping and Emulation
ASIC prototyping and emulation harness the EP2AGZ350HF40I2N's 350K logic-element fabric to map large ASIC RTL blocks partition-by-partition for pre-silicon software development. The HF40 1517-pin BGA exposes enough I/O to bridge to DDR3 SODIMMs, high-speed mezzanine connectors (HSMC/FMC), and PCIe Gen2 slots for host bring-up. Multi-FPGA partitioning benefits from the device's 6.375 Gbps transceivers for chip-to-chip serial links, avoiding parallel-pin bottlenecks across the prototyping backplane.
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Broadcast Video Processing and Conversion
Broadcast video processing and format conversion make use of the EP2AGZ350HF40I2N's parallel I/O bandwidth and DSP blocks to handle SDI/HDMI ingest, up/down/cross-conversion, and color-space transforms at 4K and 8K resolutions. The 350K logic elements support multi-channel frame buffers and PIP/POP compositing, while the 6.375 Gbps transceivers provide 12G-SDI and SMPTE 2110 IP transport. The HF40 BGA's signal-integrity margin preserves eye-diagrams on long PCB traces.
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High-Performance Computing Accelerator Card
The EP2AGZ350HF40I2N serves as a co-processor on HPC accelerator cards where 350K logic elements plus 6.375 Gbps transceivers implement low-latency on-board networks, memory controllers, and PCIe Gen2 host bridges. The HF40 1517-pin BGA delivers enough balls for multi-channel DDR3 with ECC, multiple QSFP+ cages, and expansion headers. Industrial temperature grade fits hyperscale-out edge nodes deployed in non-datacenter environments with wider thermal envelopes.
추천
Industrial Machine Vision and Inspection
Industrial machine vision systems leverage the EP2AGZ350HF40I2N for high-throughput Camera Link, CoaXPress, and GigE Vision aggregation with on-FPGA preprocessing before forwarding to host processors. The 6.375 Gbps transceivers handle CoaXPress 1.1 links up to 6.25 Gbps per channel, while the 350K logic elements run Bayer demosaicing, HDR merging, and defect-detection CNN accelerators. Industrial temperature grade and lead-free build suit factory-floor deployments with strict compliance and uptime requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350HF40I2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350HF40I3N | EP2AGZ350HF40I4N | EP2AGZ350HF40C2N | EP2AGZ350HF40C4N | EP2AGZ300HF40I2N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-pin FBGA (HF40) | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same | 1517-pin FBGA (HF40) - same |
| Family | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ | Arria II GZ |
| Logic Elements | 350000 | 350000 | 350000 | 350000 | 350000 | 300000 |
| Speed Grade | I2 (industrial, speed grade 2) | I3 | I4 | C2 (commercial) | C4 (commercial) | I2 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Highest logic density in Arria II GZ family (vs EP2AGZ300HF40I2N)
- Industrial temperature grade with lead-free build (vs EP2AGZ350HF40C2N)
- Lower speed grade = better timing margin headroom (vs EP2AGZ350HF40I4N)
설계 노트
The EP2AGZ350HF40I2N requires multiple separate supply rails: VCCINT (core), VCCAUX (auxiliary), VCCIO (I/O banks), and VCCR/VCCT for transceiver analog supplies. Each rail must be decoupled with at least one bulk capacitor per 10 power pins and a 0.1 uF / 0.01 uF high-frequency pair adjacent to each power-ball group. Estimated total power consumption for a fully utilized 350K design with all transceivers active can exceed 15 W - derate the PCB thermal budget accordingly.
Use a high-layer-count stackup (at least 10 layers) with dedicated ground and power planes. The HF40 1 mm pitch flip-chip BGA requires microvia-in-pad or sub-75 um laser-drilled vias on inner layers to break out all signal balls without dog-bone traces that violate return-current paths. Maintain 100-ohm differential impedance for transceiver pairs and 50-ohm single-ended for general-purpose I/O.
Estimated: with theta-JA of approximately 8 C/W for the HF40 flip-chip BGA and 15 W typical dissipation, the junction temperature rise above ambient is roughly 120 C - thermal management is essential. Use a heat spreader or heatsink with thermal interface material rated for industrial temperature, and ensure adequate airflow in the chassis. Industrial-grade parts (-40C to +100C ambient) still require junction temperatures to stay below 100C for long-term reliability.
Transceiver channels require matched-length routing within tight tolerances (typically within 5 mils intra-pair, 25 mils inter-pair) and clean reference planes. The HF40 BGA escape pattern must avoid crossing transceiver lanes with noisy I/O signals, and AC-coupling capacitors must be placed within 200 mils of the FPGA balls. Reference Intel's Arria II GZ Transceiver User Guide for per-protocol PHY settings.
Do not reuse configuration files generated for one speed grade (I2 vs I3/I4) on another without re-running Quartus timing analysis - the place-and-route result is speed-grade dependent. Avoid mixing the NRND EP2AGZ350HF40I2N with newer Arria 10 / Cyclone 10 parts on the same design - they require different Quartus libraries, different pinouts, and different power rails.
규정 준수 정보
Lead-free per 'N' suffix in order code. NRND lifecycle status as of 2026-09-08. RoHS compliant.
