EPM240F100C5N - 240-LE CPLD, 4.7ns, MAX II Family | Intel
MPN: EPM240F100C5N ✓ فعالEPM240F100C5N نمای کلی
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/PLA architecture with multiple logic blocks connected by a central interconnect. CPLDs sit below FPGAs in density but above simple PLDs in capability; their flash-based instant-on configuration makes them ideal for system control, I/O expansion, and bus-interface bridging where microseconds of FPGA configuration time are unacceptable. The MAX II family further reduces static power by roughly 50% versus previous-generation MAX devices through a look-up-table (LUT) array implemented on flash, eliminating external configuration memory.
Key features of the EPM240F100C5N include non-volatile flash configuration (instant-on at power-up), MultiVolt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interfaces on a per-bank basis, a 4-input LUT logic element architecture, and JTAG IEEE 1149.1 boundary-scan support. The device is supported by the Altera/Intel Quartus Prime design software, with free Quartus Prime Lite handling the full EPM240 design flow. The 100-ball FBGA package provides compact board area and excellent thermal performance for consumer, industrial, and telecommunications applications.
Typical applications include I/O expansion for microcontrollers, bus bridging between legacy 5V-tolerant peripherals and 3.3V processors, power-sequencing logic in multi-rail systems, and configurable glue-logic replacement of discrete 74-series logic. The device's instant-on behavior is particularly valued in safety and motor-control systems where firmware boot latency cannot be tolerated.
When designing, ensure VCCIO banks match the voltage of connected peripherals and that JTAG signals (TCK, TMS, TDI, TDO) are accessible for in-system programming. A 0.1uF decoupling capacitor per VCC pin is recommended by Intel reference designs. Quartus Prime software supports both Verilog HDL and VHDL with the free web-edition toolchain.
This page synthesizes distributor pricing, drop-in MAX II alternatives, and practical design guidance not consolidated in the manufacturer datasheet alone.
جایگزین‌های drop-in برای EPM240F100C5N — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EPM240F100C5N (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM240F100C4N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM240F100I5N
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM570F100C5N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM240T100C5N
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM1270F256C5N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM240F100C5N حداکثر مقادیر مجاز و مشخصات الکتریکی
| Device Family | MAX II |
| Logic Elements (LEs) | 240 |
| Macrocells | 192 |
| User I/O Pins (maximum) | 80 |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns |
| بسته‌بندی | 100-ball FineLine BGA (FBGA-100) |
| محدوده دمای کاری | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | Non-volatile flash (instant-on) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Programming Interface | JTAG / ByteBlasterMV |
| نوع نصب | Surface Mount (BGA) |
| وضعیت RoHS | Compliant |
راهنمای پیکربندی پین EPM240F100C5N 100-ball fineline bga (fbga-100)
پیکربندی پین برای EPM240F100C5N (پکیج 100-ball fineline bga (fbga-100)). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EPM240F100C5N.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EPM240F100C5N مناسب است برای 6 کاربردs: Microcontroller I/O Expansion, Legacy Bus Bridging, Power Supply Sequencing, Industrial Control Glue Logic, Consumer Electronics Display Interface, Telecom Line Card Glue Logic.
Microcontroller I/O Expansion
The EPM240F100C5N's 240 logic elements and 80 user I/O pins make it an ideal I/O expander for microcontrollers with limited GPIO counts. With 4.7 ns pin-to-pin logic delay and instant-on non-volatile flash configuration, it adds deterministic I/O expansion without boot delay or external configuration memory. The MultiVolt I/O banks allow direct interfacing with 1.5V, 1.8V, 2.5V, and 3.3V peripherals simultaneously, eliminating external level shifters. Quartus Prime Lite synthesizes combinational and sequential glue-logic in minutes, and the JTAG interface allows in-system reprogramming without removing the device from the board.
پیشنهادی
Legacy Bus Bridging
The EPM240F100C5N bridges legacy peripherals to modern processors by translating between 5V-tolerant input logic and 3.3V output banks via the MultiVolt I/O architecture. With 192 macrocells, it implements glue-logic state machines, address decoding, and wait-state generators between legacy ISA-style buses and modern ARM or RISC-V host processors. The 4.7 ns tPD supports synchronous bus operation up to approximately 200 MHz internal clock rates, while deterministic timing simplifies board-level timing closure versus FPGA-based bridges. JTAG reconfiguration allows field firmware updates without board removal.
پیشنهادی
Power Supply Sequencing
The EPM240F100C5N implements multi-rail power-up and power-down sequencing in telecom, server, and industrial systems where specific voltage rails must come up in a defined order. Its instant-on non-volatile flash configuration executes the sequencing logic within microseconds of VCCINT reaching regulation, earlier than any microcontroller could boot, ensuring deterministic rail ordering. The 80 user I/O pins can monitor PG (power-good) signals from each regulator and drive ENABLE pins of downstream rails, while JTAG allows in-system reprogramming of the sequencing pattern during board bring-up.
پیشنهادی
Industrial Control Glue Logic
In industrial PLC, motor-control, and sensor-interface boards, the EPM240F100C5N replaces dozens of discrete 74HC-series logic gates with a single programmable device that fits in a 100-ball FineLine BGA. The 4.7 ns tPD supports high-speed encoder inputs, PWM modulation, and safety-interlock logic, while the 0C to +85C commercial temperature range covers most factory-floor environments. For harsher settings, the EPM240F100I5N variant extends the range to -40C to +100C with identical pinout. Quartus Prime Lite's free toolchain keeps NRE costs minimal for low-volume industrial designs.
پیشنهادی
Consumer Electronics Display Interface
The EPM240F100C5N generates display timing, color-space conversion, and backlight control signals in LCD, OLED, and projector applications. Its MultiVolt I/O banks drive both 1.8V panel timing logic and 3.3V backlight drivers from a single device, eliminating level-shifter ICs. The non-volatile instant-on configuration starts the display within microseconds of system power-up, improving the user-perceived responsiveness versus FPGA-based solutions that require external configuration flash. JTAG allows field firmware updates for new display panels without board respins.
پیشنهادی
Telecom Line Card Glue Logic
The EPM240F100C5N handles line-card housekeeping functions in telecommunications equipment, including alarm aggregation, LED status driving, clock muxing, and JTAG scan-chain management. Its deterministic timing simplifies board-level timing closure for synchronous telecom buses, while the 100-ball FBGA package provides excellent thermal performance for densely populated line cards. With 240 LEs and 192 macrocells, it implements complete state machines for line-interface card reset and provisioning logic.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EPM240F100C5N — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EPM240F100C4N | EPM240F100I5N | EPM570F100C5N | EPM1270F256C5N |
|---|---|---|---|---|---|
| Package | 100-ball FineLine BGA (FBGA-100) | 100-ball FBGA - same | 100-ball FBGA - same | 100-ball FBGA - same | 256-ball FBGA - larger |
| Brand | Intel | Intel - same | Intel - same | Intel - same | |
| Logic Elements | 240 | 240 | 570 (+138%) | 1270 (+429%) | |
| Macrocells | 192 | 192 | 440 | 980 | |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | 5.4 ns (slower) | 6.2 ns (slower) | |
| User I/O Pins | 80 | 80 | 76 | 212 | |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | |
| Unit Price (qty 1, USD) | $8.08 | $8.50 (typical) | $11.20 (typical) | $22.50 (typical) | |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) |
تفاوت‌های کلیدی
- Lowest-cost 240-LE CPLD with instant-on flash configuration (در مقابلGeneric FPGA-based solutions)
- Industrial-temperature drop-in available in same footprint (در مقابلEPM240F100C4N (industrial variant))
- Upward migration to higher density without package change (در مقابلEPM570F100C5N (570 LEs))
- MultiVolt I/O banks eliminate external level shifters (در مقابلDiscrete 74-series glue logic)
یادداشت‌های طراحی
Decouple each VCCINT (3.3V core) pin with a 0.1uF ceramic capacitor placed within 5 mm of the package, plus a single 10uF bulk capacitor on the 3.3V rail. Each VCCIO bank requires its own 0.1uF decoupling per bank; bank voltages may differ (1.5V, 1.8V, 2.5V, or 3.3V) and must be properly bypassed. Estimated: at 100 MHz toggle rate and 50% LE utilization, the EPM240F100C5N typically draws 30-50 mA from VCCINT and bank-dependent current from VCCIO - budget 300 mW total power supply capacity for typical designs.
Route JTAG signals TCK, TMS, TDI, TDO with 50-ohm controlled impedance and keep total length below 150 mm for reliable ByteBlasterMV programming. Provide a JTAG header or test pad accessible in-system for firmware updates. For the 100-ball FineLine BGA, use microvia PCB technology with 0.4 mm ball pitch to simplify breakout routing; alternatively, a 4-layer PCB with continuous ground plane under the BGA provides excellent thermal dissipation and EMI suppression. Keep high-speed signals on adjacent layers to a minimum and avoid routing signals through BGA interior layers without ground references.
Configure each I/O bank VCCIO to match the connected peripheral voltage (1.5V, 1.8V, 2.5V, or 3.3V); mixing voltages within a single bank is not allowed. User I/O inputs are 5V tolerant when the bank VCCIO is 3.3V per Intel MAX II device handbook - this allows direct interfacing with 5V CMOS peripherals without external level shifters. For high-speed outputs above 50 MHz, use the slew-rate-limited I/O setting to reduce EMI; for slower control signals, full-slew-rate provides faster edge transitions. Source-series termination (22-33 ohms) on outputs above 30 MHz reduces reflections on long traces.
Common design pitfalls include: (1) leaving unused JTAG pins floating - tie TCK to GND through 10k and TMS/TDI to VCCIO through 10k for predictable JTAG behavior; (2) forgetting that the EPM240F100C5N's instant-on configuration begins executing before system reset is deasserted - design power-sequencing state machines to handle this correctly; (3) specifying the EPM240F100C5N for industrial applications - use EPM240F100I5N instead for the -40C to +100C industrial temperature range; (4) exceeding the maximum toggle rate - the 4.7 ns tPD implies internal toggle frequencies up to approximately 200 MHz, but practical designs should target 50-100 MHz for reliable timing closure.
اطلاعات انطباق
RoHS and lead-free compliant per Intel MAX II product environmental compliance documentation. Not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade CPLD portfolio. REACH SVHC compliance confirmed by Intel Material Declaration Data Sheets (MDDS).
