EPM240F100C5N - 240-LE CPLD, 4.7ns, MAX II Family | Intel
MPN: EPM240F100C5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.0751 | $8.08 |
| 10 | $7.26 | $72.60 |
| 100 | $6.5 | $650.00 |
| 500 | $5.75 | $2,875.00 |
| 1,000 | $5.2 | $5,200.00 |
Drop-in alternatives for EPM240F100C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM240F100C4N
✅ Drop-In✓ In Stock
$7.05 / Unit
View Datasheet →EPM240F100I5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.2 / Unit
View Datasheet →EPM570F100C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM240T100C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$4.32 / Unit
View Datasheet →EPM1270F256C5N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPM240F100C5N Maximum Ratings & Electrical Characteristics
| Device Family | MAX II |
| Logic Elements (LEs) | 240 |
| Macrocells | 192 |
| User I/O Pins (maximum) | 80 |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns |
| Package | 100-ball FineLine BGA (FBGA-100) |
| Operating Temperature Range | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | Non-volatile flash (instant-on) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Programming Interface | JTAG / ByteBlasterMV |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
EPM240F100C5N 100-ball fineline bga (fbga-100) Pin Configuration Guide
Complete pinout information for EPM240F100C5N (100-ball fineline bga (fbga-100) package) with 80 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM240F100C5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 80 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM240F100C5N is suitable for 6 applications: Microcontroller I/O Expansion, Legacy Bus Bridging, Power Supply Sequencing, Industrial Control Glue Logic, Consumer Electronics Display Interface, Telecom Line Card Glue Logic.
Microcontroller I/O Expansion
The EPM240F100C5N's 240 logic elements and 80 user I/O pins make it an ideal I/O expander for microcontrollers with limited GPIO counts. With 4.7 ns pin-to-pin logic delay and instant-on non-volatile flash configuration, it adds deterministic I/O expansion without boot delay or external configuration memory. The MultiVolt I/O banks allow direct interfacing with 1.5V, 1.8V, 2.5V, and 3.3V peripherals simultaneously, eliminating external level shifters. Quartus Prime Lite synthesizes combinational and sequential glue-logic in minutes, and the JTAG interface allows in-system reprogramming without removing the device from the board.
Recommended
Legacy Bus Bridging
The EPM240F100C5N bridges legacy peripherals to modern processors by translating between 5V-tolerant input logic and 3.3V output banks via the MultiVolt I/O architecture. With 192 macrocells, it implements glue-logic state machines, address decoding, and wait-state generators between legacy ISA-style buses and modern ARM or RISC-V host processors. The 4.7 ns tPD supports synchronous bus operation up to approximately 200 MHz internal clock rates, while deterministic timing simplifies board-level timing closure versus FPGA-based bridges. JTAG reconfiguration allows field firmware updates without board removal.
Recommended
Power Supply Sequencing
The EPM240F100C5N implements multi-rail power-up and power-down sequencing in telecom, server, and industrial systems where specific voltage rails must come up in a defined order. Its instant-on non-volatile flash configuration executes the sequencing logic within microseconds of VCCINT reaching regulation, earlier than any microcontroller could boot, ensuring deterministic rail ordering. The 80 user I/O pins can monitor PG (power-good) signals from each regulator and drive ENABLE pins of downstream rails, while JTAG allows in-system reprogramming of the sequencing pattern during board bring-up.
Recommended
Industrial Control Glue Logic
In industrial PLC, motor-control, and sensor-interface boards, the EPM240F100C5N replaces dozens of discrete 74HC-series logic gates with a single programmable device that fits in a 100-ball FineLine BGA. The 4.7 ns tPD supports high-speed encoder inputs, PWM modulation, and safety-interlock logic, while the 0C to +85C commercial temperature range covers most factory-floor environments. For harsher settings, the EPM240F100I5N variant extends the range to -40C to +100C with identical pinout. Quartus Prime Lite's free toolchain keeps NRE costs minimal for low-volume industrial designs.
Recommended
Consumer Electronics Display Interface
The EPM240F100C5N generates display timing, color-space conversion, and backlight control signals in LCD, OLED, and projector applications. Its MultiVolt I/O banks drive both 1.8V panel timing logic and 3.3V backlight drivers from a single device, eliminating level-shifter ICs. The non-volatile instant-on configuration starts the display within microseconds of system power-up, improving the user-perceived responsiveness versus FPGA-based solutions that require external configuration flash. JTAG allows field firmware updates for new display panels without board respins.
Recommended
Telecom Line Card Glue Logic
The EPM240F100C5N handles line-card housekeeping functions in telecommunications equipment, including alarm aggregation, LED status driving, clock muxing, and JTAG scan-chain management. Its deterministic timing simplifies board-level timing closure for synchronous telecom buses, while the 100-ball FBGA package provides excellent thermal performance for densely populated line cards. With 240 LEs and 192 macrocells, it implements complete state machines for line-interface card reset and provisioning logic.
Recommended
Recommended Products Summary
Engineering reference data for EPM240F100C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM240F100C4N | EPM240F100I5N | EPM570F100C5N | EPM1270F256C5N |
|---|---|---|---|---|---|
| Package | 100-ball FineLine BGA (FBGA-100) | 100-ball FBGA - same | 100-ball FBGA - same | 100-ball FBGA - same | 256-ball FBGA - larger |
| Brand | Intel | Intel - same | Intel - same | Intel - same | |
| Logic Elements | 240 | 240 | 570 (+138%) | 1270 (+429%) | |
| Macrocells | 192 | 192 | 440 | 980 | |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | 5.4 ns (slower) | 6.2 ns (slower) | |
| User I/O Pins | 80 | 80 | 76 | 212 | |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | |
| Unit Price (qty 1, USD) | $8.08 | $8.50 (typical) | $11.20 (typical) | $22.50 (typical) | |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) |
Key Differentiators
- Lowest-cost 240-LE CPLD with instant-on flash configuration (vs Generic FPGA-based solutions)
- Industrial-temperature drop-in available in same footprint (vs EPM240F100C4N (industrial variant))
- Upward migration to higher density without package change (vs EPM570F100C5N (570 LEs))
- MultiVolt I/O banks eliminate external level shifters (vs Discrete 74-series glue logic)
Design Notes
Decouple each VCCINT (3.3V core) pin with a 0.1uF ceramic capacitor placed within 5 mm of the package, plus a single 10uF bulk capacitor on the 3.3V rail. Each VCCIO bank requires its own 0.1uF decoupling per bank; bank voltages may differ (1.5V, 1.8V, 2.5V, or 3.3V) and must be properly bypassed. Estimated: at 100 MHz toggle rate and 50% LE utilization, the EPM240F100C5N typically draws 30-50 mA from VCCINT and bank-dependent current from VCCIO - budget 300 mW total power supply capacity for typical designs.
Route JTAG signals TCK, TMS, TDI, TDO with 50-ohm controlled impedance and keep total length below 150 mm for reliable ByteBlasterMV programming. Provide a JTAG header or test pad accessible in-system for firmware updates. For the 100-ball FineLine BGA, use microvia PCB technology with 0.4 mm ball pitch to simplify breakout routing; alternatively, a 4-layer PCB with continuous ground plane under the BGA provides excellent thermal dissipation and EMI suppression. Keep high-speed signals on adjacent layers to a minimum and avoid routing signals through BGA interior layers without ground references.
Configure each I/O bank VCCIO to match the connected peripheral voltage (1.5V, 1.8V, 2.5V, or 3.3V); mixing voltages within a single bank is not allowed. User I/O inputs are 5V tolerant when the bank VCCIO is 3.3V per Intel MAX II device handbook - this allows direct interfacing with 5V CMOS peripherals without external level shifters. For high-speed outputs above 50 MHz, use the slew-rate-limited I/O setting to reduce EMI; for slower control signals, full-slew-rate provides faster edge transitions. Source-series termination (22-33 ohms) on outputs above 30 MHz reduces reflections on long traces.
Common design pitfalls include: (1) leaving unused JTAG pins floating - tie TCK to GND through 10k and TMS/TDI to VCCIO through 10k for predictable JTAG behavior; (2) forgetting that the EPM240F100C5N's instant-on configuration begins executing before system reset is deasserted - design power-sequencing state machines to handle this correctly; (3) specifying the EPM240F100C5N for industrial applications - use EPM240F100I5N instead for the -40C to +100C industrial temperature range; (4) exceeding the maximum toggle rate - the 4.7 ns tPD implies internal toggle frequencies up to approximately 200 MHz, but practical designs should target 50-100 MHz for reliable timing closure.
Compliance Information
RoHS and lead-free compliant per Intel MAX II product environmental compliance documentation. Not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade CPLD portfolio. REACH SVHC compliance confirmed by Intel Material Declaration Data Sheets (MDDS).
