EPM240F100C5N - 240-LE CPLD, 4.7ns, MAX II Family | Intel
MPN： EPM240F100C5N ✓ 啟用中EPM240F100C5N 概覽
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the deterministic timing of PAL/PLA architecture with multiple logic blocks connected by a central interconnect. CPLDs sit below FPGAs in density but above simple PLDs in capability; their flash-based instant-on configuration makes them ideal for system control, I/O expansion, and bus-interface bridging where microseconds of FPGA configuration time are unacceptable. The MAX II family further reduces static power by roughly 50% versus previous-generation MAX devices through a look-up-table (LUT) array implemented on flash, eliminating external configuration memory.
Key features of the EPM240F100C5N include non-volatile flash configuration (instant-on at power-up), MultiVolt I/O supporting 1.5V, 1.8V, 2.5V, and 3.3V interfaces on a per-bank basis, a 4-input LUT logic element architecture, and JTAG IEEE 1149.1 boundary-scan support. The device is supported by the Altera/Intel Quartus Prime design software, with free Quartus Prime Lite handling the full EPM240 design flow. The 100-ball FBGA package provides compact board area and excellent thermal performance for consumer, industrial, and telecommunications applications.
Typical applications include I/O expansion for microcontrollers, bus bridging between legacy 5V-tolerant peripherals and 3.3V processors, power-sequencing logic in multi-rail systems, and configurable glue-logic replacement of discrete 74-series logic. The device's instant-on behavior is particularly valued in safety and motor-control systems where firmware boot latency cannot be tolerated.
When designing, ensure VCCIO banks match the voltage of connected peripherals and that JTAG signals (TCK, TMS, TDI, TDO) are accessible for in-system programming. A 0.1uF decoupling capacitor per VCC pin is recommended by Intel reference designs. Quartus Prime software supports both Verilog HDL and VHDL with the free web-edition toolchain.
This page synthesizes distributor pricing, drop-in MAX II alternatives, and practical design guidance not consolidated in the manufacturer datasheet alone.
直接替換替代品，適用於 EPM240F100C5N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPM240F100C5N （相同外形與佔位） — 差異在於 Package, Process Technology, Operating Temperature, Programming Interface, Configuration Memory.
EPM240F100C4N
✅ 直接替換聯絡詢價
查看資料表 →EPM240F100I5N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPM570F100C5N
✅ 直接替換聯絡詢價
查看資料表 →EPM240T100C5N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EPM1270F256C5N
✅ 直接替換✗ 缺貨
$16.2 / 單位
查看資料表 →EPM240F100C5N 最大額定值與電氣特性
| Device Family | MAX II |
| Logic Elements (LEs) | 240 |
| Macrocells | 192 |
| User I/O Pins (maximum) | 80 |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns |
| 封裝 | 100-ball FineLine BGA (FBGA-100) |
| 工作溫度範圍 | 0C to +85C (commercial) |
| Supply Voltage Core (VCCINT) | 3.3 V |
| I/O Bank Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (MultiVolt) |
| Configuration Memory | Non-volatile flash (instant-on) |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Programming Interface | JTAG / ByteBlasterMV |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
EPM240F100C5N 100-ball fineline bga (fbga-100) 腳位配置指南
EPM240F100C5N（100-ball fineline bga (fbga-100) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPM240F100C5N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPM240F100C5N 適用於 6 應用s: Microcontroller I/O Expansion, Legacy Bus Bridging, Power Supply Sequencing, Industrial Control Glue Logic, Consumer Electronics Display Interface, Telecom Line Card Glue Logic.
Microcontroller I/O Expansion
The EPM240F100C5N's 240 logic elements and 80 user I/O pins make it an ideal I/O expander for microcontrollers with limited GPIO counts. With 4.7 ns pin-to-pin logic delay and instant-on non-volatile flash configuration, it adds deterministic I/O expansion without boot delay or external configuration memory. The MultiVolt I/O banks allow direct interfacing with 1.5V, 1.8V, 2.5V, and 3.3V peripherals simultaneously, eliminating external level shifters. Quartus Prime Lite synthesizes combinational and sequential glue-logic in minutes, and the JTAG interface allows in-system reprogramming without removing the device from the board.
推薦
Legacy Bus Bridging
The EPM240F100C5N bridges legacy peripherals to modern processors by translating between 5V-tolerant input logic and 3.3V output banks via the MultiVolt I/O architecture. With 192 macrocells, it implements glue-logic state machines, address decoding, and wait-state generators between legacy ISA-style buses and modern ARM or RISC-V host processors. The 4.7 ns tPD supports synchronous bus operation up to approximately 200 MHz internal clock rates, while deterministic timing simplifies board-level timing closure versus FPGA-based bridges. JTAG reconfiguration allows field firmware updates without board removal.
推薦
Power Supply Sequencing
The EPM240F100C5N implements multi-rail power-up and power-down sequencing in telecom, server, and industrial systems where specific voltage rails must come up in a defined order. Its instant-on non-volatile flash configuration executes the sequencing logic within microseconds of VCCINT reaching regulation, earlier than any microcontroller could boot, ensuring deterministic rail ordering. The 80 user I/O pins can monitor PG (power-good) signals from each regulator and drive ENABLE pins of downstream rails, while JTAG allows in-system reprogramming of the sequencing pattern during board bring-up.
推薦
Industrial Control Glue Logic
In industrial PLC, motor-control, and sensor-interface boards, the EPM240F100C5N replaces dozens of discrete 74HC-series logic gates with a single programmable device that fits in a 100-ball FineLine BGA. The 4.7 ns tPD supports high-speed encoder inputs, PWM modulation, and safety-interlock logic, while the 0C to +85C commercial temperature range covers most factory-floor environments. For harsher settings, the EPM240F100I5N variant extends the range to -40C to +100C with identical pinout. Quartus Prime Lite's free toolchain keeps NRE costs minimal for low-volume industrial designs.
推薦
Consumer Electronics Display Interface
The EPM240F100C5N generates display timing, color-space conversion, and backlight control signals in LCD, OLED, and projector applications. Its MultiVolt I/O banks drive both 1.8V panel timing logic and 3.3V backlight drivers from a single device, eliminating level-shifter ICs. The non-volatile instant-on configuration starts the display within microseconds of system power-up, improving the user-perceived responsiveness versus FPGA-based solutions that require external configuration flash. JTAG allows field firmware updates for new display panels without board respins.
推薦
Telecom Line Card Glue Logic
The EPM240F100C5N handles line-card housekeeping functions in telecommunications equipment, including alarm aggregation, LED status driving, clock muxing, and JTAG scan-chain management. Its deterministic timing simplifies board-level timing closure for synchronous telecom buses, while the 100-ball FBGA package provides excellent thermal performance for densely populated line cards. With 240 LEs and 192 macrocells, it implements complete state machines for line-interface card reset and provisioning logic.
推薦
推薦產品摘要
工程參考資料，適用於 EPM240F100C5N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPM240F100C4N | EPM240F100I5N | EPM570F100C5N | EPM1270F256C5N |
|---|---|---|---|---|---|
| Package | 100-ball FineLine BGA (FBGA-100) | 100-ball FBGA - same | 100-ball FBGA - same | 100-ball FBGA - same | 256-ball FBGA - larger |
| Brand | Intel | Intel - same | Intel - same | Intel - same | |
| Logic Elements | 240 | 240 | 570 (+138%) | 1270 (+429%) | |
| Macrocells | 192 | 192 | 440 | 980 | |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | 5.4 ns (slower) | 6.2 ns (slower) | |
| User I/O Pins | 80 | 80 | 76 | 212 | |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | |
| Unit Price (qty 1, USD) | $8.08 | $8.50 (typical) | $11.20 (typical) | $22.50 (typical) | |
| Configuration Memory | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) | Non-volatile flash (instant-on) |
主要差異化特點
- Lowest-cost 240-LE CPLD with instant-on flash configuration (對比Generic FPGA-based solutions)
- Industrial-temperature drop-in available in same footprint (對比EPM240F100C4N (industrial variant))
- Upward migration to higher density without package change (對比EPM570F100C5N (570 LEs))
- MultiVolt I/O banks eliminate external level shifters (對比Discrete 74-series glue logic)
設計說明
Decouple each VCCINT (3.3V core) pin with a 0.1uF ceramic capacitor placed within 5 mm of the package, plus a single 10uF bulk capacitor on the 3.3V rail. Each VCCIO bank requires its own 0.1uF decoupling per bank; bank voltages may differ (1.5V, 1.8V, 2.5V, or 3.3V) and must be properly bypassed. Estimated: at 100 MHz toggle rate and 50% LE utilization, the EPM240F100C5N typically draws 30-50 mA from VCCINT and bank-dependent current from VCCIO - budget 300 mW total power supply capacity for typical designs.
Route JTAG signals TCK, TMS, TDI, TDO with 50-ohm controlled impedance and keep total length below 150 mm for reliable ByteBlasterMV programming. Provide a JTAG header or test pad accessible in-system for firmware updates. For the 100-ball FineLine BGA, use microvia PCB technology with 0.4 mm ball pitch to simplify breakout routing; alternatively, a 4-layer PCB with continuous ground plane under the BGA provides excellent thermal dissipation and EMI suppression. Keep high-speed signals on adjacent layers to a minimum and avoid routing signals through BGA interior layers without ground references.
Configure each I/O bank VCCIO to match the connected peripheral voltage (1.5V, 1.8V, 2.5V, or 3.3V); mixing voltages within a single bank is not allowed. User I/O inputs are 5V tolerant when the bank VCCIO is 3.3V per Intel MAX II device handbook - this allows direct interfacing with 5V CMOS peripherals without external level shifters. For high-speed outputs above 50 MHz, use the slew-rate-limited I/O setting to reduce EMI; for slower control signals, full-slew-rate provides faster edge transitions. Source-series termination (22-33 ohms) on outputs above 30 MHz reduces reflections on long traces.
Common design pitfalls include: (1) leaving unused JTAG pins floating - tie TCK to GND through 10k and TMS/TDI to VCCIO through 10k for predictable JTAG behavior; (2) forgetting that the EPM240F100C5N's instant-on configuration begins executing before system reset is deasserted - design power-sequencing state machines to handle this correctly; (3) specifying the EPM240F100C5N for industrial applications - use EPM240F100I5N instead for the -40C to +100C industrial temperature range; (4) exceeding the maximum toggle rate - the 4.7 ns tPD implies internal toggle frequencies up to approximately 200 MHz, but practical designs should target 50-100 MHz for reliable timing closure.
合規資訊
RoHS and lead-free compliant per Intel MAX II product environmental compliance documentation. Not AEC-Q100 qualified; for automotive applications consult Intel automotive-grade CPLD portfolio. REACH SVHC compliance confirmed by Intel Material Declaration Data Sheets (MDDS).
