EPM7256AEFI100-7 - MAX 7000A CPLD, 256 Macrocells | Intel / Altera
MPN: EPM7256AEFI100-7 ✗ پایان تولیدEPM7256AEFI100-7 نمای کلی
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like logic blocks on a single chip with a programmable interconnect matrix. In the broader taxonomy, a CPLD sits between a small FPGA and a discrete gate array: it provides deterministic, propagation-delay-based timing (often called "PAL-like" timing) with instant-on, flash- or EPROM-backed configuration. Designers typically use a CPLD when the design is dominated by wide combinational logic, decoders, and registered I/O - exactly the use cases the MAX 7000A family was designed for.
The EPM7256AEFI100-7 features 256 macrocells organized in logic array blocks (LABs), each containing 16 macrocells, with a programmable interconnect array (PIA) routing signals between LABs and to the I/O pins. The device supports JTAG-based IEEE 1149.1 boundary-scan test and in-system programmability through Altera's legacy programming tools (MAX+PLUS II or Quartus II). MultiVolt I/O supports interfacing to 2.5 V, 3.3 V, and 5.0 V logic families without external level shifters, which is critical when bridging legacy 5 V peripherals to modern 3.3 V processors.
Typical applications include PCI/ISA bus address decoding and chip-select generation, asynchronous state machines for industrial controllers, I/O expansion and level translation between 5 V and 3.3 V domains, and configuration/reset sequencing for microprocessors and DSPs. The 100-ball FBGA package provides high board-density routing for designs that need all 84 I/O on a small PCB footprint.
When designing with this part, ensure the JTAG chain order matches the BSDL file order in the Altera documentation. Decoupling must use 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each supply ball. Quiescent current for the MAX 7000A family is in the tens of milliamps; thermal dissipation is usually not a concern at typical clock rates, but junction temperature must stay within the -40 C to +85 C industrial range.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical glue-logic design notes that are not aggregated in a single place in the manufacturer datasheet, helping procurement and design engineers evaluate the EPM7256AEFI100-7 against modern and legacy substitutes.
جایگزین‌های drop-in برای EPM7256AEFI100-7 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EPM7256AEFI100-7 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Programmability, RoHS Status, Operating Temperature, Mounting Type.
EPM7256AEFI100-7N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EPM7256AEFC100-7N
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
EPM7256AEFC100-7
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM7256AEFI100-7
✅ جایگزین مستقیم ⚠️ مشخصات تأییدنشدهبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM7256AEFC100-10N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM7256AEFC256-5N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EPM7256AEFI100-7 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Logic Family | MAX 7000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 256 |
| Number of Usable Gates | 5K |
| Number of User I/O | 84 |
| Pin-to-Pin Delay (Speed Grade) | 7.5 ns |
| Maximum Operating Frequency | 126.6 MHz |
| Core Supply Voltage | 3.3 V |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5.0 V |
| Programmability | In-system programmable (ISP) via JTAG |
| بسته‌بندی | 100-ball FBGA (FineLine BGA), 11x11 mm |
| Operating Temperature Range (Industrial) | -40 C to +85 C |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| نوع نصب | Surface Mount |
| وضعیت RoHS | Not Compliant (per Arrow listing) |
راهنمای پیکربندی پین EPM7256AEFI100-7 100-ball fbga (fineline bga), 11x11 mm
پیکربندی پین برای EPM7256AEFI100-7 (پکیج 100-ball fbga (fineline bga), 11x11 mm). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای EPM7256AEFI100-7.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
EPM7256AEFI100-7 مناسب است برای 6 کاربردs: PCI/ISA Bus Address Decoding, Industrial Glue Logic and I/O Expansion, Microprocessor Reset and Configuration Sequencing, 5V to 3.3V Level Translation Bridge, Telecom Backplane Switch and Router Glue Logic, Legacy Embedded System Sustainment.
PCI/ISA Bus Address Decoding
The EPM7256AEFI100-7 is a strong fit for PCI and ISA address decoding and chip-select generation, where 256 macrocells provide ample logic for wide address comparators and the 7.5 ns pin-to-pin delay ensures decoder outputs settle within one PCI clock cycle at 33 MHz. Its MultiVolt I/O supports bridging 5 V ISA peripherals to 3.3 V PCI buses without external level shifters. Designers typically use 64-128 macrocells for the decoder, leaving headroom for chip-select gating and bus-arbitration logic. The 84 user I/O accommodate address, data-direction, and interrupt-routing signals without bus multiplexing.
پیشنهادی
Industrial Glue Logic and I/O Expansion
In industrial controllers and factory-automation PLCs, the EPM7256AEFI100-7 serves as a deterministic glue-logic hub, replacing dozens of 74-series TTL gates with a single in-system-programmable device. The 5K usable gates and 256 macrocells handle wide combinational decode, registered I/O, and asynchronous state machines for motor-control sequencing. The industrial -40 C to +85 C temperature range is required for factory-floor environments. The JTAG-based ISP allows firmware updates without removing the device from the board, useful for late-stage design changes.
پیشنهادی
Microprocessor Reset and Configuration Sequencing
The EPM7256AEFI100-7 is widely used to sequence power-up and reset behavior for multi-rail microprocessor and DSP systems, where deterministic timing prevents latch-up and bus contention. With 256 macrocells it can manage 8-12 supply rails with adjustable delay chains (implemented via LCELL primitives) and watchdog timer logic. The 7.5 ns propagation delay supports fast power-good response. JTAG boundary-scan enables board-level continuity test, critical for high-density BGA boards where traditional bed-of-nails testing is impractical.
پیشنهادی
5V to 3.3V Level Translation Bridge
The MultiVolt I/O on the EPM7256AEFI100-7 allows direct interfacing between 5 V legacy peripherals and 3.3 V modern ASICs or processors without external level-shifters. The device can buffer and translate dozens of signals in both directions across its 84 user I/O, replacing discrete bus-switch ICs and saving board area. With 256 macrocells, designers can implement translation plus protocol adaptation (for example, 8-bit parallel to 16-bit parallel) in a single chip. The 100-ball FBGA package fits densely on compact interface boards.
پیشنهادی
Telecom Backplane Switch and Router Glue Logic
In telecom backplanes and switch fabrics, the EPM7256AEFI100-7 provides deterministic glue logic for high-speed serial interfaces, I2C/SPI management buses, and PHY reset coordination. The 126.6 MHz maximum frequency and 7.5 ns delay support fast backplane Ethernet (FE/GE) management paths where timing margins are tight. 256 macrocells are sufficient for complex state machines managing hot-swap insertion, LED indicators, and interrupt routing across multiple line cards. The industrial temperature range suits central-office and outdoor-cabinet deployments.
پیشنهادی
Legacy Embedded System Sustainment
The EPM7256AEFI100-7 is in active use as a sustainment part for legacy VMEbus, cPCI, and proprietary embedded systems where the original MAX 7000A design cannot be changed due to certification or qualification cost. The 100-ball FBGA footprint matches existing board artwork, and the 7.5 ns timing preserves bus-protocol compliance. Intel has marked the family NRND with an estimated 2024 EOL, so remaining inventory is being consumed for field replacements. Designers maintaining long-life industrial, defense, or aerospace systems rely on this part for repairs and small-batch production.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EPM7256AEFI100-7 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EPM7256AEFI100-7N | EPM7256AEFC100-7N | EPM7256AEFC100-7 | EPM7256AEFC100-10N | EPM7256AEFC256-5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 100-ball FBGA (11x11 mm) | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| Usable Gates | 5K | 5K | 5K | 5K | 5K | 5K |
| User I/O | 84 | 84 | 84 | 84 | 84 | 84 |
| Pin-to-Pin Delay (Speed Grade) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 10 ns (slower) | 5 ns (faster) |
| Temperature Grade | Industrial (-40 C to +85 C) | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) |
| Lead-Free Finish ("N" suffix) | No (SnPb or unspecified) | Yes | Yes | No | Yes | Yes |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
تفاوت‌های کلیدی
- Drop-in same-FBGA replacement with RoHS lead-free finish (در مقابلEPM7256AEFI100-7N)
- Faster speed grade available in same package (در مقابلEPM7256AEFC256-5N)
- Same 100-FBGA footprint across commercial and industrial variants (در مقابلEPM7256AEFC100-7)
یادداشت‌های طراحی
The EPM7256AEFI100-7 requires a clean 3.3 V core supply with bulk-decoupling of 10-100 uF tantalum plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCC ball. During in-system programming via JTAG, the device draws higher transient currents; budget the regulator for at least 1.5x the typical ICC specification. Use a separate analog ground island if the board mixes switching converters with the CPLD to avoid ground-bounce coupling into JTAG programming pins.
The 100-ball FBGA requires 0.8 mm pitch routing on the PCB. Use 4-layer stack-up with continuous ground plane beneath the BGA to provide both reference plane and thermal spreading. Vias-in-pad are strongly recommended for inner-row balls to escape routing on dense boards. Solder-paste stencil aperture reduction of 5-10% on inner balls prevents solder-ball bridging during reflow. Bake-and-dry-pack handling is required if the part has been out of sealed bag more than 168 hours.
Estimated: With 84 simultaneously-switching outputs at 5 V MultiVolt I/O into 50 pF loads, expect ground-bounce spikes in the 1-2 ns range; derate system timing budgets accordingly. Do not leave JTAG TCK floating during normal operation - tie to GND through 10 kohm to prevent spurious device programming. The MAX 7000A ISP algorithm requires specific VCC ramp-up timing; consult the manufacturer datasheet for power-up sequencing if multiple devices share the JTAG chain.
Series-terminate high-speed outputs (those toggling above 50 MHz) with 33-ohm resistors placed within 10 mm of the FBGA ball to dampen reflections on long traces. The 7.5 ns propagation delay assumes a 50 pF load; for heavily loaded buses, plan for additional delay through LCELL chains. Keep clock and JTAG signals away from I/O banks driving switching converters or relays.
اطلاعات انطباق
RoHS not compliant per Arrow product listing; for RoHS-compliant assembly choose EPM7256AEFI100-7N (lead-free variant). AEC-Q100 not applicable for industrial-temperature CPLD. REACH, halogen-free, and conflict-minerals status not stated in distributor data.
