EPM7256AEFI100-7 - MAX 7000A CPLD, 256 Macrocells | Intel / Altera
MPN: EPM7256AEFI100-7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $139.28 | $139.28 |
| 10 | $125.3 | $1,253.00 |
| 100 | $98.5 | $9,850.00 |
| 500 | $78.2 | $39,100.00 |
| 1,000 | $65.4 | $65,400.00 |
Drop-in alternatives for EPM7256AEFI100-7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM7256AEFI100-7N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7256AEFC100-7N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7256AEFC100-7
✅ Drop-In✓ In Stock
$15.2 / Unit
View Datasheet →EPM7256AEFI100-7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65.4 / Unit
View Datasheet →EPM7256AEFC100-10N
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$24.5 / Unit
View Datasheet →EPM7256AEFC256-5N
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$23.1 / Unit
View Datasheet →EPM7256AEFI100-7 Maximum Ratings & Electrical Characteristics
| Logic Family | MAX 7000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 256 |
| Number of Usable Gates | 5K |
| Number of User I/O | 84 |
| Pin-to-Pin Delay (Speed Grade) | 7.5 ns |
| Maximum Operating Frequency | 126.6 MHz |
| Core Supply Voltage | 3.3 V |
| MultiVolt I/O Support | 2.5 V / 3.3 V / 5.0 V |
| Programmability | In-system programmable (ISP) via JTAG |
| Package | 100-ball FBGA (FineLine BGA), 11x11 mm |
| Operating Temperature Range (Industrial) | -40 C to +85 C |
| JTAG / Boundary Scan | IEEE 1149.1 compliant |
| Mounting Type | Surface Mount |
| RoHS Status | Not Compliant (per Arrow listing) |
EPM7256AEFI100-7 100-ball fbga (fineline bga), 11x11 mm Pin Configuration Guide
Complete pinout information for EPM7256AEFI100-7 (100-ball fbga (fineline bga), 11x11 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM7256AEFI100-7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7256AEFI100-7 is suitable for 6 applications: PCI/ISA Bus Address Decoding, Industrial Glue Logic and I/O Expansion, Microprocessor Reset and Configuration Sequencing, 5V to 3.3V Level Translation Bridge, Telecom Backplane Switch and Router Glue Logic, Legacy Embedded System Sustainment.
PCI/ISA Bus Address Decoding
The EPM7256AEFI100-7 is a strong fit for PCI and ISA address decoding and chip-select generation, where 256 macrocells provide ample logic for wide address comparators and the 7.5 ns pin-to-pin delay ensures decoder outputs settle within one PCI clock cycle at 33 MHz. Its MultiVolt I/O supports bridging 5 V ISA peripherals to 3.3 V PCI buses without external level shifters. Designers typically use 64-128 macrocells for the decoder, leaving headroom for chip-select gating and bus-arbitration logic. The 84 user I/O accommodate address, data-direction, and interrupt-routing signals without bus multiplexing.
Recommended
Industrial Glue Logic and I/O Expansion
In industrial controllers and factory-automation PLCs, the EPM7256AEFI100-7 serves as a deterministic glue-logic hub, replacing dozens of 74-series TTL gates with a single in-system-programmable device. The 5K usable gates and 256 macrocells handle wide combinational decode, registered I/O, and asynchronous state machines for motor-control sequencing. The industrial -40 C to +85 C temperature range is required for factory-floor environments. The JTAG-based ISP allows firmware updates without removing the device from the board, useful for late-stage design changes.
Recommended
Microprocessor Reset and Configuration Sequencing
The EPM7256AEFI100-7 is widely used to sequence power-up and reset behavior for multi-rail microprocessor and DSP systems, where deterministic timing prevents latch-up and bus contention. With 256 macrocells it can manage 8-12 supply rails with adjustable delay chains (implemented via LCELL primitives) and watchdog timer logic. The 7.5 ns propagation delay supports fast power-good response. JTAG boundary-scan enables board-level continuity test, critical for high-density BGA boards where traditional bed-of-nails testing is impractical.
Recommended
5V to 3.3V Level Translation Bridge
The MultiVolt I/O on the EPM7256AEFI100-7 allows direct interfacing between 5 V legacy peripherals and 3.3 V modern ASICs or processors without external level-shifters. The device can buffer and translate dozens of signals in both directions across its 84 user I/O, replacing discrete bus-switch ICs and saving board area. With 256 macrocells, designers can implement translation plus protocol adaptation (for example, 8-bit parallel to 16-bit parallel) in a single chip. The 100-ball FBGA package fits densely on compact interface boards.
Recommended
Telecom Backplane Switch and Router Glue Logic
In telecom backplanes and switch fabrics, the EPM7256AEFI100-7 provides deterministic glue logic for high-speed serial interfaces, I2C/SPI management buses, and PHY reset coordination. The 126.6 MHz maximum frequency and 7.5 ns delay support fast backplane Ethernet (FE/GE) management paths where timing margins are tight. 256 macrocells are sufficient for complex state machines managing hot-swap insertion, LED indicators, and interrupt routing across multiple line cards. The industrial temperature range suits central-office and outdoor-cabinet deployments.
Recommended
Legacy Embedded System Sustainment
The EPM7256AEFI100-7 is in active use as a sustainment part for legacy VMEbus, cPCI, and proprietary embedded systems where the original MAX 7000A design cannot be changed due to certification or qualification cost. The 100-ball FBGA footprint matches existing board artwork, and the 7.5 ns timing preserves bus-protocol compliance. Intel has marked the family NRND with an estimated 2024 EOL, so remaining inventory is being consumed for field replacements. Designers maintaining long-life industrial, defense, or aerospace systems rely on this part for repairs and small-batch production.
Recommended
Recommended Products Summary
Engineering reference data for EPM7256AEFI100-7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7256AEFI100-7N | EPM7256AEFC100-7N | EPM7256AEFC100-7 | EPM7256AEFC100-10N | EPM7256AEFC256-5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 100-ball FBGA (11x11 mm) | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same | 100-ball FBGA (11x11 mm) - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| Usable Gates | 5K | 5K | 5K | 5K | 5K | 5K |
| User I/O | 84 | 84 | 84 | 84 | 84 | 84 |
| Pin-to-Pin Delay (Speed Grade) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 10 ns (slower) | 5 ns (faster) |
| Temperature Grade | Industrial (-40 C to +85 C) | Industrial (-40 C to +85 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) | Commercial (0 C to +70 C) |
| Lead-Free Finish ("N" suffix) | No (SnPb or unspecified) | Yes | Yes | No | Yes | Yes |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Drop-in same-FBGA replacement with RoHS lead-free finish (vs EPM7256AEFI100-7N)
- Faster speed grade available in same package (vs EPM7256AEFC256-5N)
- Same 100-FBGA footprint across commercial and industrial variants (vs EPM7256AEFC100-7)
Design Notes
The EPM7256AEFI100-7 requires a clean 3.3 V core supply with bulk-decoupling of 10-100 uF tantalum plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCC ball. During in-system programming via JTAG, the device draws higher transient currents; budget the regulator for at least 1.5x the typical ICC specification. Use a separate analog ground island if the board mixes switching converters with the CPLD to avoid ground-bounce coupling into JTAG programming pins.
The 100-ball FBGA requires 0.8 mm pitch routing on the PCB. Use 4-layer stack-up with continuous ground plane beneath the BGA to provide both reference plane and thermal spreading. Vias-in-pad are strongly recommended for inner-row balls to escape routing on dense boards. Solder-paste stencil aperture reduction of 5-10% on inner balls prevents solder-ball bridging during reflow. Bake-and-dry-pack handling is required if the part has been out of sealed bag more than 168 hours.
Estimated: With 84 simultaneously-switching outputs at 5 V MultiVolt I/O into 50 pF loads, expect ground-bounce spikes in the 1-2 ns range; derate system timing budgets accordingly. Do not leave JTAG TCK floating during normal operation - tie to GND through 10 kohm to prevent spurious device programming. The MAX 7000A ISP algorithm requires specific VCC ramp-up timing; consult the manufacturer datasheet for power-up sequencing if multiple devices share the JTAG chain.
Series-terminate high-speed outputs (those toggling above 50 MHz) with 33-ohm resistors placed within 10 mm of the FBGA ball to dampen reflections on long traces. The 7.5 ns propagation delay assumes a 50 pF load; for heavily loaded buses, plan for additional delay through LCELL chains. Keep clock and JTAG signals away from I/O banks driving switching converters or relays.
Compliance Information
RoHS not compliant per Arrow product listing; for RoHS-compliant assembly choose EPM7256AEFI100-7N (lead-free variant). AEC-Q100 not applicable for industrial-temperature CPLD. REACH, halogen-free, and conflict-minerals status not stated in distributor data.
