EPM7256AEFC100-10N - MAX 7000 CPLD, 256 Macro, 10ns, 100-FBGA | Altera
MPN: EPM7256AEFC100-10N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $39.47 | $39.47 |
| 10 | $35.5 | $355.00 |
| 100 | $31.2 | $3,120.00 |
| 500 | $27.8 | $13,900.00 |
| 1,000 | $24.5 | $24,500.00 |
Drop-in alternatives for EPM7256AEFC100-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM7256AEFC100-7N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7256AEFC100-15N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM7256AEFI100-10
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EPM7256AEFC100-10N Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (now Intel) |
| Series | MAX 7000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 256 |
| Logic Array Blocks (LABs) | 16 |
| User I/O | 84 |
| Number of Gates | 5000 |
| Propagation Delay (tPD) | 10 ns |
| Maximum Frequency (fMAX) | 154.8 MHz |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Tolerance | 5 V tolerant (multiVolt I/O) |
| Programmability | EEPROM, In-System Programmable (JTAG IEEE 1149.1) |
| Package | 100-LBGA (11 x 11 mm), FineLine BGA |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to +70°C (commercial) |
| Process Technology | 0.30 µm EEPROM CMOS |
EPM7256AEFC100-10N 100-lbga (11 x 11 mm), fineline bga Pin Configuration Guide
Complete pinout information for EPM7256AEFC100-10N (100-lbga (11 x 11 mm), fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM7256AEFC100-10N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM7256AEFC100-10N is suitable for 6 applications: High-Speed Bus Interface Bridging, Address Decoding and Chip-Select Generation, Telecom Line-Card Glue Logic, Industrial Control and Factory Automation, Peripheral Interfacing and Legacy I/O Bridging, State-Machine Replacement in Computing Equipment.
High-Speed Bus Interface Bridging
The EPM7256AEFC100-10N is well suited to bridge PCI, ISA, VME, PCMCIA, and proprietary local buses in networking and telecom hardware. Its 10 ns tPD and 154.8 MHz fMAX, combined with 5V-tolerant multiVolt I/O, allow it to convert between 3.3V and 5V domains while meeting PCI 33 MHz clock-to-output timing with margin. The 256 macrocells comfortably hold the address-decoders, chip-select generators, byte-enable logic, and wait-state machines typical of a bridge. Designers typically pair it with a clock buffer and place it adjacent to the bus connector to minimize stub length and keep critical-path delays within the 10 ns budget.
Recommended
Address Decoding and Chip-Select Generation
The 256 macrocells and 16 LABs in the EPM7256AEFC100-10N can implement a full address decoder for embedded microprocessors, DSPs, and 32-bit microcontrollers requiring many memory-mapped peripherals. With 84 user I/O pins, the device supports up to 20 to 30 separate chip-select outputs without external decoding. The deterministic 10 ns tPD provides predictable setup-to-output timing, which simplifies worst-case bus analysis. Per the manufacturer datasheet, this is the canonical use case for the MAX 7000A family in legacy 68k, x86, and PowerPC-based designs.
Recommended
Telecom Line-Card Glue Logic
Telecommunications line cards require deterministic, low-latency glue logic to aggregate framers, mappers, TDM switches, and network processors. The EPM7256AEFC100-10N's 5V-tolerant I/O simplifies level-shifting between 5V legacy framers and 3.3V ASICs, while the 10 ns tPD easily meets T1/E1 and 155 MHz POS-PHY timing. The EEPROM-based instant-on (under 100 µs) eliminates the FPGA configuration delay that line cards cannot tolerate. The 100-FBGA package provides strong thermal performance and the pin density required by multi-channel designs, as documented in the manufacturer reference designs.
Recommended
Industrial Control and Factory Automation
In industrial control platforms such as PLCs, motor drives, and SCADA front-ends, the EPM7256AEFC100-10N provides deterministic state-machine logic for safety interlocks, pulse-train generation, encoder decoding, and PWM timing. The 256 macrocells can host multiple 16-bit counters, quadrature decoders, and Step/Dir pulse generators. Designers appreciate the 5V-tolerant I/O for compatibility with 24V opto-isolated industrial signal conditioning. The commercial 0°C to +70°C grade suits enclosure-protected applications, while the industrial variant EPM7256AEFI100-10 extends coverage to -40°C to +85°C for outdoor cabinets.
Recommended
Peripheral Interfacing and Legacy I/O Bridging
The EPM7256AEFC100-10N is widely used to bridge modern 3.3V processors to legacy 5V peripherals such as UARTs, parallel ports, IDE/ATA buses, and ISA expansion slots. Its 5V-tolerant I/O pins can drive 5V TTL loads directly while sourcing from a 3.3V VCCIO, eliminating external level shifters. The 84 user I/O pins comfortably absorb a full IDE interface (16-bit data, address, control) plus several chip selects. The 10 ns tPD matches the ISA 8 MHz clock cycle budget with substantial timing margin for stable operation.
Recommended
State-Machine Replacement in Computing Equipment
Computing platforms such as RAID controllers, storage backplanes, and baseboard management controllers rely on CPLDs to implement complex multi-state control logic that would otherwise require dozens of discrete 74-series gates. The EPM7256AEFC100-10N's 256 macrocells can host 8 to 12 independent state machines simultaneously, and the EEPROM non-volatile configuration eliminates the FPGA bitstream loading step. Its 154.8 MHz fMAX provides ample headroom for 66 MHz/100 MHz internal buses, while the JTAG ISP interface supports field firmware updates through the BMC.
Recommended
Recommended Products Summary
Engineering reference data for EPM7256AEFC100-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM7256AEFC100-7N | EPM7256AEFC100-15N | EPM7256AEFI100-10 | EPM7256AEQC100-10N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 100-LBGA (11x11 mm) | 100-LBGA (11x11 mm) - same | 100-LBGA (11x11 mm) - same | 100-LBGA (11x11 mm) - same | 100-PQFP - different (NOT pin-compatible) |
| Macrocells | 256 | 256 | 256 | 256 | 256 |
| Logic Array Blocks | 16 | 16 | 16 | 16 | 16 |
| User I/O | 84 | 84 | 84 | 84 | 84 |
| Propagation Delay (tPD) | 10 ns | 7.5 ns (25% faster) | 15 ns (50% slower) | 10 ns (same) | 10 ns (same) |
| Max Frequency (fMAX) | 154.8 MHz | 181.8 MHz (faster) | 118 MHz (slower) | 154.8 MHz (same) | 154.8 MHz (same) |
| Operating Temperature | 0°C to +70°C (commercial) | 0°C to +70°C | 0°C to +70°C | -40°C to +85°C (industrial) | 0°C to +70°C |
Key Differentiators
- Balanced 10 ns speed grade is the sweet spot for sub-100 MHz bus designs (vs EPM7256AEFC100-7N)
- Commercial 0°C to +70°C grade optimized for indoor equipment (vs EPM7256AEFI100-10)
- 100-LBGA package offers superior thermal and electrical performance over QFP (vs EPM7256AEQC100-10N)
Design Notes
Estimated: VCCINT = 3.3V with I/O banks optionally at 2.5V or 1.8V via VCCIO pins. Per the manufacturer datasheet, quiescent current during standby is approximately 50 to 100 mA, rising to 200 to 300 mA at full toggle activity. Decouple each VCC/VCCIO pin with a 0.1 µF X7R ceramic within 5 mm of the ball, plus a single 10 µF tantalum or ceramic bulk capacitor per power domain. JTAG-ISP-driven configuration transients can spike supply current by 20-30%; allow margin when sizing the 3.3V regulator.
The 100-LBGA package at 11x11 mm uses 1.0 mm ball pitch, which requires 4-layer or 6-layer PCB stack-up with microvia or sub-0.1 mm laser-drilled vias for fan-out. Per the manufacturer reference layout, escape all balls on the top layer using dog-bone fan-out to via-in-pad or near-pad micro-vias, then route signals on internal layers. Keep a continuous ground plane on layer 2 beneath the device and stitch the perimeter with a via fence every 2 mm to control BGA lead inductance and EMI. Maintain at least 0.8 mm clearance between adjacent BGA balls to avoid solder bridging during reflow.
Do not leave unused I/O pins floating - explicitly configure them as outputs driving ground or as inputs with the weak pull-up enabled in your Quartus/MAX+PLUS II design file. Per the manufacturer datasheet, floating inputs can draw 1 to 2 mA each and may oscillate, injecting noise into the global PIA. Also note that the JTAG pins (TCK, TMS, TDI, TDO) must be accessible for ISP; if they are bussed to other JTAG devices, follow the daisy-chain guidelines in the manufacturer BSDL file to ensure correct boundary-scan ordering. Finally, validate that your target speed grade supports any clock-doubler or PLL macros before relying on internal frequency multiplication.
Compliance Information
RoHS, REACH, and lead-free status are not explicitly confirmed in the verified distributor data for the EPM7256AEFC100-10N. The FBGA package was historically offered in both Pb and Pb-free variants; buyers should request a Certificate of Compliance from the supplier before placing volume orders for RoHS-bound assemblies. AEC-Q100 not applicable - this is a legacy commercial/industrial CPLD not qualified for automotive safety applications.
