AMD

XC6SLX25-3FTG256C - 24,051-LE Spartan-6 FPGA | AMD

MPN: XC6SLX25-3FTG256C ✓ فعال
256-LBGA FT-style package Package -3 Speed 936 kbit Memory
حداقل سفارش: 1 |

XC6SLX25-3FTG256C نمای کلی

The AMD XC6SLX25-3FTG256C is a Spartan-6 LX field-programmable gate array with 24,051 logic cells, 3,758 adaptive logic modules, 936 kbit of embedded memory, and 186 I/Os in a 256-LBGA FT-style package. The -3 speed grade supports a 0°C to 85°C commercial operating-temperature range. It combines programmable digital logic, configurable I/O, block RAM, and digital signal processing resources on one device.

A field-programmable gate array is a semiconductor whose digital functionality is defined after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable interconnect, memory, and I/O resources. This makes the Spartan-6 LX device useful when a design requires hardware parallelism, reconfigurable interfaces, rapid prototyping, or later field updates without changing the printed circuit board.

The XC6SLX25-3FTG256C provides 24,051 logic cells and 3,758 adaptive logic modules, giving a design substantial combinational and sequential logic capacity. Its 936 kbit of embedded memory supports buffering, packet storage, data acquisition, and general-purpose digital functions. The 186 available I/Os support external interfaces and system integration, while the -3 speed grade provides a defined performance class for industrial and commercial designs operating between 0°C and 85°C.

Spartan-6 LX devices use 6-input adaptive logic modules and a programmable interconnect architecture. Depending on the implementation, designers can use the logic fabric for control, interfaces, protocol handling, and parallel processing, while block RAM provides dedicated storage resources. Configuration and programming details should be reviewed in the manufacturer Spartan-6 documentation before selecting I/O standards, clocking resources, or power-management settings.

Typical applications include industrial control and automation, communication equipment, test and measurement, embedded video processing, data acquisition, and embedded systems that benefit from hardware parallelism. The combination of 24,051 logic cells, 936 kbit of embedded memory, and 186 I/Os makes the device appropriate for controllers that must combine multiple fixed-function blocks in one programmable component.

The main PCB-design consideration is the 256-ball BGA footprint and its demanding escape-routing requirements. Follow the AMD Spartan-6 package pinout files, recommended PCB stack-up, and decoupling guidance when assigning power and ground balls. Validate the design for the intended -3 speed grade, I/O standards, clock topology, configuration interface, and operating-temperature range before release.

This product page consolidates the exact XC6SLX25-3FTG256C configuration, pin-compatible Spartan-6 LX options, application guidance, and design considerations into an engineering-oriented reference for FPGA architecture planning and PCB implementation.

جایگزین‌های drop-in برای XC6SLX25-3FTG256C — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.

گونه‌ها در این سری

مدل‌های هم‌سری که جایگزین مستقیم هستند برای XC6SLX25-3FTG256C (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Device Type, Logic Cells, Adaptive Logic Modules, Operating Temperature.

AMD
Package: 256-LBGA / FTBGA-256, 17 x 17 mm, 1.0 mm pitch
Logic Cells: 14,579
Operating Temperature: 0 C to +85 C (Commercial)
مقایسه با XC6SLX25-3FTG256C →
Xilinx
Package: 256-pin FTBGA, 17 x 17 mm, 1 mm pitch
Device Type: Spartan-6 LX field-programmable gate array
مقایسه با XC6SLX25-3FTG256C →
AMD
Package: 256-LBGA, 17 x 17 mm
Device Type: Field Programmable Gate Array (FPGA)
Logic Cells: 24,051 cells
مقایسه با XC6SLX25-3FTG256C →
AMD
Package: 256-LBGA
Device Type: Field-Programmable Gate Array (FPGA)
Adaptive Logic Modules: 3,758 ALM
مقایسه با XC6SLX25-3FTG256C →

XC6SLX25-2FTG256C

✅ جایگزین مستقیم
📦 256-LBGA FT-style
Speed grade changes from -3 to -2; logic, memory, I/O count, and package remain unchanged

📋 جایگزین مرجع (خارج از کاتالوگ)

XC6SLX25-3FTG256I

✅ جایگزین مستقیم
AMD
📦 256-LBGA FT-style
Field-Programmable Gate Array (FPGA) · Spartan-6 LX · 24,051 LE · 3,758 ALM · 936 Kbit · 186 I/O · 500 MHz · -3

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

XC6SLX25-2FTG256I

✅ جایگزین مستقیم
AMD
📦 256-LBGA FT-style
Field-Programmable Gate Array (FPGA) · Spartan-6 LX · 24,051 cells · 24,051 LE · 1,879 CLBs · 3,758 ALMs · 186 I/Os · 500 MHz

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

XC6SLX25-3FTG256C حداکثر مقادیر مجاز و مشخصات الکتریکی

Product Type Spartan-6 LX Field Programmable Gate Array (FPGA)
Logic Cells 24,051 logic cells
Adaptive Logic Modules 3,758 ALMs
Embedded Memory 936 kbit
User I/O Count 186 I/Os
Speed Grade -3
دمای کاری 0°C to 85°C
بسته‌بندی 256-LBGA FT-style package
Device Family Spartan-6 LX
Manufacturer AMD
Original Manufacturer Xilinx
نوع نصب Surface Mount

راهنمای پیکربندی پین XC6SLX25-3FTG256C 256-lbga ft-style package

پیکربندی پین برای XC6SLX25-3FTG256C (پکیج 256-lbga ft-style package). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.

نمودار پین‌آوت پکیج 256-lbga ft-style package برای XC6SLX25-3FTG256C

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کاربردهای معمول

XC6SLX25-3FTG256C مناسب است برای 6 کاربردs: Industrial Control and Automation, Communication Interface Consolidation, Data Acquisition Systems, Test and Measurement Equipment, Embedded Video and Image Processing, Programmable Embedded Systems.

🏭

Industrial Control and Automation

The XC6SLX25-3FTG256C fits industrial controllers that combine sequencing logic, communications, data acquisition, and actuator control. Its 24,051 logic cells and 3,758 adaptive logic modules support parallel control functions, while 936 kbit of embedded memory can hold acquisition buffers, protocol data, and status tables. The 186 I/Os provide connections to sensors, digital I/O, converters, and field interfaces. Within the specified 0°C to 85°C range, the -3 speed grade gives designers a defined timing target for control loops and peripheral logic.

🌐

Communication Interface Consolidation

The XC6SLX25-3FTG256C is suited to communication equipment that needs several protocol and framing functions implemented in parallel hardware. Its 3,758 adaptive logic modules can accommodate state machines, serializers, filters, and interface controllers, while 936 kbit of embedded memory provides local packet or frame storage. The 186 I/Os allow multiple external data paths to be consolidated in a 256-LBGA device. System timing should be closed against the -3 speed-grade limits and the selected I/O standards.

📊

Data Acquisition Systems

The XC6SLX25-3FTG256C can implement acquisition pipelines, sample buffering, trigger logic, and data-formatting functions in one programmable device. The 24,051 logic cells support parallel datapaths and control sections, and the 936 kbit embedded-memory capacity is useful for staging captured data between processing stages. With 186 I/Os, the FPGA can interface to multiple converters, digital sensors, counters, and test points. Designers must assign the package balls and confirm interface timing using the manufacturer's pinout and electrical guidance.

🖥️

Test and Measurement Equipment

The XC6SLX25-3FTG256C is appropriate for programmable test logic requiring parallel stimulus generation, result capture, sequencing, and data analysis. Its 3,758 adaptive logic modules can implement multiple counters, timing units, pattern engines, and control state machines, while 936 kbit of embedded memory supports trace and result buffering. The 186-I/O resource set enables connection to converters, switches, and clock sources. The -3 grade is appropriate when design timing requires a higher speed class than the -2 options.

📺

Embedded Video and Image Processing

The XC6SLX25-3FTG256C can support embedded video pipelines where deterministic parallel processing, line buffers, pixel formatting, and control logic are needed. Its 24,051 logic cells provide substantial configurable processing capacity, and its 936 kbit of embedded memory can serve small frame, line, or packet buffers. The 186 I/Os support connection to image sensors, memory interfaces, displays, and digital processing components. Clocking, memory bandwidth, and timing must be evaluated against the -3 grade and target video resolution.

🔧

Programmable Embedded Systems

The XC6SLX25-3FTG256C fits embedded systems that need reconfigurable control logic, custom peripherals, and compact integration. The FPGA fabric can implement hardware-assisted control, data transformation, timers, and communication functions while the 936 kbit embedded memory supplies local storage. Its 186 I/Os provide dedicated external connectivity, and the 256-LBGA package supports dense board-level integration. Firmware and hardware interfaces should be partitioned to exploit the device's parallelism without creating timing or routing bottlenecks.

خلاصه محصولات پیشنهادی

What are the key specifications of XC6SLX25-3FTG256C that engineers should know?
The XC6SLX25-3FTG256C is a Spartan-6 LX FPGA with 24,051 logic cells, 3,758 adaptive logic modules, 936 kbit of embedded memory, and 186 I/Os in a 256-LBGA package. According to the AMD Spartan-6 LX datasheet, the device uses the -3 speed grade and is specified for 0°C to 85°C. These figures define its main capacity, memory, interface, package, and environmental boundaries for initial architecture planning.
Where can I download the XC6SLX25-3FTG256C datasheet PDF?
The AMD Spartan-6 LX datasheet can be accessed through the XC6SLX25 datasheet link on this page, while the manufacturer package-pinout page contains the Spartan-6 device pinout files. The product listing also links to the exact XC6SLX25-3FTG256C documentation. Use the pinout files to assign all 256 package balls and the datasheet to confirm voltage, timing, configuration, and electrical limits before schematic capture.
Where can I find the XC6SLX25-3FTG256C pinout?
The XC6SLX25-3FTG256C pinout is published through AMD's Spartan-6 Package Device Pinout Files page, which provides package information in ASCII text format. The device uses a 256-LBGA FT-style package with 186 user I/Os. Because power, ground, configuration, clock, and dedicated I/O balls must be assigned according to the exact package, use the manufacturer pinout file rather than relying on a generic BGA drawing.
What is XC6SLX25-3FTG256C used for?
The XC6SLX25-3FTG256C is used for programmable digital control, data acquisition, communication interfaces, industrial automation, test equipment, and embedded processing systems. Its 24,051 logic cells, 936 kbit of embedded memory, and 186 I/Os allow multiple parallel functions to be consolidated in one device. The manufacturer documentation identifies the Spartan-6 LX family as a low-cost platform for high-volume programmable-logic applications.
What does the -3 speed grade mean for XC6SLX25-3FTG256C?
The -3 designation identifies the device's -3 Spartan-6 speed grade, while the C suffix identifies the commercial temperature option. The exact XC6SLX25-3FTG256C configuration is specified from 0°C to 85°C. Timing closure must therefore use the -3 operating conditions from the AMD datasheet, including the appropriate speed grade, temperature corner, supply voltage, and I/O assumptions for every implemented path.
Can XC6SLX25-2FTG256C replace XC6SLX25-3FTG256C?
Yes, the XC6SLX25-2FTG256C is a pin-compatible Spartan-6 LX option in the same 256-LBGA FT-style package with 24,051 logic cells, 3,758 adaptive logic modules, 936 kbit of embedded memory, and 186 I/Os. The principal difference is the speed grade: -2 replaces the target's -3 grade. Confirm timing closure for the -2 limits before using it as a drop-in replacement.
Can XC6SLX25-3FTG256I replace XC6SLX25-3FTG256C?
Yes, XC6SLX25-3FTG256I uses the same Spartan-6 LX device configuration, -3 speed grade, and 256-LBGA FT-style package, but it is the industrial-temperature option rather than the commercial-temperature option. It is a practical PCB-compatible alternative when the design requires the wider -40°C to 85°C operating range. Environmental qualification, timing, and procurement requirements should still be reviewed for the target system.
When should I choose XC6SLX25-3FTG256C over XC6SLX25-2FTG256C?
Choose XC6SLX25-3FTG256C when the design requires the -3 performance class rather than the -2 class while retaining the same logic, memory, I/O, and package resources. Both devices provide 24,051 logic cells and a 256-LBGA footprint, so the decision should be driven by timing closure and operating-temperature requirements. Use the -2 device only if the complete design meets its timing limits.
Is XC6SLX25-3FTG256C suitable for industrial automation?
The XC6SLX25-3FTG256C is suitable for industrial automation systems that operate within its specified 0°C to 85°C range and do not require an industrial-temperature grade. Its 186 I/Os support external sensors, actuators, and control interfaces, while its programmable logic can implement motion, sequencing, safety, and communications logic. Choose XC6SLX25-3FTG256I when operation below 0°C is required.
What is the best drop-in replacement for XC6SLX25-3FTG256C?
The closest drop-in options are XC6SLX25-2FTG256C, XC6SLX25-3FTG256I, and XC6SLX25-2FTG256I because they retain the Spartan-6 LX 256-LBGA footprint and 24,051-logic-cell configuration. The -2 variants change the speed grade, while the I variants change the temperature grade. No cross-manufacturer pin-compatible substitute was identified, so replacement selection should remain within the verified AMD/Xilinx device family.
What can replace XC6SLX25-3FTG256C?
XC6SLX25-2FTG256C, XC6SLX25-3FTG256I, and XC6SLX25-2FTG256I can be considered as drop-in-family alternatives with the same 256-LBGA FT-style package. Each retains the 24,051 logic-cell, 3,758-ALM, 936-kbit-memory, and 186-I/O configuration. The engineering choice depends on whether the substitution changes the -3 speed class, the commercial temperature range, or both.
Is XC6SLX25-3FTG256C the same as XC6SLX25-2FTG256C?
No, they share the same device size and 256-LBGA FT-style footprint but use different speed grades. XC6SLX25-3FTG256C is the -3 grade, while XC6SLX25-2FTG256C is the -2 grade. The other listed architecture figures remain 24,051 logic cells, 3,758 ALMs, 936 kbit of embedded memory, and 186 I/Os. Existing PCB land patterns can remain unchanged, but timing must be revalidated.
Where to buy XC6SLX25-3FTG256C online?
Use the Request a Quote form on this page to request XC6SLX25-3FTG256C availability, lot information, and a commercial proposal for the exact 256-LBGA FT-style configuration. The form is the appropriate channel for confirming quantity, lead time, traceability, and shipment details without relying on a changing public price. Specify the complete MPN XC6SLX25-3FTG256C in the request.
What is the price of XC6SLX25-3FTG256C?
The current commercial terms for XC6SLX25-3FTG256C should be obtained through the Request a Quote form on this page. Submit the required quantity, target shipment date, and packaging preference so the quote can reflect the exact MPN and order schedule. The structured pricing area updates independently, and a formal quote provides the appropriate transactional record for budgeting and procurement.
What is the lead time and stock status for XC6SLX25-3FTG256C?
Use the Request a Quote form on this page to obtain the current lead time and stock allocation for XC6SLX25-3FTG256C. Provide the required order quantity and intended shipment date so procurement can confirm the exact FT-style package configuration and any lot or date-code requirements. Stock and scheduling for programmable devices can change by quantity, so they should be confirmed at the time of quotation.

داده‌های مرجع مهندسی برای XC6SLX25-3FTG256C — مقایسه، راهنمای طراحی و اطلاعات انطباق.

راهنمای انتخاب

Choose XC6SLX25-3FTG256C when the PCB is assigned for the Spartan-6 LX 256-LBGA FT-style package, the design requires the -3 speed class, and a 0°C to 85°C commercial operating range is sufficient. Select XC6SLX25-2FTG256C when the same package, 24,051 logic cells, 936 kbit of memory, and 186 I/Os are needed but the complete design meets the -2 timing limits. Select XC6SLX25-3FTG256I when the design requires operation from -40°C to 85°C while retaining the -3 grade. Choose XC6SLX25-2FTG256I only when both the -2 timing class and wider temperature range are acceptable. No cross-manufacturer drop-in equivalent was identified, so device-family continuity, timing validation, and exact package assignment remain critical selection criteria.

مقایسه با جایگزین‌ها

پارامتر این محصول XC6SLX25-2FTG256C XC6SLX25-3FTG256I XC6SLX25-2FTG256I
Package 256-LBGA FT-style 256-LBGA FT-style 256-LBGA FT-style 256-LBGA FT-style
Brand AMD AMD AMD AMD
Logic Cells 24,051 logic cells 24,051 logic cells 24,051 logic cells 24,051 logic cells
Adaptive Logic Modules 3,758 ALMs 3,758 ALMs 3,758 ALMs 3,758 ALMs
Embedded Memory 936 kbit 936 kbit 936 kbit 936 kbit
User I/O Count 186 I/Os 186 I/Os 186 I/Os 186 I/Os
Speed Grade -3 -2 -3 -2
Operating Temperature 0°C to 85°C 0°C to 85°C -40°C to 85°C -40°C to 85°C
Device Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX

تفاوت‌های کلیدی

  • Maintains the -3 speed class while allowing a wider temperature grade (در مقابلXC6SLX25-2FTG256C)
  • Commercial-temperature operation with the same -3 speed grade (در مقابلXC6SLX25-3FTG256I)
  • Full FPGA resource set in a pin-compatible 256-LBGA format (در مقابلXC6SLX25-2FTG256I)

یادداشت‌های طراحی

Treat the 256-LBGA layout as a high-density routing problem. Assign every ball using the AMD Spartan-6 package-device pinout files, including power, ground, configuration, clock, and dedicated pins. Follow the manufacturer's recommended stack-up and escape-routing guidance rather than deriving ball assignments from a generic BGA library. Verify differential pairs, length-sensitive interfaces, and power-return paths during layout review.

Implement the device's power architecture from the manufacturer datasheet, including the required supply rails, sequencing, decoupling, and power-source requirements. Place bypass capacitors close to their associated package balls and keep high-current connections as short and wide as the PCB stack-up permits. Use the exact -3 operating conditions when evaluating voltage tolerance, supply current, and power-management settings.

Assign clock and high-speed interface pins only after checking the package-specific recommendations and the selected I/O standard. Maintain continuous reference planes, avoid stubs, and control return-path discontinuities beneath high-speed nets. For external memory or source-synchronous interfaces, use the AMD PCB guidelines for the relevant Spartan-6 device and validate signal integrity with the complete stack-up.

Do not treat a speed-grade or temperature-grade substitution as automatically timing- and environment-equivalent. XC6SLX25-2FTG256C retains the package and architecture but uses the -2 speed grade, while the I variants extend operation to -40°C to 85°C. Re-run timing closure, verify environmental requirements, and confirm configuration compatibility whenever the exact MPN changes.

اطلاعات انطباق

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
بدون سرب
Unknown
بدون هالوژن
Unknown
مواد معدنی درگیری
Unknown

No definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals statement was identified for this exact MPN. The FTG256 ordering code should not be treated as proof of compliance without supporting documentation.

تاریخ تأیید داده‌ها: 2026-11-06 — داده‌ها توسط تیم مهندسی قطعات XAIPART تأیید و گردآوری شده است

جستجوهای مرتبط

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قطعات و اصطلاحات مرتبط

AMD Xilinx XC6SLX25-3FTG256C XC6SLX25-2FTG256C XC6SLX25-3FTG256I XC6SLX25-2FTG256I Spartan-6 LX FPGA field-programmable gate array programmable logic logic cell adaptive logic module ALM embedded block RAM 936 kbit embedded memory 186 user I/Os 256-LBGA FT-style BGA surface-mount package speed grade -3 industrial control data acquisition test and measurement programmable embedded systems
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