XC6SLX25-3FTG256C - 24,051-LE Spartan-6 FPGA | AMD
MPN： XC6SLX25-3FTG256C ✓ 啟用中XC6SLX25-3FTG256C 概覽
A field-programmable gate array is a semiconductor whose digital functionality is defined after fabrication. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable interconnect, memory, and I/O resources. This makes the Spartan-6 LX device useful when a design requires hardware parallelism, reconfigurable interfaces, rapid prototyping, or later field updates without changing the printed circuit board.
The XC6SLX25-3FTG256C provides 24,051 logic cells and 3,758 adaptive logic modules, giving a design substantial combinational and sequential logic capacity. Its 936 kbit of embedded memory supports buffering, packet storage, data acquisition, and general-purpose digital functions. The 186 available I/Os support external interfaces and system integration, while the -3 speed grade provides a defined performance class for industrial and commercial designs operating between 0°C and 85°C.
Spartan-6 LX devices use 6-input adaptive logic modules and a programmable interconnect architecture. Depending on the implementation, designers can use the logic fabric for control, interfaces, protocol handling, and parallel processing, while block RAM provides dedicated storage resources. Configuration and programming details should be reviewed in the manufacturer Spartan-6 documentation before selecting I/O standards, clocking resources, or power-management settings.
Typical applications include industrial control and automation, communication equipment, test and measurement, embedded video processing, data acquisition, and embedded systems that benefit from hardware parallelism. The combination of 24,051 logic cells, 936 kbit of embedded memory, and 186 I/Os makes the device appropriate for controllers that must combine multiple fixed-function blocks in one programmable component.
The main PCB-design consideration is the 256-ball BGA footprint and its demanding escape-routing requirements. Follow the AMD Spartan-6 package pinout files, recommended PCB stack-up, and decoupling guidance when assigning power and ground balls. Validate the design for the intended -3 speed grade, I/O standards, clock topology, configuration interface, and operating-temperature range before release.
This product page consolidates the exact XC6SLX25-3FTG256C configuration, pin-compatible Spartan-6 LX options, application guidance, and design considerations into an engineering-oriented reference for FPGA architecture planning and PCB implementation.
直接替換替代品，適用於 XC6SLX25-3FTG256C — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX25-3FTG256C （相同外形與佔位） — 差異在於 Package, Device Type, Logic Cells, Adaptive Logic Modules, Operating Temperature.
XC6SLX25-2FTG256C
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX25-3FTG256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX25-2FTG256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX25-3FTG256C 最大額定值與電氣特性
| Product Type | Spartan-6 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 24,051 logic cells |
| Adaptive Logic Modules | 3,758 ALMs |
| Embedded Memory | 936 kbit |
| User I/O Count | 186 I/Os |
| Speed Grade | -3 |
| 工作溫度 | 0°C to 85°C |
| 封裝 | 256-LBGA FT-style package |
| Device Family | Spartan-6 LX |
| Manufacturer | AMD |
| Original Manufacturer | Xilinx |
| 安裝類型 | Surface Mount |
XC6SLX25-3FTG256C 256-lbga ft-style package 腳位配置指南
XC6SLX25-3FTG256C（256-lbga ft-style package 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX25-3FTG256C.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX25-3FTG256C 適用於 6 應用s: Industrial Control and Automation, Communication Interface Consolidation, Data Acquisition Systems, Test and Measurement Equipment, Embedded Video and Image Processing, Programmable Embedded Systems.
Industrial Control and Automation
The XC6SLX25-3FTG256C fits industrial controllers that combine sequencing logic, communications, data acquisition, and actuator control. Its 24,051 logic cells and 3,758 adaptive logic modules support parallel control functions, while 936 kbit of embedded memory can hold acquisition buffers, protocol data, and status tables. The 186 I/Os provide connections to sensors, digital I/O, converters, and field interfaces. Within the specified 0°C to 85°C range, the -3 speed grade gives designers a defined timing target for control loops and peripheral logic.
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Communication Interface Consolidation
The XC6SLX25-3FTG256C is suited to communication equipment that needs several protocol and framing functions implemented in parallel hardware. Its 3,758 adaptive logic modules can accommodate state machines, serializers, filters, and interface controllers, while 936 kbit of embedded memory provides local packet or frame storage. The 186 I/Os allow multiple external data paths to be consolidated in a 256-LBGA device. System timing should be closed against the -3 speed-grade limits and the selected I/O standards.
推薦
Data Acquisition Systems
The XC6SLX25-3FTG256C can implement acquisition pipelines, sample buffering, trigger logic, and data-formatting functions in one programmable device. The 24,051 logic cells support parallel datapaths and control sections, and the 936 kbit embedded-memory capacity is useful for staging captured data between processing stages. With 186 I/Os, the FPGA can interface to multiple converters, digital sensors, counters, and test points. Designers must assign the package balls and confirm interface timing using the manufacturer's pinout and electrical guidance.
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Test and Measurement Equipment
The XC6SLX25-3FTG256C is appropriate for programmable test logic requiring parallel stimulus generation, result capture, sequencing, and data analysis. Its 3,758 adaptive logic modules can implement multiple counters, timing units, pattern engines, and control state machines, while 936 kbit of embedded memory supports trace and result buffering. The 186-I/O resource set enables connection to converters, switches, and clock sources. The -3 grade is appropriate when design timing requires a higher speed class than the -2 options.
推薦
Embedded Video and Image Processing
The XC6SLX25-3FTG256C can support embedded video pipelines where deterministic parallel processing, line buffers, pixel formatting, and control logic are needed. Its 24,051 logic cells provide substantial configurable processing capacity, and its 936 kbit of embedded memory can serve small frame, line, or packet buffers. The 186 I/Os support connection to image sensors, memory interfaces, displays, and digital processing components. Clocking, memory bandwidth, and timing must be evaluated against the -3 grade and target video resolution.
推薦
Programmable Embedded Systems
The XC6SLX25-3FTG256C fits embedded systems that need reconfigurable control logic, custom peripherals, and compact integration. The FPGA fabric can implement hardware-assisted control, data transformation, timers, and communication functions while the 936 kbit embedded memory supplies local storage. Its 186 I/Os provide dedicated external connectivity, and the 256-LBGA package supports dense board-level integration. Firmware and hardware interfaces should be partitioned to exploit the device's parallelism without creating timing or routing bottlenecks.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX25-3FTG256C — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX25-2FTG256C | XC6SLX25-3FTG256I | XC6SLX25-2FTG256I |
|---|---|---|---|---|
| Package | 256-LBGA FT-style | 256-LBGA FT-style | 256-LBGA FT-style | 256-LBGA FT-style |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 24,051 logic cells | 24,051 logic cells | 24,051 logic cells | 24,051 logic cells |
| Adaptive Logic Modules | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs | 3,758 ALMs |
| Embedded Memory | 936 kbit | 936 kbit | 936 kbit | 936 kbit |
| User I/O Count | 186 I/Os | 186 I/Os | 186 I/Os | 186 I/Os |
| Speed Grade | -3 | -2 | -3 | -2 |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | -40°C to 85°C | -40°C to 85°C |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
主要差異化特點
- Maintains the -3 speed class while allowing a wider temperature grade (對比XC6SLX25-2FTG256C)
- Commercial-temperature operation with the same -3 speed grade (對比XC6SLX25-3FTG256I)
- Full FPGA resource set in a pin-compatible 256-LBGA format (對比XC6SLX25-2FTG256I)
設計說明
Treat the 256-LBGA layout as a high-density routing problem. Assign every ball using the AMD Spartan-6 package-device pinout files, including power, ground, configuration, clock, and dedicated pins. Follow the manufacturer's recommended stack-up and escape-routing guidance rather than deriving ball assignments from a generic BGA library. Verify differential pairs, length-sensitive interfaces, and power-return paths during layout review.
Implement the device's power architecture from the manufacturer datasheet, including the required supply rails, sequencing, decoupling, and power-source requirements. Place bypass capacitors close to their associated package balls and keep high-current connections as short and wide as the PCB stack-up permits. Use the exact -3 operating conditions when evaluating voltage tolerance, supply current, and power-management settings.
Assign clock and high-speed interface pins only after checking the package-specific recommendations and the selected I/O standard. Maintain continuous reference planes, avoid stubs, and control return-path discontinuities beneath high-speed nets. For external memory or source-synchronous interfaces, use the AMD PCB guidelines for the relevant Spartan-6 device and validate signal integrity with the complete stack-up.
Do not treat a speed-grade or temperature-grade substitution as automatically timing- and environment-equivalent. XC6SLX25-2FTG256C retains the package and architecture but uses the -2 speed grade, while the I variants extend operation to -40°C to 85°C. Re-run timing closure, verify environmental requirements, and confirm configuration compatibility whenever the exact MPN changes.
合規資訊
No definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals statement was identified for this exact MPN. The FTG256 ordering code should not be treated as proof of compliance without supporting documentation.
