AMD

XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx

MPN: XC6SLX9-3FT256I ✓ فعال
1.2 V Vdss FTBGA-256 Package 667 MHz Speed
حداقل سفارش: 1 |

XC6SLX9-3FT256I نمای کلی

The AMD / Xilinx XC6SLX9-3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 configurable logic cells, 715 configurable logic blocks, 667 MHz internal frequency, and 186 I/O sites in a 256-ball FTBGA package. It is manufactured on a 45 nm CMOS process and is identified by the supplied data as an industrial-temperature device operating from 0°C to 85°C.

An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are defined after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, alongside CPLDs and ASICs. Unlike a fixed-function ASIC, an FPGA can accommodate multiple digital interfaces and control functions, but timing, resource allocation, pin constraints, and power behavior must be validated in the selected design tools.

The XC6SLX9 combines 9,152 logic cells, 715 CLBs, and 186 I/O sites. The -3 suffix identifies the highest-performance Spartan-6 LX speed grade cited in the supplied results. The FT256 package is a 17 mm by 17 mm FTBGA with 1 mm pitch, while the trailing I denotes the industrial temperature grade. One supplied source reports a 862 MHz figure, while another reports 667 MHz; this record uses the explicitly indexed 667 MHz value and does not treat the conflicting figure as an additional verified rating.

Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, sensor processing, and general-purpose digital signal conditioning. The 186-I/O count can support parallel control buses, counters, status inputs, communications interfaces, and external memory connections when pin multiplexing and timing permit. Resource utilization must be checked in ISE Design Suite or the approved AMD FPGA tool flow rather than inferred from logic-cell count alone.

This 256-ball BGA package requires a multilayer PCB with controlled escape routing and package-specific ball assignment. Pinout details, configuration requirements, bank voltage limits, decoupling, and differential-pair rules must come from the official Spartan-6 documentation and package files. The available web results do not provide a genuine manufacturer PDF URL, a complete verified ball map, lifecycle notice, or qualified pricing table, so those fields remain unverified.

This page consolidates the supplied distributor specifications, comparison candidates, sourcing observations, and design cautions. It adds engineering context around package migration, speed-grade differences, timing validation, and BGA layout while clearly separating verified facts from data that still requires manufacturer-document confirmation.

جایگزین‌های drop-in برای XC6SLX9-3FT256I — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.

گونه‌ها در این سری

مدل‌های هم‌سری که جایگزین مستقیم هستند برای XC6SLX9-3FT256I (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Speed Grade, Device Type, Operating Temperature, Logic Cells.

AMD
Package: 256-FTBGA (FT256), 17 x 17 mm, 1.0 mm pitch
Speed Grade: -2
Operating Temperature: -40C to +100C (Industrial, I suffix)
مقایسه با XC6SLX9-3FT256I →
AMD
Package: FTBGA-256 (17 x 17 mm, 1.0 mm pitch)
Speed Grade: -2
Operating Temperature: -40C to +100C (Industrial)
مقایسه با XC6SLX9-3FT256I →
Xilinx
Package: 256-ball LBGA
Speed Grade: -1L
Device Type: Field-Programmable Gate Array (FPGA)
مقایسه با XC6SLX9-3FT256I →
AMD
Package: 256-LBGA
Device Type: Spartan-6 LX Field Programmable Gate Array (FPGA)
مقایسه با XC6SLX9-3FT256I →

XC6SLX9-2FT256I

✅ جایگزین مستقیم
AMD
📦 FTBGA-256
Spartan-6 LX · 9,152 · 589,824 (576 Kb) · 186 · 16 · 1,430 · 1,430 · 45 nm CMOS

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

XC6SLX9-2FTG256I

✅ جایگزین مستقیم
AMD
📦 FTBGA-256
Spartan-6 LX · 9,152 · 186 · 5,760 (6-input) · 90 blocks / 589,824 bits (~576 Kb) · 32 (DSP48A1) · 667 MHz · 1.2 V

برای قیمت تماس بگیرید

مشاهده دیتاشیت ←

XC6SLX9-3FTG256I

✅ جایگزین مستقیم
📦 FTBGA-256
Retains the -3 speed grade and 256-ball package class while changing the FT256 ordering code to FTG256; exact electrical and ball-map equivalence requires official package verification.

📋 جایگزین مرجع (خارج از کاتالوگ)

XC6SLX9-3FTG256C

✅ جایگزین مستقیم
📦 FTBGA-256
Retains the -3 speed grade and 256-ball package class but uses the FTG256 ordering code and commercial-grade designation rather than the target industrial-grade designation.

📋 جایگزین مرجع (خارج از کاتالوگ)

XC6SLX9-3FT256I حداکثر مقادیر مجاز و مشخصات الکتریکی

Device Type Field Programmable Gate Array
FPGA Family Spartan-6 LX
Logic Cells 9,152 cells
Configurable Logic Blocks 715 CLBs
Internal Frequency 667 MHz
I/O Sites 186 I/O
Process Technology 45 nm CMOS
ولتاژ تغذیه 1.2 V
دمای کاری 0°C to 85°C
Temperature Grade Industrial
Package Type FTBGA-256
Package Dimensions 17 mm x 17 mm
Package Pitch 1 mm
Terminal Count 256 balls
نوع نصب Surface Mount
Speed Grade -3
Spartan-6 LX Speed-Grade Position -3 has the highest performance
Package Outline MS-034

راهنمای پیکربندی پین XC6SLX9-3FT256I ms-034

پیکربندی پین برای XC6SLX9-3FT256I (پکیج ms-034). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.

نمودار پین‌آوت پکیج ms-034 برای XC6SLX9-3FT256I

داده پین‌آوت تفصیلی موجود نیست برای XC6SLX9-3FT256I.

به دیتاشیت برای پیکربندی کامل پین‌ها.

کاربردهای معمول

XC6SLX9-3FT256I مناسب است برای 6 کاربردs: Industrial Control Systems, Data Acquisition and Instrumentation, Communications Gateways, Sensor Processing and Edge Logic, Video and Imaging Control, Embedded Programmable Control.

🏭

Industrial Control Systems

The XC6SLX9-3FT256I fits compact industrial controllers because it combines 9,152 logic cells, 715 CLBs, and 186 I/O sites in an industrial-temperature 0°C to 85°C device. Those resources can support state machines, interlocks, counters, communications, and signal-acquisition logic without committing the design to an ASIC. The -3 speed grade also favors designs that need more timing margin than lower grades. Engineers should assign pins against the official FT256 package file, bank power requirements, and exact industrial availability rather than relying on distributor aliases.

📊

Data Acquisition and Instrumentation

The XC6SLX9-3FT256I can implement parallel acquisition control, digital filtering, calibration tables, and test sequencing where deterministic programmable logic is useful. Its 186 I/O sites provide substantial board-level connectivity, while the -3 grade is the highest-performance Spartan-6 LX option cited in the verified data. For analog front ends, the FPGA should operate alongside suitable converters and interface components. Exact sampling throughput, pin standards, clocking, and timing closure must be demonstrated in the selected AMD tool flow and against the official device documentation.

🌐

Communications Gateways

The XC6SLX9-3FT256I is suitable for protocol conversion and communications buffering because its 9,152 logic cells can support parallel datapaths, finite-state machines, framing logic, and supervisory interfaces. A gateway design could pair it with differential line transceivers for industrial links or a transceiver for Ethernet-facing physical layers. The 1.2 V supply information is device-level and does not define every I/O bank voltage. Engineers must therefore verify bank assignments, transceiver logic levels, clock domains, impedance, and timing before releasing a board.

🧩

Sensor Processing and Edge Logic

The XC6SLX9-3FT256I can act as a deterministic sensor-processing front end for digital sensors, counters, timing blocks, and local decision logic. Its 186 I/O sites support multiple digital channels, while programmable fabric allows filtering and protocol conversion to coexist in one FPGA. The industrial temperature range supports uncased or controlled-enclosure designs within the stated limits, although measured board self-heating must remain inside the supported range. Analog sensor conditioning still requires suitable amplifiers, ADC parts, protection, grounding, and calibration.

📺

Video and Imaging Control

The XC6SLX9-3FT256I can serve as an imaging-system timing, control, and interface FPGA when image data is segmented into manageable parallel paths. The 186 I/O sites and -3 grade can assist with pixel timing, line and frame control, data capture, crop or format logic, and downstream memory traffic. It is not enough alone to determine a supported video resolution or frame rate; data-path width, external memory speed, I/O standards, clocking, and timing closure establish real throughput. The package and bank assignments must be reviewed against the selected sensor and display interfaces.

⚡

Embedded Programmable Control

The XC6SLX9-3FT256I is useful where a microcontroller alone would make deterministic control or parallel logic difficult. It can implement timers, PWM generation, motor-step sequencing, fault handling, and custom accelerators around a host processor, while its 9,152 logic cells remain sufficient only after checking memory and hard-resource use. The supplied 667 MHz figure is an indexed device value, not a guaranteed system clock. Clock-generation choices, I/O timing, motor-drive isolation, and safety behavior must be designed and validated as a complete motor-control system.

What is the XC6SLX9-3FT256I?
The XC6SLX9-3FT256I is an AMD / Xilinx Spartan-6 LX FPGA with 9,152 logic cells, 715 configurable logic blocks, 186 I/O sites, and a 667 MHz indexed internal frequency. According to the supplied Mouser and DigChip product data, it is a 45 nm CMOS programmable-logic device in a 256-ball FTBGA package. Its -3 suffix identifies the highest-performance Spartan-6 LX speed grade described by the manufacturer-related search result.
What package does the XC6SLX9-3FT256I use?
The XC6SLX9-3FT256I uses a 256-ball FTBGA package measuring 17 mm by 17 mm with a 1 mm pitch. The supplied distributor specifications identify package code FTBGA-256 and mechanical outline MS-034, while other results describe the same package as LBGA or PBGA256. Engineers should use the official Spartan-6 package files for ball locations because the supplied web results do not contain a complete verified pin map.
Where can I download the XC6SLX9-3FT256I datasheet PDF?
The official AMD Spartan-6 package-pinout page is the appropriate starting point for XC6SLX9-3FT256I documentation because it provides package files and related device information. The supplied search results also link to third-party datasheet mirrors, but no genuine AMD-hosted PDF URL appears in the verified data. Download and archive the current official product documentation and package files before approving a new design.
Where can I find the XC6SLX9-3FT256I pinout?
The XC6SLX9-3FT256I pinout must be taken from AMD's official Spartan-6 package device pinout files rather than inferred from distributor listings. The supplied results confirm a 256-ball FTBGA-256 package but do not provide all 256 verified ball names. The package file should be checked against the exact FT256 package and device family before assigning constraints or checking power-bank compatibility.
How many I/O sites and logic cells does the XC6SLX9-3FT256I have?
The XC6SLX9-3FT256I has 186 I/O sites and 9,152 configurable logic cells organized into 715 CLBs, according to the supplied distributor comparison data. These figures define the device's gross programmable capacity, not guaranteed utilization for a selected design. Actual resource use depends on the architecture, memories, DSP blocks, clocking, pin constraints, timing targets, and selected I/O standards.
Is XC6SLX9-3FT256I suitable for industrial applications?
The XC6SLX9-3FT256I is suitable in principle for industrial-temperature applications because the supplied specifications assign it a 0°C to 85°C operating range and an industrial temperature grade. Final suitability also depends on system airflow, board temperature, power integrity, configuration reliability, lifecycle requirements, and compliance targets. Those enclosure and procurement criteria cannot be confirmed from the supplied snippets alone.
What can replace the XC6SLX9-3FT256I?
The closest verified candidates are AMD / Xilinx XC6SLX9 speed- and package-related Spartan-6 LX variants, but a true drop-in replacement requires exact FT256 package, ball compatibility, voltage, configuration, speed, temperature, and lifecycle validation. The supplied cross-reference data identifies XC6SLX9-2FT256I, XC6SLX9-2FTG256I, and XC6SLX9-3FTG256I for comparison without explicitly confirming every replacement condition. A PCB migration should therefore begin with official package and bitstream analysis.
What is the best AMD / Xilinx equivalent for XC6SLX9-3FT256I?
The best practical same-family candidate must preserve the Spartan-6 LX device, FT256 footprint, industrial temperature requirement, and required performance. The supplied AMD support search concerns XC6SLX9-2FT256I and XC6SLX9-2FTG256I replacements without PCB changes, while comparison results also list XC6SLX9-3FTG256C. None is labeled here as guaranteed drop-in because the verified excerpts do not establish identical ball mapping, pin behavior, supply rails, and bitstream compatibility.
XC6SLX9-3FT256I vs XC6SLX9-2FT256I: which is better?
XC6SLX9-3FT256I is the better choice when the design needs the higher -3 Spartan-6 LX performance grade. The supplied comparison records both as 9,152-cell CMOS devices in the same broad 256-pin FTBGA family, while identifying -3 as the highest-performance grade. XC6SLX9-2FT256I may be considered for cost or availability only after verifying exact package, timing, ballout, and lifecycle requirements.
XC6SLX9-3FT256I vs XC6SLX9-3FTG256I: which should I choose?
Choose XC6SLX9-3FTG256I only if official documentation confirms exact pin compatibility and acceptable device differences for the target design. The supplied comparison data groups both as Spartan-6 LX devices with 9,152 cells and a 256-ball package class, but it also uses different FT256 and FTG256 ordering codes. Those suffixes must not be assumed interchangeable without an AMD package cross-reference and successful constraint, timing, and bitstream checks.
What are the key specifications of XC6SLX9-3FT256I?
The XC6SLX9-3FT256I combines 9,152 logic cells, 715 CLBs, 186 I/O sites, a 667 MHz indexed internal frequency, 45 nm CMOS fabrication, and a 1.2 V supply in a 17 mm x 17 mm FTBGA-256 package. According to the supplied Mouser, DigChip, FindIC, and Jotrin results, it is an industrial-temperature Spartan-6 LX device. These are headline capacity and speed indicators, while memory, DSP, timing, and pin details still require official documentation.
Where to buy XC6SLX9-3FT256I online?
XC6SLX9-3FT256I can be found through the supplied Mouser product page, Octopart aggregation page, FPGACenter listing, and other distributor links. FPGACenter reported 1.566 units in stock and a starting price of $50.64 when the source was retrieved on 2026-10-22. Stock and pricing can change quickly, so request a written quotation and traceability confirmation before committing production quantities.
What is the price of XC6SLX9-3FT256I?
The lowest verified source price supplied for XC6SLX9-3FT256I is $50.64 from FPGACenter, as of 2026-10-22. Octopart states that three distributors were being compared, but the excerpt does not provide their individual prices. The published tier values in this record retain $50.64 as a uniform reference because no verified quantity-break schedule was supplied; they are not guaranteed volume quotations.
What is the lead time for XC6SLX9-3FT256I?
The verified lead time for XC6SLX9-3FT256I is not available. FPGACenter reported 1.566 units in stock on 2026-10-22, but a small distributor stock position does not establish future availability, production allocation, or a supported lifecycle horizon. Obtain manufacturer distribution status and a written lead-time quotation before treating the component as suitable for a new production program.
Is XC6SLX9-3FT256I in stock?
FPGACenter reported 1.566 units of XC6SLX9-3FT256I in stock when the verified search was fetched on 2026-10-22, and its starting price was $50.64. Mouser and Octopart also expose purchase or comparison pages, but the supplied excerpts do not explicitly state their inventory quantities. Because FPGA stock is volatile and counterfeits are possible, confirm availability, factory traceability, date code, and authorized-channel documentation before purchase.

داده‌های مرجع مهندسی برای XC6SLX9-3FT256I — مقایسه، راهنمای طراحی و اطلاعات انطباق.

راهنمای انتخاب

Choose XC6SLX9-3FT256I when the design specifically requires the Spartan-6 LX 9,152-cell device, the -3 performance grade, 186 I/O sites, and an industrial-temperature 256-ball package. XC6SLX9-2FT256I is the nearest lower-speed same-family candidate and may be preferable only when cost or availability outweighs timing margin. XC6SLX9-2FTG256I changes both speed grade and ordering code, so it requires closer package and timing validation. XC6SLX9-3FTG256I preserves the -3 grade but changes FT256 to FTG256; compare official package files before treating it as a drop-in part. XC6SLX9-3FTG256C is commercial-grade and therefore less suitable when the target's verified 0°C to 85°C industrial range matters. No foreign-manufacturer cross-brand replacement is included because the verified cross-reference data does not establish one. Final selection should also consider authorized-channel availability, lifecycle commitments, software support, configuration compatibility, and successful timing, I/O, power, and system-level validation.

مقایسه با جایگزین‌ها

پارامتر این محصول XC6SLX9-2FT256I XC6SLX9-2FTG256I XC6SLX9-3FTG256I XC6SLX9-3FTG256C
Brand AMD AMD AMD AMD AMD
Package FTBGA-256 FTBGA-256 FTBGA-256 package class FTBGA-256 package class FTBGA-256 package class
FPGA Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Speed Grade -3 -2 -2 -3 -3

تفاوت‌های کلیدی

  • Highest identified Spartan-6 LX speed grade (در مقابلXC6SLX9-2FT256I)
  • Industrial-grade device designation (در مقابلXC6SLX9-3FTG256C)
  • Exact 256-pin FT256 ordering code (در مقابلXC6SLX9-3FTG256I)

یادداشت‌های طراحی

Treat the FTBGA-256 land pattern as a constrained high-density escape-routing problem. The verified package is 17 mm x 17 mm with 1 mm pitch, so board stackup, microvia capability, solder-mask definition, assembly process, and ball-to-pad mapping require controlled PCB-library data. Use the official AMD Spartan-6 package files rather than converting an FBGA symbol from a generic library. Complete escape routing, fanout, length matching, and power-plane continuity reviews before fabrication.

The supplied 1.2 V value is the device supply figure, but XC6SLX9 boards commonly need multiple regulated rails and voltage-aware I/O banks; their exact values are not present in the verified excerpts. Do not assign VCCO or other bank supplies by analogy. Follow the official Spartan-6 pinout and power guide to select regulators, set current margin, define power-up sequencing, and place stable decoupling at the relevant supply balls and configuration pins.

Do not treat FT256, FTG256, and generic PBGA256 or LBGA256 descriptions as confirmed identical pinouts. Before substituting any listed alternative, compare official package drawings, ball maps, power balls, configuration pins, I/O standards, speed grade, temperature grade, supported tools, and bitstream status. The verified snippets establish family and package-class similarities, but they do not contain complete ball maps; final equivalence must therefore be signed off through constraint import, timing analysis, hardware bring-up, and system regression tests.

The 667 MHz indexed frequency is not permission to use a 667 MHz board clock without timing and signal-integrity analysis. Assign clock-capable pins, inspect clock-routing requirements, define external memory or source-synchronous interfaces, and simulate edge rates, return paths, stubs, series termination, and layer transitions where applicable. Differential interfaces require the exact I/O standard and bank voltage from official documentation; both are unavailable in the supplied excerpts and must not be guessed.

اطلاعات انطباق

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
بدون سرب
Unknown
بدون هالوژن
Unknown
مواد معدنی درگیری
Unknown

The verified excerpts do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is treated as not applicable because this is an FPGA rather than an automotive-qualified device; the industrial temperature grade does not itself establish AEC-Q100 qualification.

تاریخ تأیید داده‌ها: 2026-10-22 — داده‌ها توسط تیم مهندسی قطعات XAIPART تأیید و گردآوری شده است

جستجوهای مرتبط

XC6SLX9-3FT256I XC6SLX9-3FT256I datasheet PDF AMD XC6SLX9-3FT256I FPGA XC6SLX9-3FT256I FTBGA-256 pinout XC6SLX9 9152 cell FPGA XC6SLX9-3FT256I industrial temperature XC6SLX9-3FT256I vs XC6SLX9-2FT256I XC6SLX9-3FT256I drop-in replacement Spartan-6 LX industrial controller FPGA Spartan-6 LX data acquisition FPGA XC6SLX9-3FT256I price XC6SLX9-3FT256I buy online XC6SLX9-3FT256I lead time What can replace XC6SLX9-3FT256I? Where to find XC6SLX9-3FT256I pinout?

قطعات و اصطلاحات مرتبط

AMD AMD / Xilinx XC6SLX9-3FT256I XC6SLX9-2FT256I XC6SLX9-2FTG256I XC6SLX9-3FTG256I XC6SLX9-3FTG256C Spartan-6 LX FPGA field-programmable gate array programmable logic CPLD ASIC semiconductor logic cell configurable logic block CLB I/O site speed grade 45 nm CMOS 1.2 V FTBGA-256 BGA surface mount industrial temperature grade
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