XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx
MPN： XC6SLX9-3FT256I ✓ 啟用中XC6SLX9-3FT256I 概覽
An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are defined after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, alongside CPLDs and ASICs. Unlike a fixed-function ASIC, an FPGA can accommodate multiple digital interfaces and control functions, but timing, resource allocation, pin constraints, and power behavior must be validated in the selected design tools.
The XC6SLX9 combines 9,152 logic cells, 715 CLBs, and 186 I/O sites. The -3 suffix identifies the highest-performance Spartan-6 LX speed grade cited in the supplied results. The FT256 package is a 17 mm by 17 mm FTBGA with 1 mm pitch, while the trailing I denotes the industrial temperature grade. One supplied source reports a 862 MHz figure, while another reports 667 MHz; this record uses the explicitly indexed 667 MHz value and does not treat the conflicting figure as an additional verified rating.
Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, sensor processing, and general-purpose digital signal conditioning. The 186-I/O count can support parallel control buses, counters, status inputs, communications interfaces, and external memory connections when pin multiplexing and timing permit. Resource utilization must be checked in ISE Design Suite or the approved AMD FPGA tool flow rather than inferred from logic-cell count alone.
This 256-ball BGA package requires a multilayer PCB with controlled escape routing and package-specific ball assignment. Pinout details, configuration requirements, bank voltage limits, decoupling, and differential-pair rules must come from the official Spartan-6 documentation and package files. The available web results do not provide a genuine manufacturer PDF URL, a complete verified ball map, lifecycle notice, or qualified pricing table, so those fields remain unverified.
This page consolidates the supplied distributor specifications, comparison candidates, sourcing observations, and design cautions. It adds engineering context around package migration, speed-grade differences, timing validation, and BGA layout while clearly separating verified facts from data that still requires manufacturer-document confirmation.
直接替換替代品，適用於 XC6SLX9-3FT256I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： XC6SLX9-3FT256I （相同外形與佔位） — 差異在於 Package, Speed Grade, Device Type, Operating Temperature, Logic Cells.
XC6SLX9-2FT256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX9-2FTG256I
✅ 直接替換聯絡詢價
查看資料表 →XC6SLX9-3FTG256I
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX9-3FTG256C
✅ 直接替換📋 參考替代品（不在目錄中）
XC6SLX9-3FT256I 最大額定值與電氣特性
| Device Type | Field Programmable Gate Array |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 9,152 cells |
| Configurable Logic Blocks | 715 CLBs |
| Internal Frequency | 667 MHz |
| I/O Sites | 186 I/O |
| Process Technology | 45 nm CMOS |
| 供應電壓 | 1.2 V |
| 工作溫度 | 0°C to 85°C |
| Temperature Grade | Industrial |
| Package Type | FTBGA-256 |
| Package Dimensions | 17 mm x 17 mm |
| Package Pitch | 1 mm |
| Terminal Count | 256 balls |
| 安裝類型 | Surface Mount |
| Speed Grade | -3 |
| Spartan-6 LX Speed-Grade Position | -3 has the highest performance |
| Package Outline | MS-034 |
XC6SLX9-3FT256I ms-034 腳位配置指南
XC6SLX9-3FT256I（ms-034 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： XC6SLX9-3FT256I.
請參閱 資料表 以查看完整腳位配置。
典型應用
XC6SLX9-3FT256I 適用於 6 應用s: Industrial Control Systems, Data Acquisition and Instrumentation, Communications Gateways, Sensor Processing and Edge Logic, Video and Imaging Control, Embedded Programmable Control.
Industrial Control Systems
The XC6SLX9-3FT256I fits compact industrial controllers because it combines 9,152 logic cells, 715 CLBs, and 186 I/O sites in an industrial-temperature 0°C to 85°C device. Those resources can support state machines, interlocks, counters, communications, and signal-acquisition logic without committing the design to an ASIC. The -3 speed grade also favors designs that need more timing margin than lower grades. Engineers should assign pins against the official FT256 package file, bank power requirements, and exact industrial availability rather than relying on distributor aliases.
推薦
Data Acquisition and Instrumentation
The XC6SLX9-3FT256I can implement parallel acquisition control, digital filtering, calibration tables, and test sequencing where deterministic programmable logic is useful. Its 186 I/O sites provide substantial board-level connectivity, while the -3 grade is the highest-performance Spartan-6 LX option cited in the verified data. For analog front ends, the FPGA should operate alongside suitable converters and interface components. Exact sampling throughput, pin standards, clocking, and timing closure must be demonstrated in the selected AMD tool flow and against the official device documentation.
推薦
Communications Gateways
The XC6SLX9-3FT256I is suitable for protocol conversion and communications buffering because its 9,152 logic cells can support parallel datapaths, finite-state machines, framing logic, and supervisory interfaces. A gateway design could pair it with differential line transceivers for industrial links or a transceiver for Ethernet-facing physical layers. The 1.2 V supply information is device-level and does not define every I/O bank voltage. Engineers must therefore verify bank assignments, transceiver logic levels, clock domains, impedance, and timing before releasing a board.
推薦
Sensor Processing and Edge Logic
The XC6SLX9-3FT256I can act as a deterministic sensor-processing front end for digital sensors, counters, timing blocks, and local decision logic. Its 186 I/O sites support multiple digital channels, while programmable fabric allows filtering and protocol conversion to coexist in one FPGA. The industrial temperature range supports uncased or controlled-enclosure designs within the stated limits, although measured board self-heating must remain inside the supported range. Analog sensor conditioning still requires suitable amplifiers, ADC parts, protection, grounding, and calibration.
推薦
Video and Imaging Control
The XC6SLX9-3FT256I can serve as an imaging-system timing, control, and interface FPGA when image data is segmented into manageable parallel paths. The 186 I/O sites and -3 grade can assist with pixel timing, line and frame control, data capture, crop or format logic, and downstream memory traffic. It is not enough alone to determine a supported video resolution or frame rate; data-path width, external memory speed, I/O standards, clocking, and timing closure establish real throughput. The package and bank assignments must be reviewed against the selected sensor and display interfaces.
推薦
Embedded Programmable Control
The XC6SLX9-3FT256I is useful where a microcontroller alone would make deterministic control or parallel logic difficult. It can implement timers, PWM generation, motor-step sequencing, fault handling, and custom accelerators around a host processor, while its 9,152 logic cells remain sufficient only after checking memory and hard-resource use. The supplied 667 MHz figure is an indexed device value, not a guaranteed system clock. Clock-generation choices, I/O timing, motor-drive isolation, and safety behavior must be designed and validated as a complete motor-control system.
推薦
推薦產品摘要
工程參考資料，適用於 XC6SLX9-3FT256I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | XC6SLX9-2FT256I | XC6SLX9-2FTG256I | XC6SLX9-3FTG256I | XC6SLX9-3FTG256C |
|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD |
| Package | FTBGA-256 | FTBGA-256 | FTBGA-256 package class | FTBGA-256 package class | FTBGA-256 package class |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | -3 | -2 | -2 | -3 | -3 |
主要差異化特點
- Highest identified Spartan-6 LX speed grade (對比XC6SLX9-2FT256I)
- Industrial-grade device designation (對比XC6SLX9-3FTG256C)
- Exact 256-pin FT256 ordering code (對比XC6SLX9-3FTG256I)
設計說明
Treat the FTBGA-256 land pattern as a constrained high-density escape-routing problem. The verified package is 17 mm x 17 mm with 1 mm pitch, so board stackup, microvia capability, solder-mask definition, assembly process, and ball-to-pad mapping require controlled PCB-library data. Use the official AMD Spartan-6 package files rather than converting an FBGA symbol from a generic library. Complete escape routing, fanout, length matching, and power-plane continuity reviews before fabrication.
The supplied 1.2 V value is the device supply figure, but XC6SLX9 boards commonly need multiple regulated rails and voltage-aware I/O banks; their exact values are not present in the verified excerpts. Do not assign VCCO or other bank supplies by analogy. Follow the official Spartan-6 pinout and power guide to select regulators, set current margin, define power-up sequencing, and place stable decoupling at the relevant supply balls and configuration pins.
Do not treat FT256, FTG256, and generic PBGA256 or LBGA256 descriptions as confirmed identical pinouts. Before substituting any listed alternative, compare official package drawings, ball maps, power balls, configuration pins, I/O standards, speed grade, temperature grade, supported tools, and bitstream status. The verified snippets establish family and package-class similarities, but they do not contain complete ball maps; final equivalence must therefore be signed off through constraint import, timing analysis, hardware bring-up, and system regression tests.
The 667 MHz indexed frequency is not permission to use a 667 MHz board clock without timing and signal-integrity analysis. Assign clock-capable pins, inspect clock-routing requirements, define external memory or source-synchronous interfaces, and simulate edge rates, return paths, stubs, series termination, and layer transitions where applicable. Differential interfaces require the exact I/O standard and bank voltage from official documentation; both are unavailable in the supplied excerpts and must not be guessed.
合規資訊
The verified excerpts do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is treated as not applicable because this is an FPGA rather than an automotive-qualified device; the industrial temperature grade does not itself establish AEC-Q100 qualification.
