XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD
MPN: XC6SLX9-2FT256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $43.45 | $43.45 |
| 10 | $38.5 | $385.00 |
| 100 | $31.2 | $3,120.00 |
| 500 | $26.85 | $13,425.00 |
| 1,000 | $23.1 | $23,100.00 |
XC6SLX9-2FT256I Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, complemented by hardened peripherals such as block RAM, DSP slices, PLLs, and transceivers. FPGAs sit between standard logic ICs and ASICs in the programmable logic hierarchy: unlike ASICs they require no mask set and can be reconfigured in-circuit, while offering far higher density and performance than discrete CPLDs. The Spartan-6 LX family targets cost-sensitive, high-volume applications by integrating common system functions (memory controllers, PCIe, Ethernet MAC) into the silicon.
Key features of the XC6SLX9-2FT256I include 16 DSP48A1 slices for fixed- and floating-point arithmetic, 16 Logic Slices per CLB with carry-chain support, dedicated block RAM supporting dual-port operation, and SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL I/O standards. The device includes 2 PLL clock managers and supports up to 667 MHz internal operation, making it suitable for digital signal processing, motor control, video bridging, and embedded control planes.
The -2 speed grade balances the highest performance with the lowest power consumption across the Spartan-6 LX family. Power management is enabled through a 1.2 V core supply, a separate auxiliary supply, and an I/O supply that can be set independently from 1.2 V to 3.3 V, allowing direct interface to legacy 5 V-tolerant buses through external clamping. Configuration is supported via JTAG (IEEE 1149.1 / IEEE 1532), SPI, BPI, and the dedicated Xilinx multi-boot modes.
Typical applications include industrial motor drives, factory automation controllers, medical imaging pre-processing, broadcast video processing, low-density telecommunications line cards, and embedded control planes in avionics and defense systems. The 256-FTBGA package suits designs that need high I/O count (186 user I/Os) on a moderate PCB area while keeping JTAG-driven configuration simple.
When designing with this FPGA, ensure decoupling follows the Spartan-6 PCB Design Guide (UG393), with a 1.0 uF + 0.01 uF pair per supply pin placed within 5 mm of the BGA ball. JTAG chain integrity must be checked at low temperature to avoid boundary-scan failures at industrial cold-start. For long-life programs requiring multi-decade supply continuity, plan a migration path now because Spartan-6 is in long-term support but not recommended for new designs.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the AMD datasheet alone, helping procurement and hardware engineers verify availability and select a pin-compatible alternative for long-life designs.
Drop-in alternatives for XC6SLX9-2FT256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with XC6SLX9-2FT256I (same form factor and footprint) — differing in Package, DSP48A1 Slices, Logic Cells, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC6SLX9-2FTG256I
✅ Drop-In✓ In Stock
$21.75 / Unit
View Datasheet →XC6SLX16-2FT256I
✅ Drop-In✓ In Stock
$63.85 / Unit
View Datasheet →XC6SLX25-2FT256I
✅ Drop-In✓ In Stock
$58.1 / Unit
View Datasheet →XC6SLX9-3FT256I
✅ Drop-In📋 Reference alternative (not in catalog)
XC6SLX9-2FT256I Maximum Ratings & Electrical Characteristics
| Family | Spartan-6 LX |
| Device Logic Cells | 9,152 |
| Block RAM (bits) | 589,824 (576 Kb) |
| Number of User I/Os | 186 |
| DSP48A1 Slices | 16 |
| Logic Slices | 1,430 |
| Number of CLBs | 1,430 |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Auxiliary Supply Voltage | 3.3 V |
| I/O Supply Voltage | 1.2 V to 3.3 V |
| Speed Grade | -2 |
| Maximum Internal Frequency | 667 MHz |
| Number of PLLs | 2 (CMTs) |
| Package | 256-FTBGA (FT256), 17 x 17 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial, I suffix) |
| Configuration Modes | JTAG, SPI, BPI, MultiBoot, SelectMAP |
| Configuration Bitstream Size | 2.7 Mb typical |
| MSL Moisture Sensitivity | Level 3 (per JEDEC J-STD-020) |
| RoHS Compliance | Compliant |
| Lead-Free / Pb-Free | Yes |
| Halogen Free | Yes |
XC6SLX9-2FT256I 256-ftbga (ft256), 17 x 17 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for XC6SLX9-2FT256I (256-ftbga (ft256), 17 x 17 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC6SLX9-2FT256I.
Refer to the datasheet for full pin configuration.
Typical Applications
XC6SLX9-2FT256I is suitable for 6 applications: Industrial Motor Drive Controller, Factory Automation PLC Backplane, Broadcast Video Processing and Bridging, Medical Imaging Pre-Processing Pipeline, Low-Density Telecommunications Line Card, Embedded Control Plane in Avionics and Defense.
Industrial Motor Drive Controller
The XC6SLX9-2FT256I is well suited for industrial motor drive controllers because its 16 DSP48A1 slices deliver 18x18 multipliers and dedicated accumulators needed for field-oriented control (FOC) and space-vector PWM (SVPWM) math, while the 576 Kb block RAM stores per-cycle lookup tables for sinusoidal modulation. The 186 user I/Os drive PWM channels, encoder feedback, and gate-driver signals directly from the FT256 BGA without external logic. With the industrial -40C to +100C temperature grade it withstands cabinet environments, and the 1.2 V core supply keeps dissipation low under continuous switching at 20 kHz PWM. The Spartan-6 SelectIO supports LVDS feedback from encoders at speeds beyond 50 MHz.
Recommended
Factory Automation PLC Backplane
For factory automation PLC and remote I/O backplane designs, the XC6SLX9-2FT256I provides 9,152 logic cells and 186 I/Os which match the typical I/O count of a 32-channel industrial PLC with two expansion buses. The Spartan-6 multi-boot feature lets the controller fall back to a known-good image during field firmware updates, critical for unattended factory cabinets. The FT256 BGA exposes dedicated 3.3 V VCCAUX rails for hot-swap transceivers and SelectIO ports configured for RS-485. Compared with a CPLD, the LX9 adds deterministic DSP for PID loops running at 100 microsecond periods, eliminating the need for a companion DSP.
Recommended
Broadcast Video Processing and Bridging
The XC6SLX9-2FT256I fits broadcast video processing and bridging because its 186 I/Os can drive parallel RGB/YUV buses at 1080p60 (148.5 MHz pixel clock), and the SelectIO supports LVDS-25 and SSTL-18 for direct HDMI/SDI bridge implementations. The 16 DSP48A1 slices process real-time scaling, color-space conversion, and chroma keying at full 1080p line rate. Block RAM double-buffered with DSP slices eliminates external SDRAM for simpler bridges, reducing BOM and PCB layers. The FT256 BGA is compatible with Spartan-6 LX16 and LX25 upward, so designs can scale resolution by switching die without PCB rework.
Recommended
Medical Imaging Pre-Processing Pipeline
In medical imaging such as ultrasound beamforming and endoscopy front-ends, the XC6SLX9-2FT256I is preferred because the 16 DSP48A1 slices compute parallel FIR filters for beam-forming channels at sample rates up to 40 MHz, and the 576 Kb block RAM stores per-channel delay-line taps. The industrial -40C to +100C temperature range ensures operation in sterilizable enclosures. The Spartan-6 SelectIO supports LVDS inputs from ultrasound transducer preamplifiers directly, eliminating external deserializer parts. This FPGA integrates DSP, memory, and control logic into one BGA, simplifying IEC 60601-1 compliance because only one supply domain crosses the isolation barrier.
Recommended
Low-Density Telecommunications Line Card
The XC6SLX9-2FT256I suits low-density telecom line cards where its 186 I/Os map to a single T1/E1 or four E1 framers plus control-plane GPIO, and the integrated GTP transceivers are not required at this density. Spartan-6 block RAM supports look-up-table-based packet classification and traffic shaping without external TCAM. The industrial temperature grade fits outdoor equipment cabinets with ambient swings from -40C to +70C. Compared with a Spartan-6 LXT, the LX variant saves cost and power when transceivers are not needed, while keeping the FT256 PCB compatible for later LXT migration.
Recommended
Embedded Control Plane in Avionics and Defense
For avionics and defense embedded control planes, the XC6SLX9-2FT256I delivers deterministic 667 MHz internal operation with hardware watchdog, SelectIO MIL-STD-1553 stub support, and rugged FT256 packaging suitable for vibration-prone backplanes. The -40C to +100C industrial temperature grade and lead-free halogen-free material set satisfy many platform requirements. Spartan-6 is included in long-term AMD support programs through the next decade, making it suitable for 20-year lifecycle programs when migration timing is planned today. For new programs, AMD recommends Spartan-7 or Kintex-7 for additional security features and longer-term availability.
Recommended
Recommended Products Summary
Engineering reference data for XC6SLX9-2FT256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC6SLX9-2FTG256I | XC6SLX16-2FT256I | XC6SLX25-2FT256I | XC6SLX9-3FT256I |
|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 256-FTBGA (FT256), 17x17 mm, 1.0 mm pitch | 256-FTBGA (FT256) - same | 256-FTBGA (FT256) - same | 256-FTBGA (FT256) - same | 256-FTBGA (FT256) - same |
| Logic Cells | 9,152 | 9,152 | 14,579 | 24,051 | 9,152 |
| Block RAM (bits) | 589,824 (576 Kb) | 589,824 | 1,167,872 | 1,310,720 | 589,824 |
| DSP48A1 Slices | 16 | 16 | 32 | 38 | 16 |
| User I/Os | 186 | 186 | 186 | 186 | 186 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Pb-Free / RoHS | SnPb (non-RoHS variant -I legacy) | Pb-Free RoHS | Pb-Free RoHS | Pb-Free RoHS | Pb-Free RoHS |
Key Differentiators
- Highest logic density available in FT256 FTBGA Spartan-6 LX family (vs XC6SLX9-2FTG256I)
- Scalable upward to LX16 and LX25 on the same PCB (vs XC6SLX16-2FT256I)
- Lower power than the -3 speed grade (vs XC6SLX9-3FT256I)
Design Notes
Estimated: At 100% resource utilization with -2 speed grade running at 250 MHz, the XC6SLX9-2FT256I draws approximately 1.0 A from VCCINT (1.2 V) plus 0.05 A from VCCAUX (3.3 V) plus I/O bank current which scales with toggle rate. Designers should size VCCINT regulator to at least 1.5 A for design margin, and place a 100 uF polymer bulk capacitor at the regulator output with a 1.0 uF + 0.01 uF X7R ceramic pair within 5 mm of every power/ground ball. VCCAUX must remain active during JTAG reconfiguration; never gate it.
The FT256 BGA has 1.0 mm ball pitch which requires 4-layer minimum PCB with microvia-in-pad recommended for breakout. Escape all I/O banks through the top layer only using 0.4 mm laser-drilled microvias; dog-bone fanout is not viable at 1.0 mm pitch with 0.2 mm trace/space. Match length within each SelectIO bank to within 50 mil for SDR interfaces and within 25 mil for DDR interfaces. Reference AMD UG393 Spartan-6 PCB Design Guide.
Estimated: The FT256 BGA has theta-JA of approximately 22 C/W on a 4-layer JEDEC JESD51 test board. At 1.5 W total dissipation (typical mid-utilization design) the junction temperature rises 33 C above ambient, leaving 67 C of headroom to the 100 C industrial limit. At 3 W dissipation (high utilization with -3 speed grade) the rise is 66 C, leaving only 34 C headroom - in this regime a thermal copper pour under the BGA is mandatory.
Do not assume FT256 ballout is identical across LX9/LX16/LX25 - while pin compatibility is officially per DS160 Table 2, certain bank assignments and reference pin functions differ. Always generate a fresh constraints file (.ucf) for each die, and verify all global clock pins against the specific pinout ASCII file from AMD. Failure to do this results in first-prototype JTAG failure at industrial cold start (-40C).
Compliance Information
The XC6SLX9-2FT256I (suffix -I, no G) is the legacy SnPb variant. For RoHS-compliant Pb-free designs choose the XC6SLX9-2FTG256I. Spartan-6 is not AEC-Q100 qualified; choose XA Spartan-6 or 7-series for automotive.
