FPGA & CPLD
Produits (6666)
A3PE600-2FG256 - 600K-Gate Flash FPGA, 165 I/O | Microchip
The Microchip Technology A3PE600-2FG256 is a ProASIC3E flash-based FPGA with 600,000 system gates, 13,824 logic elements, 165 user I/Os, and 110,592 bits of embedded true dual-port SRAM, housed in a 256-ball fine-pitch BGA (FBGA) package with 1.0 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device that implements user-defined digital logic through configurable logic blocks, interconnect routing, and I/O cells programmed after manufacturing. The ProASIC3E family sits within Microchip's broader FPGA hierarchy, below the ProASIC3L and Igloo2 families, and is distinguished by its flash-based programming technology rather than SRAM. Key features include flash-based, nonvolatile configuration that provides live-at-power-up (Level 0) operation without an external configuration device, enabling true single-chip solutions. The 130-nm, 7-layer metal (6 copper) flash-based CMOS process delivers low total cost of ownership. The -2 speed grade supports system-level performance suitable for glue logic, control, and interface bridging functions, and the device is reprogrammable in-system. Technically, the ProASIC3E architecture uses VersaTiles as its universal logic element, with embedded block SRAM organized as true dual-port memory for FIFOs and buffering. On-chip flash switching and routing remove the need for boot PROMs, improving board reliability and startup time compared with SRAM FPGAs. Supply voltage is a 1.5 V core, with commercial operating temperature of 0C to +70C for this standard (non-I) variant. Typical applications include industrial control, communication line cards, test and measurement instrumentation, motor control interfaces, and secure single-chip logic replacement of ASICs and gate arrays in low-to-medium volume production. Design consideration: because configuration is nonvolatile flash, no configuration SPI flash is required, but I/O bank voltage rules and 1.0 mm pitch BGA routing (typically requiring a minimum 6-layer PCB) must be respected in layout. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG256I - ProASIC3E FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-2FG256I is a 600,000-gate ProASIC3E flash-based FPGA with 165 user I/Os, a system performance of up to 310 MHz, and a 1.5V core voltage, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/FPBGA) package qualified for the industrial temperature range of -40C to +85C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that the designer configures after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic devices: FPGA -> flash-based FPGA -> single-chip, non-volatile FPGA. Unlike SRAM FPGAs, ProASIC3E devices store their configuration in on-chip flash, so they power up instantly, require no external configuration ROM, and offer higher resistance to configuration tampering. Key features include the third-generation VersaTile architecture, where each tile functions as a three-input LUT, a D-flip-flop, or a latch with enable, enabling highly efficient fabric utilization. The -2 speed grade balances performance and cost, supporting designs up to 310 MHz. The flash fabric also delivers low total cost of ownership through single-chip integration and reprogrammability. Built on a 130nm flash process, the device integrates embedded memory (110,592 bits per distributor listing as fabric RAM capacity) and supports the ProASIC3E I/O features for interfacing with common single-ended and differential standards. Microchip's Libero SoC design suite supports synthesis, place-and-route, and simulation for this family. Typical applications include industrial automation control, communications line-card glue logic and bridging, aerospace/defense systems favoring non-volatile instant-on FPGAs, and medical instrumentation where configuration flash simplifies the power-up sequence. A key design consideration: distributor data (chipdig) lists this exact speed-grade/temperature suffix as RoHS non-compliant and containing lead. Designers with RoHS mandates should verify the -FGG256 lead-bump variant before finalizing the BOM. This page synthesizes distributor pricing tiers, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-2FG484 is a 600,000-gate ProASIC3E flash-based FPGA with 13,824 logic cells, 270 user I/Os, 110592 bits of embedded RAM, a maximum system frequency of 310 MHz, and 1.5V core operation, housed in a 484-ball FBGA (PBGA) package with 1.00 mm ball pitch. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting above CPLDs in the programmable-logic hierarchy and below ASICs in density. The ProASIC3E family is distinctive because it uses flash technology rather than SRAM: configuration data is stored in on-chip flash cells, so the device is single-chip, instantly starts at power-up, and needs no external configuration PROM. Key features include the 130 nm flash-based CMOS process, 600K system gates, speed grade -2, and reprogrammability without a boot device, which lowers total cost of ownership (TOC). The embedded 110592-bit RAM supports FIFOs and dual-port buffering in data-path designs. Architecturally, ProASIC3E combines VersaTiles (fine-grained logic tiles), flash switches that are inherently non-volatile and radiation-tolerant versus SRAM alternatives, and embedded block RAM, delivering system performance up to 310 MHz on a 1.5V core. Typical applications include industrial automation control, communications and networking line cards, aerospace/defense systems, and medical instrumentation, where instant-on, secure, non-volatile configuration and high I/O count are decisive. Design consideration: the 1.5V core and 484-ball BGA demand careful power-plane design and controlled-impedance PCB stack-up; use Microchip Libero SoC for synthesis, place-and-route, and timing sign-off at the -2 speed grade. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FG484I - 600K-Gate Flash FPGA 484-BGA | Microchip
The Microchip Technology A3PE600-2FG484I is a ProASIC3E flash-based FPGA with 600,000 system gates, 13,824 configurable logic blocks (CLBs), and 270 user I/Os, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package and rated for the industrial temperature range (-40C to +100C). A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that the designer wires together after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses nonvolatile flash cells to store the configuration, so it powers up instantly as a single-chip solution with no external boot PROM and no configuration bitstream to load. Key features include flash-based, live-at-power-up operation, reprogrammability in-system, 1.5V core operation on a 130nm flash process, system performance up to 310 MHz, and low total cost of ownership thanks to the single-chip architecture. The -2 speed grade offers the fastest timing grades available in the ProASIC3E family, supporting high-throughput datapath and interface designs. Technically, the ProASIC3E fabric combines VersaTiles (fine-grained logic tiles) with embedded block SRAM, supporting synchronous FIFOs and dual-port memories. The flash switch architecture also gives inherently lower static power and better SEU robustness than SRAM FPGAs, which matters in industrial and communications equipment. Typical applications include industrial automation control, communications and networking line cards, medical instrumentation, aerospace/defense subsystems, and test equipment glue logic consolidation, where instant-on and high I/O count matter. A key design consideration is power delivery: the 1.5V core rail must be well decoupled, and I/O bank voltages (1.5V to 3.3V) must be planned per bank before pin assignment. This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600-2FGG256 is a ProASIC3E family flash-based FPGA with 600,000 system gates, a system frequency up to 310 MHz, and 165 user I/O, fabricated on a 130nm process with a 1.5V core and housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA/LBGA) package. A flash-based FPGA is a field programmable gate array whose configuration is stored in on-chip flash memory rather than SRAM. Unlike SRAM FPGAs, flash FPGAs are non-volatile and single-chip: they configure instantly at power-up, require no external boot PROM, and are inherently more secure because the bitstream never needs to be loaded externally. Within the programmable logic hierarchy, the A3PE600 sits at the low-to-mid density tier of the ProASIC3E family, below the A3PE1500 and A3PE3000. Key differentiating features include live reprogrammability via on-chip flash, low total cost of ownership through single-chip integration, abundant embedded memory, and support for industrial temperature operation in a compact 17 x 17 mm footprint class package. The speed grade -2 suffix denotes a standard performance bin within the family, supporting system clock rates up to 310 MHz for typical designs. Architecturally, the device is built from a sea of versatile logic elements organized into tiles, with flash switches providing the routing configuration. The ProASIC3E variant adds embedded SRAM blocks, supporting FIFOs and dual-port memories commonly required in data path and interface designs. CMOS flash technology also yields low static power compared to comparable SRAM FPGA architectures. Typical applications include industrial automation controllers, communications and networking interface bridging, test and measurement instrumentation, medical equipment, and aerospace/defense subsystems requiring secure, instant-on programmable logic. When designing with this device, plan power sequencing for the 1.5V core and 3.3V I/O banks, and verify I/O standards and bank assignment against the package pinout in the manufacturer datasheet before board layout. Pricing as of 2026-09-02 starts at approximately $40.70 at LCSC (qty 1). This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2FGG484 - 600K Gate ProASIC3E FPGA 484-BGA | Microchip
The Microchip Technology (Microsemi) A3PE600-2FGG484 is a 600,000-gate ProASIC3E flash-based FPGA built on 130nm CMOS flash technology, offering 270 user I/Os, 110592 bits of configuration resources in a 484-ball Fine-Pitch Ball Grid Array (FBGA, 23x23 mm) package. It operates from a 1.5V core supply (1.425V to 1.575V) with a commercial temperature range of 0C to +85C junction temperature and a speed grade of -2 (up to 310 MHz system performance per distributor data). A flash-based FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), ProASIC3E devices differ from SRAM FPGAs by being single-chip, instantly-on, and inherently secure, since no bitstream is exposed at power-up. Key features of the A3PE600 include non-volatile flash configuration (no external boot device required), 600K system gates, 270 versatile user I/Os supporting multiple single-ended and differential standards, embedded SRAM blocks for on-chip buffering, and low total cost of ownership through single-chip integration and reprogrammability. The 484-ball FBGA package supports surface-mount assembly with a 1.000 mm ball pitch. Technically, the A3PE600 uses Microsemi's proven flash switch and 130nm seven-layer metal flash CMOS process. The VersaTile architecture allows each logic tile to be configured as a 3-input LUT, D-flip-flop, or memory element, delivering high logic utilization. The ProASIC3E variant adds embedded SRAM and supports bus-friendly interfaces typical of bridge and control applications. Typical applications include industrial automation control, motor drive interface logic, communication bridge functions, aerospace sub-systems, test equipment, and secure single-chip control logic where instant-on behavior and configuration security matter. For design-in, ensure the 1.5V core rail is within 1.425V to 1.575V under all load transients, and follow Microchip's power-up sequencing and decoupling guidance in the manufacturer datasheet. This page synthesizes verified distributor data from DigiKey, Mouser, Octopart, and Microchip product pages with drop-in alternatives, comparison tables, and design notes not found in the manufacturer datasheet.
A3PE600-2FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology (Microsemi) A3PE600-2FGG484I is a 600,000-gate ProASIC3E flash-based FPGA with 13,824 configurable logic blocks (CLBs), up to 270 user I/Os, and a -2 speed grade, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA-484, 23 x 23 mm, 1.0 mm ball pitch) in an industrial temperature grade (-40C to +100C). A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory cells rather than SRAM. This places the A3PE600 within the FPGA hierarchy of programmable logic devices, sitting above CPLDs in gate count and below high-end SRAM FPGAs, and contrasts with SRAM FPGAs by needing no external configuration PROM: the single-chip solution boots instantly at power-up, which also reduces total bill-of-materials cost and improves system security. Key features of the A3PE600-2FGG484I include non-volatile FlashX3 processing on a 130 nm CMOS process, single 1.5V core operation, system performance up to approximately 231 MHz, and optional soft ARM support per the ProASIC3E family datasheet. The ProASIC3E family adds embedded flash memory (up to 270 Kbit in this density class, 110592 bits cited by distributors) and supports low-cost ASIC replacement in single-chip designs with reprogrammability. Architecturally, the device uses the Actel/Microchip ProASIC3E sea-of-von Neumann fabric with versatile logic elements, embedded SRAM blocks, and flash configuration cells. The -2 speed grade denotes the fastest commercial binning for this density, and the FG484 package provides 1.0 mm pitch balls for surface-mount assembly. Typical applications include networking and communications line cards, avionics and industrial control logic integration, and consumer or computing systems seeking ASIC-like integration without NRE masks. Design consideration: flash FPGAs cannot be reconfigured as frequently in-circuit as SRAM FPGAs, so plan design iterations through the Libero SoC toolchain and JTAG programming accordingly. This page synthesizes distributor pricing context, same-brand drop-in package variants, and practical design notes not found in the manufacturer datasheet, with pricing references as of 2026-09-02.
A3PE600-2PQ208I - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip (formerly Microsemi) A3PE600-2PQ208I is a ProASIC3E flash-based FPGA delivering 600,000 system gates, 147 user I/O pins, and 110,592 bits of on-chip RAM in a 208-pin BFQFP (PQFP) surface-mount package, with industrial temperature range operation. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field. The A3PE600 belongs to the flash-based FPGA hierarchy: ProASIC3E family -> ProASIC3 generation -> flash FPGA -> programmable logic device. Unlike SRAM FPGAs, flash-based FPGAs retain their configuration in non-volatile memory, so they power up instantly and need no external configuration PROM. Key features include the unique VersaTile architecture, where each tile operates as a three-input LUT, a D-flip-flop, or a latch with enable, maximizing fabric utilization. The single-chip, non-volatile flash fabric eliminates configuration loads, reduces board cost (low TOC), and improves security because the bitstream is stored on-chip. Speed grade -2 supports system performance suitable for glue logic, bus bridging, and control applications, and the family supports optional soft ARM Cortex-M1 implementations per the ProASIC3E datasheet. Technically, the device is built on a 130 nm flash process with a 1.5V core supply. On-chip RAM blocks provide distributed and block storage, while abundant I/O banks support common single-ended standards for board-level interfacing. The 208-pin BFQFP provides a 0.5 mm pitch gull-wing footprint that is straightforward to inspect and rework. Typical applications include industrial automation control, aerospace and defense subsystems, medical instrumentation, communications bridging, and test equipment, where single-chip instant-on programmable logic is valued. Design consideration: budget the 1.5V core and 3.3V I/O rails with clean decoupling, and confirm the industrial -40C to +125C rating matches your thermal environment before finalizing the BOM. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-2PQG208 - ProASIC3E 600K Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-2PQG208 is a ProASIC3E family flash-based Field Programmable Gate Array (FPGA) offering 600,000 gates, 110,592 bits of embedded RAM, 147 user I/O pins, and up to 310 MHz system performance in a 208-pin PQFP (BFQFP, 28x28 mm) package. A flash-based FPGA stores its configuration in on-chip flash memory rather than an external configuration PROM. Unlike SRAM FPGAs, this single-chip approach means the device is live at power-up, requires no external boot device, and is inherently more secure because the bitstream never leaves the package. Within the programmable logic hierarchy, the A3PE600 sits in the mid-density tier of the ProASIC3E family, which spans from low-density consumer devices up to 3M-gate avionics-grade parts, built on a 130 nm flash process with a 1.5 V core supply. Key features include a low total cost of ownership thanks to single-chip operation, reprogrammable flash fabric, support for 1.425V to 1.575V core supply, industrial-relevant performance of up to 310 MHz, and 147 programmable I/Os supporting common single-ended standards. The -2 speed grade balances performance and cost within the family, while the commercial temperature range of 0C to +85C suits controlled-environment systems. The ProASIC3E architecture combines VersTiles (logic modules), embedded flash, and distributed RAM to implement glue logic, bus bridging, state machines, and control-plane functions. Embedded 110,592 bits of RAM support FIFOs and small buffers in networking and communications designs. As a cost-effective ASIC replacement, the family is documented for consumer, networking/communications, computing, and avionics markets per the Microchip ProASIC3E datasheet. Typical applications include industrial control and automation, communications bridging, battery-powered and power-sensitive computing platforms, and single-chip ASIC-replacement designs where instant-on operation and configuration security matter. Design consideration: budget the 1.5V core rail (1.425V to 1.575V tolerance) carefully and follow Microchip power-supply decoupling guidance in the ProASIC3E handbook; the 208-pin PQFP requires careful signal-integrity practice for fast edge rates. This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
A3PE600-2PQG208I - 600K Gate ProASIC3E FPGA 208-PQFP | Microsemi
The Microsemi (Microchip Technology) A3PE600-2PQG208I is a ProASIC3E family Field Programmable Gate Array (FPGA) with 600,000 system gates, 147 user I/O pins, and 110,592 bits of embedded RAM, housed in a 208-pin Fine Pitch Quad Flat Package (208-BFQFP / 208-PQFP, 28x28 mm). An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device that implements custom digital logic through configurable logic blocks and programmable interconnects. Within the programmable logic hierarchy, the ProASIC3E family sits in the low-density, flash-based, non-volatile FPGA segment, positioned between CPLDs and high-end SRAM FPGAs. Because configuration data is stored on-chip in flash cells, ProASIC3E devices are single-chip solutions that do not require an external configuration PROM, reducing bill-of-materials cost and improving security against bitstream theft. Key features include a 1.5V core supply (1.425V to 1.575V operating range), system performance up to 310 MHz, 130nm flash-based CMOS technology, and industrial temperature operation from -40C to +100C junction temperature (indicated by the I suffix). The -2 speed grade balances performance and cost within the family. Embedded RAM blocks support FIFOs, dual-port memories, and bus interfacing, while abundant user I/O supports common I/O standards for glue logic, bus bridging, and control applications. Technically, the ProASIC3E architecture uses a sea-of-gates fabric with VersTiles logic elements and flash-based switching, giving instant-on behavior at power-up with no configuration time. The 600K-gate density suits mid-complexity designs such as protocol bridging, motor control, display interfaces, and avionics subsystems. Microchip datasheets position the family as a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets. Typical applications include industrial automation control, communications line-card glue logic, and aerospace/avionics subsystems where single-chip, instant-on, radiation-tolerant-heritage flash FPGAs are preferred. Design consideration: use Libero SoC from Microchip for synthesis and place-and-route; power the 1.5V core with a regulator rated for inrush during flash read at power-up. This page synthesizes distributor stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-FG256 - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip Technology A3PE600-FG256 is a 600,000-gate ProASIC3E flash-based FPGA with 165 user I/Os, up to 231 MHz system performance, and a 1.5V core, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements custom digital logic through programmable interconnects and configurable logic blocks. The ProASIC3E family is a flash-based FPGA, meaning configuration data is stored in on-chip nonvolatile flash cells rather than an external configuration PROM, making it a secure, single-chip, Instant-On solution within the broader hierarchy of programmable logic devices (PLDs). Key features include nonvolatile flash programming (no external boot device required), reprogrammability with live update support, low total cost of ownership versus ASIC alternatives, and optional soft ARM support per Microchip product documentation. The 130nm CMOS flash process yields low static power and high design security because configuration data is not visible on a serial bitstream. Architecturally, the A3PE600 uses a sea-of-vanilla-points (VersaTile) fabric where each tile can be configured as a three-input lookup table, a D-type flip-flop, or memory, and the ProASIC3E variant adds embedded RAM blocks for buffering and FIFO structures. Typical applications include industrial automation control, communications and networking line cards, aerospace and defense processing, medical instrumentation, and motor-drive interfaces where a single-chip, instant-on programmable fabric is valued. A key design consideration: the standard FG256 variant contains lead and is RoHS non-compliant per distributor data, so new designs targeting EU RoHS markets should select the green FGG256 package variant. This page synthesizes distributor availability, drop-in same-footprint alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
A3PE600-FG256I - 600K Gate Flash FPGA, 256-FBGA | Microchip
The Microchip Technology (Microsemi) A3PE600-FG256I is a 600,000-gate flash-based ProASIC3E FPGA with 13,824 D flip-flops, 165 user I/O, and system speeds up to 350 MHz, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA, 17 x 17 mm, 1.0 mm ball pitch) industrial-grade package rated from -40C to +100C (TJ) with a 1.425V to 1.575V core supply. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration device or SRAM cells. Within the programmable logic hierarchy, the A3PE600 belongs to the ProASIC3E enhanced family, positioned above the base ProASIC3 (A3P) family with added embedded memory bandwidth and DSP-friendly features, making it a single-chip, live-at-power-up solution for system logic integration. Key differentiating features include nonvolatile Flash configuration (no boot PROM, instant-on operation, inherently single-chip), 1.5V core operation for low dynamic power, enhanced embedded SRAM blocks suited to FIFO and dual-port buffering, and support for DDR interfaces on the E variant. The fabric is built on a 130nm CMOS process with Microsemi's flash switch technology, giving high immunity to configuration upset compared with SRAM FPGAs. Architecturally, the device is organized as 13,824 VersaTiles (CLB-equivalent cells) with a sea-of-tiles mesh, plus dedicated blocks: embedded SRAM, and flexible I/O banks supporting multiple single-ended and differential standards. Timing closure is achieved through the Libero SoC design suite with Synplify synthesis. Typical applications include industrial control and automation, aerospace and defense subsystems, secure bridge logic, communications line cards, medical instrumentation, and test equipment, where instant-on nonvolatile configuration and long-lifecycle supply are valued. Design consideration: the FG (standard) package variant is RoHS non-compliant / contains lead per distributor data - the FGG variant is the green, lead-free option in the identical 256-ball footprint, so new lead-free designs should specify A3PE600-FGG256I. This page synthesizes verified distributor data, same-family drop-in packaging variants, and practical design guidance not consolidated on the manufacturer datasheet.
A3PE600-FG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-FG484 is a 600K-gate ProASIC3E flash-based FPGA with 270 user I/Os, 110592 bits of user-accessible flash memory, 231 MHz system performance, and a 1.5V core, housed in a 484-ball FBGA (23 x 23 mm, 1 mm ball pitch) package. It is a nonvolatile, single-chip programmable logic device fabricated on 130nm flash technology. A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip flash cells rather than SRAM. Unlike SRAM FPGAs, flash FPGAs power up instantly with no external configuration PROM, simplify system bring-up, and provide inherent protection against cloning and bitstream tampering. Within the power-management hierarchy of programmable logic, the ProASIC3E family sits alongside Microchip's Igloo (low-power) and Fusion (mixed-signal) families, all built on the same flash switch fabric. Key features include 13824 versatile logic cells (CLBs), 600K system gates, support for soft ARM processors, abundant embedded block RAM, up to 270 single-ended user I/Os with support for common I/O standards, and footprint compatibility between FG256 and FG484 packages, allowing migration across the ProASIC3E family on the same PCB. The A3PE600 architecture uses a Sea-of-Gates flash fabric with routing switches programmed by flash cells, delivering deterministic timing and 231 MHz system performance in a 1.5V core with 3.3V auxiliary supply. Nonvolatile configuration eliminates the boot delay and the external flash of SRAM-based alternatives, and Flash*Freeze-style low-power modes (in the L variants) complement the family for power-sensitive systems. Typical applications include industrial automation control, networking and communications line cards, avionics and defense electronics requiring single-chip secure configuration, test and measurement instrumentation, and cost-effective ASIC replacement in consumer and computing platforms. A key design consideration: ensure power sequencing-free simplicity is exploited, but verify I/O banking and VREF placement when using voltage-referenced I/O standards, assigning one VREF pin per minibank. This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-FG484I - ProASIC3E FPGA 600K Gates 484-FBGA | Microchip
The Microchip Technology (Microsemi) A3PE600-FG484I is a 600,000-gate ProASIC3E flash-based FPGA with 270 user I/Os and 110,592 bits of embedded RAM, manufactured on a 130nm process and housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA, 23x23 mm) rated for industrial junction temperatures from -40C to +100C. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that designers configure to implement custom digital circuits. The A3PE600 belongs to the ProASIC3E family, part of the broader hierarchy FPGA -> programmable logic device (PLD) -> programmable logic -> semiconductor. Unlike SRAM FPGAs, ProASIC3E devices use flash-based configuration cells, giving them a single-chip, non-volatile, instant-on solution with no external boot PROM. Key features include 600K system gates with roughly 13,824 logic cells (7K usable LEs), system performance up to 231 MHz, a 1.5V core supply (1.425V to 1.575V operating range), and abundant advanced features such as embedded RAM blocks and extensive I/O flexibility. The flash fabric delivers low total cost of ownership (TOC) because it eliminates configuration devices and supports secure, single-chip designs. Architecturally, ProASIC3E combines the VersaTile logic structure with dedicated embedded memory blocks, enabling designers to build FIFOs, dual-port RAMs, and state machines while the 270 user I/Os support multiple single-ended and differential standards. The 130nm flash process also offers intrinsically low static power and high resistance to configuration upset compared with SRAM-based competitors. Typical applications include industrial automation and motor control, aerospace and defense payloads requiring instant-on operation, communications and networking line cards, and medical instrumentation. The industrial temperature grade (I suffix) and flash security make it well suited for harsh or security-sensitive environments. Design consideration: verify core supply at 1.5V within the 1.425V-1.575V window and budget the 484-ball footprint carefully; this part is RoHS non-compliant per distributor data, so confirm regulatory acceptance for new designs or consider the FGG (green) package variants. This page synthesizes distributor pricing tiers, drop-in alternatives from the same ProASIC3E family, and practical design notes not found on standard distributor listings.
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology A3PE600-FG484M is a 600,000-system-gate ProASIC3E flash-based FPGA with 270 user I/Os, 231 MHz system performance, and a 484-ball Fine-Pitch Ball Grid Array (FBGA) package fabricated on a 130-nm, 7-layer-metal flash-based CMOS process. The M suffix designates tray packing for this industrial-grade device. A field programmable gate array (FPGA) is a programmable logic device that implements custom digital hardware through a fabric of configurable logic elements, embedded SRAM blocks, and programmable interconnect. Within the power-management hierarchy of system logic, FPGAs sit above fixed-function ASICs and ASSPs in flexibility, and the ProASIC3E family is distinctive because its flash-based fabric is live-at-power-up and requires no external configuration device, making it a true single-chip solution and a cost-effective ASIC replacement. Key features of the A3PE600 include up to 110592 bits of embedded True Dual-Port SRAM (kbit-class block memory), abundant 270 user I/Os supporting multiple single-ended and differential standards, and 1.2 V to 1.5 V core voltage operation. The 13824 CLB / 13824-cell fabric delivers roughly 504 kbits of block RAM-class capacity for pipelining, FIFOs, and coefficient storage in DSP-style designs. Architecturally, the ProASIC3E fabric uses fine-grained VersaTiles on the 130-nm flash process, giving deterministic timing without configuration time at power-up and instant-on behavior valued in avionics, networking/communications, computing, and consumer systems where configuration is a hazard. Embedded block RAM and flexible I/O banks allow glue logic consolidation, bus bridging, and protocol conversion on one die. Typical applications include ASIC prototyping and low-volume ASIC replacement, industrial control and automation, communications line-card bridging, and avionics subsystem logic. The 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) suits high-I/O designs needing 270 usable signals without moving to 676-ball packages. Design consideration: budget I/O bank supply rails per I/O standard and honor flash programming voltage requirements; power estimation with Microchip (Actel/Microsemi) tools is essential before finalizing regulator sizing. This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3 and ProASIC3E families, and practical design notes not found in the manufacturer datasheet.
A3PE600-FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
The Microchip Technology (Microsemi/Actel) A3PE600-FGG256 is a ProASIC3E flash-based FPGA delivering 600,000 system gates (13,824 CLBs / approximately 7K logic elements) with 165 user I/Os and 110,592 bits of embedded flash memory, housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than an external configuration ROM. Within the programmable logic hierarchy, the A3PE600 sits in the low-to-mid density ProASIC3E family, positioned above the ProASIC3 and below the ProASIC3L and ProASIC3E higher-density members. Because configuration data is retained in flash, the device powers up instantly as a single-chip solution with no boot sequence, distinguishing it from SRAM FPGAs such as Xilinx Spartan or Altera Cyclone families. Key features include reprogrammable flash fabric supporting secure, live-at-power-up operation, abundant embedded memory blocks for FIFO and buffer functions, low total cost of ownership through elimination of external boot flash, and small-footprint packaging suited to space-constrained designs. The 256-FBGA package provides 165 user I/Os with flexible banked voltage support for mixed-voltage system interfacing. Architecturally, the ProASIC3E fabric is built from a sea-of-modules grid of versatile logic elements (VersaTiles) interconnected by a hierarchical routing structure, implemented on a standard CMOS process. The flash switching technology gives non-volatile, highly secure configuration with no bitstream readback exposure, an important advantage in defense and industrial designs where IP protection matters. Typical applications include industrial automation control, medical instrumentation, communications line cards, military/aerospace subsystems, and glue-logic consolidation replacing multiple ASICs or ASSPs where volume does not justify mask costs. When designing with this device, verify I/O bank voltage assignments early, since banked I/O rules constrain pin planning within the 256-ball footprint; use Microchip Libero SoC for synthesis, place-and-route, and timing signoff. This page synthesizes distributor pricing and stock signals, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip Technology (Microsemi) A3PE600-FGG256I is a 600,000-gate ProASIC3E Flash FPGA with 13,824 VersaTile logic elements, 165 user I/Os, and 110,592 bits of embedded flash memory, housed in a 256-ball FBGA (S-PBGA-B256) package measuring 17 x 17 mm with a 1.0 mm ball pitch and industrial temperature rating of -40C to +85C. A Flash FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. In the programmable-logic hierarchy, it sits alongside SRAM FPGAs and CPLDs as a class of programmable logic ICs, but unlike SRAM-based devices it is a true single-chip solution: it powers up instantly, needs no boot PROM, and resists configuration readback, which improves system security. Key features include live reprogrammability (the fabric can be reprogrammed without power-cycling in some flows), a low total cost of ownership from eliminating external configuration devices, and 1.5V core operation with low static power. The ProASIC3E variant adds embedded flash blocks and enhanced clocking resources for system-level designs up to approximately 350 MHz internal performance. Architecturally, the fabric is built from VersaTiles - each configurable as a three-input LUT, or as a D-flip-flop/latch with enable - a unique third-generation flash FPGA structure inherited from the ProASIC family. The FGG256 package is footprint-compatible with the FG484 package, easing migration to higher I/O counts. Typical applications include industrial control, communications line cards, secure single-chip logic, aerospace/defense systems, and power-up-critical designs where instant-on configuration is required. Design consideration: flash FPGAs tolerate fewer program/erase cycles than SRAM reconfiguration, so plan reprogramming frequency accordingly; also verify I/O bank voltage assignments before pinout freeze. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
The Microchip (Microsemi) A3PE600-FGG484 is a ProASIC3E flash-based FPGA with 600,000 system gates, 13,824 configurable logic blocks (CLBs), 270 user I/Os, and 110,592 bits of embedded RAM, housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA-484) measuring 23 x 23 mm with a 1 mm ball pitch and 2.23 mm height. It supports system performance up to 350 MHz and operates from a 1.5 V core supply (1.425 V to 1.575 V). A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration device. Within the programmable-logic hierarchy (FPGA -> programmable logic IC -> CMOS digital semiconductor), ProASIC3E occupies the single-chip, reprogrammable segment, offering the live-at-power-up behavior of ASICs with the flexibility of SRAM FPGAs, but without the configuration bootloader or external flash requirement. Key features include low total cost of ownership through a single-chip solution, 130 nm flash CMOS process technology, reprogrammability for in-field updates, and abundant advanced features such as embedded RAM blocks and high-performance I/O structures. The commercial temperature grading suits cost-sensitive volume applications. Technically, ProASIC3E combines a Sea-of-Gates-style fabric with VersaTiles (each based on a 3-input lookup structure) and dedicated embedded SRAM blocks. Because configuration data resides in flash, the device is inherently secure against bitstream interception, has zero configuration time at power-up, and offers very low static power consumption compared with SRAM FPGAs of similar density. Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications bridging, medical instrumentation, and test equipment glue logic, where the 270 available user I/Os and flash persistence simplify board design. A key design consideration is power supply ordering: with a flash fabric, the 1.5 V core rail should be stable before I/O banks ramp to avoid latch-up risk, and decoupling per the manufacturer power-up guidelines is mandatory. Signal integrity on the 1 mm-pitch FBGA requires careful via escape planning on high-layer-count boards. This page synthesizes distributor pricing context, drop-in family alternatives, cross-reference information, and practical design notes not found in the manufacturer datasheet, providing a single decision-ready resource for FPGA sourcing engineers.
A3PE600-FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
The Microchip Technology A3PE600-FGG484I (originally Microsemi) is a 600,000-gate ProASIC3E flash-based FPGA with 13,824 CLBs, 270 user I/Os, and 110,592 bits of embedded flash memory, housed in a 484-ball FBGA (FGG484) package measuring 23 x 23 mm with a 1.0 mm ball pitch and rated for the industrial temperature range of -40C to +85C. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device or volatile SRAM. Within the programmable logic hierarchy, the A3PE600 sits in the low-to-mid density tier of the ProASIC3E family, positioned between smaller ProASIC3 devices and higher-density A3PE1500/A3PE3000 parts, all of which belong to the broader category of power management-friendly, single-chip programmable logic ICs. Key features include nonvolatile flash programming that makes the device Instant On and removes the external boot flash, reprogrammability without a configuration PROM, single-chip operation that reduces BOM cost and board area, and flash-based security that resists cloning and bitstream extraction. The FGG484 package exposes up to 270 user I/Os supporting voltage-referenced standards with one VREF pin per I/O minibank. Technically, the A3PE600 uses a 1.5V core CMOS fabric built from 13,824 VersaTiles, with system-level performance up to 350 MHz. The ProASIC3E generation adds embedded memory blocks and PLL support beyond the earlier ProASICPLUS family, delivering ASIC-like unit cost with FPGA time-to-market benefits. The fabric is backed by Microchip's Libero SoC design suite. Typical applications include industrial automation controllers, aerospace and defense subsystems requiring single-chip instant-on logic, medical instrumentation glue logic, and secure communication bridges where a nonvolatile, low-power FPGA is preferred over SRAM-based alternatives. Designers should note that FG256 and FG484 packages are footprint-compatible, so designs can migrate densities within the family; however, voltage-referenced I/O standards require one VREF assignment per minibank, which constrains pin planning in dense designs. This page synthesizes distributor pricing, drop-in speed-grade and packaging alternatives, and practical design guidance not found in the manufacturer datasheet alone. Pricing reflects distributor data as of 2026-09-02.
A3PE600-PQ208I - 600K-Gate Flash FPGA, 147 I/O | Microchip
The Microchip (Microsemi) A3PE600-PQ208I is a ProASIC3E family flash-based FPGA offering 600,000 system gates, 147 user I/Os, and 110,592 bits of true dual-port SRAM, housed in a 208-pin BFQFP (PQ208) surface-mount package with an industrial temperature range of -40C to +100C. Its core supply operates from 1.425V to 1.575V. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), flash FPGAs occupy a distinct niche: they are Instant On at power-up, retain their programmed design when power is removed, and require no external boot flash, unlike SRAM FPGAs from Xilinx or Intel/Altera. Key features include reprogrammable 130-nm, 7-layer metal (6 copper) flash-based CMOS technology, a single-chip solution with low total cost of ownership, up to 231 MHz system performance, on-chip user nonvolatile memory, and support for Level 0 instant-on operation. The ProASIC3E fabric combines logic tiles with embedded true dual-port SRAM blocks (108 kbits on this device), enabling FIFOs, buffers, and register files without external memory. Architecturally, the A3PE600 uses a sea-of-tiles fabric of VersaTiles, each configurable as combinational or sequential logic, with flash switches providing nonvolatility and inherent security benefits: no bitstream is streamed at power-up, making reverse engineering significantly harder than SRAM FPGAs. Typical applications include industrial automation and motor control, aerospace and defense systems requiring instant-on secure configuration, medical instrumentation, and communications line cards, where single-chip nonvolatile programmable logic reduces BOM cost and board complexity. A key design consideration is power: the 1.5V core rail must be tightly regulated within 1.425V to 1.575V, and I/O bank voltages must be planned early since the 147 user I/Os are grouped into banks. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-PQG208 - 600K Gate ProASIC3E FPGA 208-PQFP | Microchip
The Microchip Technology (Microsemi) A3PE600-PQG208 is a 600,000-system-gate ProASIC3E flash-based FPGA delivering 231 MHz system performance, 147 user I/Os, and 110,592 bits of embedded RAM in a 208-pin Quad Flat Package (PQFP/BFQFP). It operates from a single 1.425V to 1.575V core supply and is fabricated on a 130nm flash-based process. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class: unlike SRAM FPGAs, it stores its configuration in on-chip flash, so it powers up instantly as a single-chip solution with no external boot configuration PROM, no configuration controller, and inherently higher design security against bitstream copying. Key features include single-chip, low total cost of ownership (TOC), reprogrammable flash fabric, abundant advanced features per the Microchip ProASIC3E datasheet, and a 208-pin surface-mount QFP footprint suitable for cost-sensitive boards. The 1.5V nominal core supply keeps dynamic power low, while 3.3V-capable I/O banks support standard single-ended interfaces. Technically, the A3PE600 uses Microsemi's flash switch technology, giving it live-at-power-up behavior and no configuration time penalty. The 130nm process yields 600K system gates, and the 231 MHz performance figure enables mid-range glue logic replacement, control, and data-path designs that would otherwise require ASIC NRE investment. Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics systems - markets the Microchip ProASIC3E datasheet explicitly identifies as target segments for ASIC-replacement use. When designing with this device, verify the 1.425V to 1.575V core supply tolerance with a dedicated regulator and confirm the 0C to +70C commercial temperature range matches your environment; industrial-grade A3PE600-PQG208I variants exist for extended temperatures. This page synthesizes distributor pricing availability, same-package drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-PQG208I - 600K Gate Flash FPGA, 147 I/O | Microchip
The Microchip (Microsemi) A3PE600-PQG208I is a ProASIC3E family flash-based FPGA with 600,000 system gates, 147 user I/Os, and 110,592 bits of total RAM, housed in a 208-pin PQFP (BFQFP, 28x28 mm) surface-mount package with an industrial operating range of -40C to +100C junction temperature. A field-programmable gate array (FPGA) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. The ProASIC3E family sits within the broader hierarchy of programmable logic devices, bridging low-cost CPLDs and high-density SRAM FPGAs, and is positioned by Microchip as a cost-effective ASIC replacement for consumer, networking/communications, computing, and avionics markets. Key features include flash-based (non-volatile) configuration, which eliminates the external boot flash and keeps configuration secure in single-chip systems; a 1.425V to 1.575V core supply aligned to 1.5V rails; system performance up to 231 MHz on 130nm flash technology; and abundant reprogrammability supporting in-field updates. Architecturally, ProASIC3E devices combine a sea-of-vanadium-gate flash switch fabric with embedded RAM blocks totaling 110,592 bits, enabling FIFOs, buffers, and small memories without external components. The flash routing matrix removes the configuration-time volatility of SRAM FPGAs, improving instant-on behavior and supply-chain resilience in cost-sensitive deployments. Typical applications include industrial control and automation, communications and networking line cards, defense and avionics subsystems, and ASIC prototyping, where the 147 I/O count and 600K gate density cover mid-scale glue logic, bus bridging, and control-plane functions. Design consideration: the PQFP package's higher inductance compared to BGA packages makes power-integrity planning essential; use solid ground returns and adequate decoupling on the 1.5V core rail. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
A3PE600-PQG208IX218 - ProASIC3E Flash FPGA 600K Gates | Microsemi
The Microsemi (Microchip) A3PE600-PQG208IX218 is a ProASIC3E family flash-based FPGA delivering 600K gates at up to 231 MHz system performance in a 208-pin PQFP (PQG208) surface-mount package, powered from a 1.5 V core supply. A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program after manufacturing. The ProASIC3E family belongs to the flash-based FPGA class, which stores configuration in non-volatile on-chip flash memory rather than external SRAM configuration devices, making it a single-chip, ASIC-replacement solution for consumer, networking/communications, computing, and avionics markets, as described in the Microchip ProASIC3E datasheet. Key differentiating features include 130 nm flash technology, single-chip operation with no external configuration PROM, reprogrammability without a microprocessor, and instant-on power-up behavior inherent to flash programming cells. The device provides 147 user I/O in the 208-pin PQFP package and supports optional soft ARM processor cores, extending it from pure glue logic to small embedded control functions. Technically, the ProASIC3E fabric uses fine-grained Versatile logic elements built on Sea-of-Tiles flash switch technology. Because configuration data resides in flash, the device is inherently secure against bitstream interception, does not require a configuration controller at power-up, and offers low total cost of ownership (TOC) compared with SRAM FPGAs that need companion flash. Typical applications include industrial control, networking line-card glue logic, avionics and space-tolerant designs where configuration volatility matters, and consumer equipment requiring fast time-to-market ASIC replacement. A key design consideration is supply integrity: decouple the 1.5 V core and 3.3 V I/O rails with low-ESR ceramic capacitors close to the package power pins, and follow Microchip power-up sequencing guidance for mixed-rail designs. This page synthesizes distributor pricing data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, offering buyers a single decision-ready reference.
A3PE600L-FG484M - 600K-Gate Flash FPGA, 484-FBGA | Microchip
The Microchip Technology (formerly Microsemi/Actel) A3PE600L-FG484M is a 600,000-system-gate flash-based FPGA from the ProASIC3EL family, offering 270 available user I/Os in a 484-ball FBGA package, built on a 130-nm, 7-layer-metal (6 copper) flash-based CMOS process with a 1.2 V to 1.5 V core voltage. A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration PROM or SRAM boot device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital logic IC - flash FPGAs occupy the single-chip, instant-on niche, making them distinct from SRAM FPGAs that require a boot sequence. Key features include Live-at-Power-Up (Level 0) operation, true single-chip integration with no external configuration device, up to 504 kbits of true dual-port SRAM, and Flash*Freeze technology for ultra-low static power consumption. Reprogrammability without a configuration flash streamlines board design and reduces total cost of ownership (TOC), a headline benefit Microchip emphasizes for the ProASIC3 family. Technically, the ProASIC3EL fabric uses fine-grained VersaTiles with flash switching elements, delivering ASIC-like security because the bitstream is stored invisibly on-chip. The 130-nm process with copper interconnect balances density, speed, and low static power. The 'M' suffix in the part number designates the commercial temperature grade of 0 to 70 C, and the 'L' suffix denotes the low-power core option. Typical applications include industrial automation controllers, military and aerospace low-power logic integration, communications line cards, and medical instrumentation where instant-on, secure, single-chip programmable logic is required. A key design consideration is power-rail sequencing: the 1.2 V/1.5 V core and 3.3 V I/O banks should be provisioned per the datasheet, although flash FPGAs tolerate any power-up order. For harsh environments, consider the RT ProASIC3 radiation-tolerant variant instead. This page synthesizes distributor inventory, drop-in alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.