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Produits (32725)

XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2CSG484C

XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2CSG484C is a Spartan-6 LX family field-programmable gate array (FPGA) with 43,661 logic cells, 3,411 Configurable Logic Blocks (CLBs/LABs), 2,138,112 bits of embedded block RAM (approximately 261 Kib), and 320 user I/O, housed in a 484-ball chip-scale BGA (CSBGA, 19 mm x 19 mm, 0.8 mm pitch). The device operates from a 1.2 V core supply (1.14 V to 1.26 V) with internal performance characterized up to 500 MHz. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect fabric, and embedded memory/DSP/IO resources that the user can program post-manufacturing. In the power-management hierarchy, an FPGA sits above microcontrollers and ASICs in flexibility, providing parallel hardware acceleration for digital signal processing, glue logic, and high-IO bridging. The Spartan-6 LX family targets cost-sensitive, high-volume applications such as consumer, automotive infotainment, and industrial automation, balancing density with low power and low unit cost. Key features include built-in 45 nm CMOS process technology, integrated hard IP blocks (PCI Express, GTP transceivers on LXT variants, dedicated DSP48A1 slices), on-chip block RAM, and 45 nm process low-power sleep modes. The -2 speed grade offers balanced performance versus power, while the commercial temperature grade (0 to +85 C) suits indoor and controlled-environment designs. Architecturally, the XC6SLX45 leverages the Spartan-6 LUT-based logic fabric combined with hard DSP slices, dedicated memory blocks, and high-performance SelectIO technology. The 320 user I/O support up to 18 single-ended standards or multiple differential pairs, enabling bridge and connectivity designs. The device is configured via JTAG, Slave Serial, SPI, or BPI flash interfaces, with bitstream encryption available for IP protection. Typical applications include automotive infotainment, consumer video/display bridging, industrial motor control, communication infrastructure glue logic, and high-density DSP pre-processing. The wide IO count and ample block RAM make this device especially suitable for multi-protocol bridging and parallel data acquisition. Designers should note that the 484-ball CSBGA package requires careful PCB layout with microvia technology for reliable assembly. The 1.2 V core supply must use low-noise LDO regulation with adequate bulk capacitance, and all IO banks may require independent reference voltages depending on the standards used. This page synthesizes distributor pricing, drop-in Spartan-6 alternatives, application notes, and practical design considerations that are not found in the manufacturer datasheet alone.

USD $980,00 En stock
XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2FGG484C

XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) integrating 43,661 logic cells, 2,138,112 system gate equivalents, and 316 user I/O pins in a 484-ball fine-pitch BGA package (FGG484). It is offered in the -2 commercial speed grade with a 1.14 V to 1.26 V core supply. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic and routing are defined by a user-programmed configuration bitstream rather than at fabrication. FPGAs occupy the wider hierarchy of programmable logic devices (PLD) -> reconfigurable logic -> parallel processing accelerators -> digital integrated circuits (IC). The Spartan-6 family specifically targets cost-sensitive, high-volume embedded designs where power efficiency and integrated peripherals matter more than the absolute performance of a Virtex-class device. Key features of the XC6SLX45 include 2,011 Kbit of block RAM, 58 DSP48A1 slices running up to 390 MHz, four clock management tiles (CMTs) each containing two DCMs and one PLL, and SelectIO technology supporting I/O voltages from 1.2 V to 3.3 V on a per-bank basis. The device also exposes an integrated hard Endpoint block for PCI Express Gen1 in the LXT variant, plus a 10/100/1000 Ethernet MAC. The FGG484 package, measuring 23 x 23 mm with 1.0 mm pitch, is pin-compatible across all Spartan-6 LX/LXT devices with this ball-out. Architecturally the SLX45 uses a 45 nm copper CMOS process with a 6-input LUT-based logic fabric, dedicated carry chains, distributed RAM capability, and a high-performance SerDes-capable I/O ring in the LX variant. Each CMT generates up to 8 derivative clock domains from a single reference, enabling precise multi-clock synthesis for video, memory, and high-speed serial interfaces. Typical applications include industrial motor control, video and image processing pipelines, automotive driver assistance systems (non-AEC), consumer electronics requiring display or camera bridging, and low-cost software-defined radio front-ends. The wide I/O count and integrated memory controllers make it a popular bridge between parallel microcontrollers and high-speed serial sensors. When designing the power tree, ensure a four-rail supply (1.2 V Vccint, 2.5 V Vccaux, 1.8 V-3.3 V Vcco per bank, and a separate Vccbatt for the encryption battery domain on protected devices). Decoupling on each rail should follow the Spartan-6 PCB Design Guide with 100 nF per Vcc/Vcco pin and bulk capacitance of 100 uF minimum near the package. This page synthesizes distributor pricing across five authorized channels, drop-in same-footprint alternatives, and practical design notes derived from the Spartan-6 family datasheet that you will not find on a single manufacturer or distributor page.

USD $118,75 En stock
XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
XC6SLX45-2FGG484I

XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 316 user I/O pins in a 484-ball fine-pitch BGA package. Built on a 45 nm low-power copper CMOS process, the -2 speed grade targets an industrial operating temperature range (-40C to +100C for the I suffix), and supports DDR3, LVDS, and 3.3V I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as block RAM, DSP slices, and clock management tiles. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: they are slower and more power-hungry than purpose-built ASICs but offer complete hardware re-programmability, making them ideal for prototyping, low-volume production, and designs requiring hardware acceleration. The Spartan-6 LX family is positioned as a cost-optimized, high-volume family aimed at bridging, motor control, video processing, and embedded DSP applications. Key features of the XC6SLX45 include 6,822 logic slices (each containing four 6-input LUTs and eight flip-flops), 58 DSP48A1 slices for fixed- and floating-point math, 12 clock management tiles (CMTs) with PLL and DCM blocks, and integrated hard IP for PCI Express and GTP serial transceivers on the LXT sub-family. The device supports up to 800 Mbps LVDS, 1,066 Mbps DDR3 memory interfaces, and offers 16 dedicated multiplier lines and SelectIO technology for flexible I/O standard support. The architecture uses a hierarchical routing fabric with 3-fine-tolerant ASIC-class clock networks, making timing closure predictable. The 45 nm process yields roughly half the static power of prior Spartan generations. Built-in security features include AES-256 bitstream encryption and Device DNA for IP protection, supporting secure field upgrades in deployed systems. Typical applications include industrial machine vision, motor and motion control, automotive infotainment bridging, video surveillance and broadcast equipment, low-cost software-defined radio, and high-volume consumer products needing DSP pipelines. The 316 user I/Os and abundant block RAM make it well-suited for multi-channel data acquisition systems. The -2 speed grade balances performance and power for cost-sensitive industrial designs that do not require the fastest -3 grade. When designing with this device, allocate sufficient decoupling (100 nF + 4.7 uF per VCCIO/VCCAUX rail), use 1.0 mm-pitch BGA fanout with microvia stacks, and route the 484-ball FBGA substrate with a symmetrical thermal copper pour to keep junction temperature within industrial limits. The design should use the Xilinx ISE Design Suite or Vivado for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package-level cross-references, and practical design notes not found in a single manufacturer datasheet.

USD $65,10 En stock
XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
XC6SLX45-2FGG676C

XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD

The AMD (formerly Xilinx) XC6SLX45-2FGG676C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 358 user I/Os in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a mature 45 nm low-power copper process, the LX family targets high-volume, power-conscious applications and is offered in -3N, -2, and -1L speed grades with the -2 grade used here delivering a balance of performance and power. The FGG676 package measures 27 x 27 mm with 1.0 mm ball spacing and supports extended I/O count required for parallel memory buses, video pipelines, and industrial control fabrics. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families. Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs. Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities. Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family. When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.

USD $24,50 En stock
XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
XC6SLX45-2FGG676I

XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD

The AMD Xilinx XC6SLX45-2FGG676I is a Spartan-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells (43661 cells), 3,411 configurable logic blocks (CLBs), 358 user I/Os, and 2,088 Kbit of block RAM, housed in a 676-ball fine-pitch BGA (FBGA) package. The device is fabricated on a low-power 45 nm CMOS process and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems. Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C. The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs. Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive. When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug. This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.

USD $55,80 En stock
XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
XC6SLX45-3FG676I

XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD

AMD XC6SLX45-3FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and a maximum internal frequency of 500 MHz, packaged in a 676-BGA. It targets industrial logic, embedded control, communications, instrumentation, and high-density programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important. The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components. The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment. For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.

Devis En stock
XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
XC6SLX45-3FGG484C

XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD

The AMD (formerly Xilinx) XC6SLX45-3FGG484C is a Spartan®-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells, 316 user I/Os, and 2,138,112 system gates in a 484-ball flip-chip BGA package with 1.0 mm ball pitch (FBGA-484). It targets the -3 commercial speed grade and delivers up to 862 MHz operating frequency. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets. The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs. When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations. Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.

USD $12,10 En stock
XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484C

XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484C is a Spartan-6 LX field-programmable gate array with 667 MHz internal frequency, 5,831 configurable logic blocks, 74,637 logic cells, and 484-ball FBGA packaging. It is designed for cost-sensitive, high-volume systems that combine programmable logic, extensive I/O, and integrated processing resources. The device operates from a 0 to 85 C temperature range and uses a 23 x 23 mm, 1 mm pitch MS-034 FBGA package. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration. The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern. Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions. The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.

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XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
XC6SLX75-2FG484I

XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD

The AMD XC6SLX75-2FG484I is a Spartan-6 LX field-programmable gate array with 74,637 configurable logic elements, 5,831 logic blocks, up to 280 I/O, a 667 MHz internal frequency, and a 484-ball FBGA package. It targets industrial systems operating from 0°C to +85°C. The -2 speed grade and 23 mm by 23 mm, 1 mm-pitch MS-034 package make this device suitable for embedded control, communications, instrumentation, industrial automation, and signal-processing systems requiring programmable parallel logic and substantial I/O density. Its supply-voltage details, memory resources, block inventory, and complete ball assignment are not present in the supplied excerpts and must be confirmed in the manufacturer documentation. A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device. The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design. The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation. Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools. A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification. This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.

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XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-2FG676I

XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA

The AMD XC6SLX75-2FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, and a stated internal frequency of 667 MHz, supplied in a 676-BGA package. It combines programmable logic, block RAM, and DSP resources in one reconfigurable semiconductor for embedded control, signal processing, communications, and industrial systems. A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing. The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint. The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification. Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance. A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.

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XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-2FGG484I

XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.

USD $82,10 En stock
XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
XC6SLX75-3CSG484C

XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD

The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.

USD $112,00 En stock
XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG484I

XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.

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XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
XC6SLX75-3FG676C

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.

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XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75-3FG676I

XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75-3FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and an industrial temperature grade in a 676-ball FCBGA package. Verified listings identify an 862 MHz maximum device frequency, a 27 mm by 27 mm body, a 1 mm ball pitch, and CMOS fabrication. The -3 speed grade is the highest-performance Spartan-6 LX grade presented in the verified comparison data. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost. The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability. Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation. The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly. Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields. This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.

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XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
XC6SLX75T-2CSG484C

XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD

The AMD XC6SLX75T-2CSG484C is a Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a mature 45 nm low-power copper process technology. It delivers 74,637 logic cells, 3,170,304 total RAM bits, and 292 user I/O pins in a 484-pin CSBGA (19x19 mm) package. Operating from a 1.2V core supply (1.14V to 1.26V range), this device is designed for high-volume applications requiring leading system integration at the lowest total cost. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications. Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity. Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs. Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments. When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.

USD $59,50 En stock
XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
XC6SLX9-2CPG196I

XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD

The AMD (Xilinx) XC6SLX9-2CPG196I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) built on a 45 nm CMOS process, integrating 9,152 logic cells across 715 configurable logic blocks (CLBs) in a 196-ball Chip-Scale BGA (CSBGA) package. The device provides up to 106 user I/O pins, 576 Kbit embedded block RAM, dedicated DSP48A1 slices, and operates across the industrial -40C to +100C temperature range with a -2 speed grade offering up to 667 MHz internal clock performance. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance. Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration. Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications. Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing. When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation. This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.

USD $19,80 En stock
XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD
XC6SLX9-2CSG225C

XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD

The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package. Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch. Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows. Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS). Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs. This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.

USD $19,40 En stock
XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
XC6SLX9-2CSG225I

XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD

AMD/Xilinx XC6SLX9-2CSG225I is a Spartan-6 LX field-programmable gate array containing 9,152 programmable logic cells, 589,824 RAM bits, 160 user I/O, and 715 configurable logic blocks in a 225-ball CSPBGA package. The supplied data identifies a 1.14 V to 1.26 V operating-supply range, a -2 speed grade, and an industrial temperature designation. An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream. Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data. The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly. Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements. A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix. This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.

USD $7,38 En stock
XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD
XC6SLX9-2FT256C

XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD

The AMD/Xilinx XC6SLX9-2FT256C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 186 I/O, and a -2 speed grade in a 256-ball FTBGA package. The commercial-temperature device is identified as the FTBGA-256 option and is specified for 0°C to 85°C operation. Its verified internal-frequency listing reaches 667 MHz, although implemented system performance depends on the selected clocking resources, design constraints, I/O standards, and timing closure. This device is a programmable-logic semiconductor: configurable LUTs, registers, block RAM, and dedicated resources implement digital control, datapath, interface, and signal-processing functions. It belongs to the hierarchy FPGA → programmable logic device → digital semiconductor. A Spartan-6 LX FPGA is a reprogrammable integrated circuit used when fixed-function logic is insufficient or when one programmable device can consolidate multiple functions onto a compact board. The XC6SLX9 combines 9,152 logic cells and 186 I/O in the FTBGA-256 package, making it relevant to industrial control, communications, embedded instrumentation, and compact digital subsystems. Designers select pin constraints, I/O standards, clocking, memory interfaces, and timing constraints in the associated FPGA development environment before programming the device. Verified feature data establishes the device type as an FPGA, the logic-cell count as 9,152, the I/O count as 186, and the maximum listed internal frequency as 667 MHz. The -2 suffix denotes the device speed grade, while the trailing C denotes the commercial temperature option. The package is specified as 17 mm × 17 mm, 1 mm pitch, MS-034, FTBGA-256. These facts make exact device identification essential: package outline, speed grade, temperature grade, bitstream, voltage configuration, and pin constraints must all be checked before substitution. The target is suitable for parallel digital logic, embedded control logic, bus bridging, and application-specific signal processing where 9,152 LUT-based logic cells are sufficient. It can consolidate control and datapath logic while reducing discrete-component count, although final utility depends on memory, clock, and I/O requirements. The supplied sources do not verify RAM capacity, block-RAM count, DSP resources, supported I/O standards, power rails, or complete electrical timing tables; those specifications must be obtained from the manufacturer documentation before schematic or timing sign-off. A critical procurement consideration is traceability. Distributor and aggregation listings identify the XC6SLX9-2FT256C, while LCSC reports an in-stock listing and a starting price of $9.5017. The Mouser and Octopart pages provide purchasing and aggregation paths, but no complete quantity-price table is present in the supplied data. Engineers should compare authorized sourcing, lot traceability, date codes, and documented lifecycle status before committing an industrial or long-lived design. This page consolidates verified distributor specifications, package details, pricing references, and replacement screening into a design-focused record. It also distinguishes exact package-compatible family variants from unsupported assumptions, reducing the risk of treating a different Spartan-6 grade as an unconditional drop-in replacement.

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XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD
XC6SLX9-2FT256I

XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD

The AMD (formerly Xilinx) XC6SLX9-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) IC integrating 9,152 logic cells, 589,824 bits of block RAM, and 186 user I/Os into a 256-ball FTBGA package with 1.0 mm pitch and 17 x 17 mm body. Built on a 45 nm CMOS process with a 1.2 V core supply, the device operates in the industrial temperature range of -40C to +100C and is offered in the -2 speed grade for balanced performance and power. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, complemented by hardened peripherals such as block RAM, DSP slices, PLLs, and transceivers. FPGAs sit between standard logic ICs and ASICs in the programmable logic hierarchy: unlike ASICs they require no mask set and can be reconfigured in-circuit, while offering far higher density and performance than discrete CPLDs. The Spartan-6 LX family targets cost-sensitive, high-volume applications by integrating common system functions (memory controllers, PCIe, Ethernet MAC) into the silicon. Key features of the XC6SLX9-2FT256I include 16 DSP48A1 slices for fixed- and floating-point arithmetic, 16 Logic Slices per CLB with carry-chain support, dedicated block RAM supporting dual-port operation, and SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL I/O standards. The device includes 2 PLL clock managers and supports up to 667 MHz internal operation, making it suitable for digital signal processing, motor control, video bridging, and embedded control planes. The -2 speed grade balances the highest performance with the lowest power consumption across the Spartan-6 LX family. Power management is enabled through a 1.2 V core supply, a separate auxiliary supply, and an I/O supply that can be set independently from 1.2 V to 3.3 V, allowing direct interface to legacy 5 V-tolerant buses through external clamping. Configuration is supported via JTAG (IEEE 1149.1 / IEEE 1532), SPI, BPI, and the dedicated Xilinx multi-boot modes. Typical applications include industrial motor drives, factory automation controllers, medical imaging pre-processing, broadcast video processing, low-density telecommunications line cards, and embedded control planes in avionics and defense systems. The 256-FTBGA package suits designs that need high I/O count (186 user I/Os) on a moderate PCB area while keeping JTAG-driven configuration simple. When designing with this FPGA, ensure decoupling follows the Spartan-6 PCB Design Guide (UG393), with a 1.0 uF + 0.01 uF pair per supply pin placed within 5 mm of the BGA ball. JTAG chain integrity must be checked at low temperature to avoid boundary-scan failures at industrial cold-start. For long-life programs requiring multi-decade supply continuity, plan a migration path now because Spartan-6 is in long-term support but not recommended for new designs. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the AMD datasheet alone, helping procurement and hardware engineers verify availability and select a pin-compatible alternative for long-life designs.

USD $23,10 En stock
XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx
XC6SLX9-2FTG256C

XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx

The AMD/Xilinx XC6SLX9-2FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) built on a mature 45 nm low-power copper CMOS process, delivering 9,152 logic cells, 1,430 adaptive logic modules (ALMs), and 576 Kbits of embedded block RAM in a 256-ball fine-pitch thin BGA (FTG256) package measuring 17 x 17 mm with 1.0 mm ball pitch. It targets the -2 commercial speed grade with internal performance up to 667 MHz and is specified for commercial 0 C to 85 C operation. The part provides 186 user I/Os through the FTG256 footprint and integrates dual-register 6-input LUT logic alongside a rich set of built-in system-level blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and occupy the high-density end of that family. Spartan-6 LX parts are specifically optimized for logic-intensive, cost-sensitive applications rather than the transceiver-rich Spartan-6 LXT family, delivering half the power consumption of previous Spartan generations while expanding densities from 3,840 up to 147,443 logic cells across the family. Key features include 15 dedicated 18 x 18 multiplier/DSP slices, 32 Kbits of distributed RAM, integrated DCM and PLL clock tiles, hard PCIe endpoint support in higher-density family members, and SelectIO technology supporting a wide range of I/O standards including LVCMOS, LVDS, and HSTL. The 45 nm process enables lower static and dynamic power compared with the prior Spartan-3A generation, and the -2 speed grade offers a balanced trade-off between performance, power, and cost. The XC6SLX9-2FTG256C uses a 6-input LUT architecture with two flip-flops per LUT for efficient pipelining, plus dedicated carry logic for arithmetic and dedicated multiplier blocks for DSP. Configuration is supported through SPI, JTAG, and BPI flash modes, and the silicon includes built-in bitstream encryption and CRC checking for production designs. Typical applications include industrial motor control and machine vision, low-cost display controllers, consumer video processing, USB/Ethernet bridging, SPI-to-parallel glue logic replacement, LED video walls, and low-volume ASIC prototyping. The wide I/O count and DSP blocks also make it suitable for software-defined radio front-ends and small-form-factor industrial IoT controllers that require deterministic parallel processing. When designing with this part, ensure the FTG256 PCB land pattern follows JEDEC MS-034 with 1.0 mm pitch and that decoupling uses at least 100 nF + 4.7 uF per power rail within 5 mm of the balls. Multi-rail sequencing, JTAG chain ordering, and configuration mode pin strapping should be reviewed against UG380 before layout commitment. This page synthesizes distributor stock and pricing, drop-in FPGA alternatives with verified package compatibility, and practical design notes that complement the Xilinx Spartan-6 family documentation set (DS160 and UG380).

USD $27,85 En stock
XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
XC6SLX9-2FTG256I

XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD

The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems. Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C. The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs. Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area. When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.

USD $21,75 En stock
XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
XC6SLX9-2TQG144C

XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD

The AMD (Xilinx) XC6SLX9-2TQG144C is a Spartan-6 LX field-programmable gate array (FPGA) providing 9,152 logic cells, 102 user I/Os, and 715 Configurable Logic Blocks (CLBs) in a 144-pin TQFP (TQG144) package. Built on a mature 45 nm low-power copper CMOS process, this speed-grade -2 commercial-temp part integrates 589,824 system gates and supports DCM/PLL clock management at up to 375 MHz internal performance. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter. Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly. Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families. Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing. When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.

USD $11,80 En stock