Modules RF
Produits (305)
RAK3172-8-SM-NI - LoRaWAN 868MHz Stamp Module, STM32WLE5, SMD | RAKwireless
The RAKwireless RAK3172-8-SM-NI is a compact, surface-mount LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CCU6 SoC, operating in the 864 MHz / 865 MHz / 868 MHz ISM bands with 2 V to 3.6 V supply, and supplied without an I-PEX antenna connector. It integrates an Arm Cortex-M4 MCU at 48 MHz with 256-Kbyte Flash and 64-Kbyte SRAM alongside a Semtech SX126x-compatible LoRa transceiver, delivering up to 15 km line-of-sight range at 5.22 mA receive current and 87 mA transmit current in a 15.5 x 15 mm SMD footprint. A LoRa module is a self-contained radio block that bundles an MCU, RF transceiver, matching network and crystal into a single reflow-solderable unit. LoRaWAN, the wider-area networking protocol layered on LoRa modulation, occupies the sub-GHz ISM spectrum and is the dominant low-power wide-area network (LPWAN) standard for battery-operated IoT deployments - a category that includes LoRa modules, LPWAN SoCs, RF transceivers, and wireless connectivity ICs. The RAK3172 sits at the lower end of this taxonomy, giving designers a pre-certified path to LoRaWAN Class A/B/C without exposing the SX126x register set or the STM32WLE5 radio peripherals. Key features include support for LoRa, (G)FSK and BPSK modulations, multiple regional bands (EU868 / IN865 / RU864), AT-command and RUI3 (RAKwireless Unified Interface v3) firmware modes, and a hardware sleep current measured in microamperes for coin-cell and Li-SOCl2 battery use. The integrated RF matching network and 32.768 kHz RTC crystal simplify host-board design, while exposed UART, SPI, I2C, ADC and GPIO lines let the module double as the application's main controller. Architecturally, the STM32WLE5 silicon mates an LPWAN radio block to a Cortex-M4 with FPU, providing hardware AES-256 for LoRaWAN payload encryption, an integrated DC-DC converter for the radio PA, and a sub-GHz front end that removes the need for an external SAW filter in most band plans. This depth of integration explains why the RAK3172 can match the range of earlier discrete-MCU + discrete-transceiver designs in a fraction of the PCB area. Typical deployments include battery-powered IoT sensors, smart agriculture probes, asset tracking, smart metering, environmental monitors, and LoRaWAN-to-Cellular gateways' downlink/uplink test fixtures. The wide -40 C to +85 C operating range covers industrial outdoor enclosures. A design tip: route the antenna trace on the host board only when the host owns the RF keep-out, since this -NI variant ships without an I-PEX connector and relies on a trace antenna or U.FL pigtail. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
RAK3172-9-SM-I - 9xx MHz LoRaWAN Module with IPEX | RAKwireless
The RAKwireless RAK3172-9-SM-I is a compact, low-power LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC SoC, integrating an Arm Cortex-M4 32-bit core with 256 KB Flash and 64 KB SRAM alongside an embedded LoRa radio. The -9-SM-I suffix denotes the 902-928 MHz sub-band (915 MHz nominal center) variant with a surface-mount form factor and an IPEX/U.FL antenna connector footprint. The module measures 15.5 mm x 15.5 mm and operates over a 2.0 V to 3.6 V supply range. A LoRaWAN module is a long-range, low-power wireless data transceiver that uses Semtech's LoRa modulation to deliver multi-kilometer connectivity in sub-GHz ISM bands while consuming only microamps in sleep mode. LoRaWAN (Long Range Wide Area Network) is an open LPWAN protocol standardized by the LoRa Alliance that sits above LoRa modulation and defines the MAC layer, device classes, and join procedures used for massive IoT deployments. Key specifications include +20 dBm maximum RF output power, link budget supporting up to 15 km line-of-sight range, 5.22 mA typical receive current, 87 mA peak transmit current, and 1.69 uA sleep current. The module exposes SPI, UART, and I2C peripherals through a stamp-hole land pattern, enabling drop-in integration into host PCBs without RF design effort. System architecture is built around the STM32WLE5 single-chip solution, which fuses the application MCU and sub-GHz radio on a common silicon die, reducing BOM cost and bill of materials while retaining full LoRaWAN 1.0.3 Class A/B/C stack compatibility. Developers can use the RAK3172 Arduino library, AT command firmware, or the Zephyr RTOS BSP for embedded development. Typical applications include battery-powered wireless sensor networks, smart agriculture soil/irrigation telemetry, asset tracking and cold-chain logistics, smart metering for water/gas utilities, and LPWAN building automation. The IPEX connector enables external high-gain antenna mounting for chassis-mounted or outdoor enclosures. When designing with this module, place the IPEX connector trace away from switching nodes and ensure the host PCB provides adequate ground flooding under the antenna feed. For external SMA antenna routing, choose the -NI (no IPEX) variant and route the RF pad directly to the SMA connector - the -I variant is intended for IPEX-attached flex antennas. This page consolidates verified distributor pricing, parametric alternatives, and practical LoRaWAN design notes not duplicated in the RAK3172 datasheet.
RAK3172-9-SM-NI - LoRaWAN 915MHz Module, STM32WLE5, 15.5x15mm | RAKwireless
The RAKwireless RAK3172-9-SM-NI is a compact, low-power LoRaWAN transceiver module built around the STMicroelectronics STM32WLE5CCU6 SoC and supporting 915MHz, 920MHz, and 923MHz regional bands. The module is supplied in a 15.5x15 mm SMD package, operates from 2 V to 3.6 V, and is shipped without an integrated I-PEX antenna connector so designers can route the RF output to an external antenna or SMA pigtail. Per the RAKwireless datasheet, the module supports LoRaWAN 1.0.3 Classes A/B/C and exposes UART, SPI, and I2C host interfaces. A LoRaWAN module is a pre-certified radio transceiver that combines a long-range sub-GHz physical layer (typically based on Semtech SX126x or integrated equivalents inside the host SoC) with LoRaWAN MAC protocol firmware. These modules sit one level above a raw RF transceiver in the connectivity hierarchy and below the application MCU; they remove the burden of RF matching, antenna design, and regional regulatory certification, allowing engineers to add multi-kilometer wireless links to battery-powered IoT nodes. The RAK3172 integrates the LoRa modem directly inside the STM32WLE5CC application MCU, eliminating the external transceiver IC and shrinking BOM cost and PCB footprint. Key feature highlights include an LoRaWAN 1.0.3 Class A/B/C stack, a stated link range of up to 15 km in line-of-sight conditions, three low-power operating modes (transmit, receive, and sleep), and access to GPIO, ADC, and timers of the underlying Cortex-M4 host. The host runs an integrated LoRaWAN stack via AT commands or STM32Cube firmware, allowing rapid prototyping without external MCU glue logic. UART serves as the primary host interface for AT-command control, while SPI and I2C are exposed for direct MCU integration. The wide 2 V to 3.6 V supply range is well suited to single-cell Li-SoCl2, Li-ion, and 2x AA battery chemistries common in field-deployed sensors. The module is rated for an industrial operating temperature range of -40 C to +85 C. Its small 15.5x15 mm SMD footprint, combined with the absence of an I-PEX connector, makes it suitable for designs where the antenna is integrated on the host PCB (chip antenna or PCB trace) or routed via a pigtail to a chassis-mount SMA. Designers can leverage the Zephyr OS board support, RAK's AT-command firmware, or STM32Cube-based SDKs. Typical applications include battery-powered LoRaWAN end nodes, agricultural soil/moisture sensors, smart-city metering, asset tracking, and wireless alarm panels. Designers should evaluate antenna gain and ground clearance around the RF pad when migrating from the I-PEX-equipped RAK3172-9-SM-I to this no-I-PEX variant. A key design consideration is antenna selection: because the I-PEX connector is omitted, RF performance depends entirely on the external antenna implementation. A poorly matched antenna can reduce range by 10 dB or more. This page synthesizes distributor pricing, drop-in module alternatives, and field design notes that go beyond the manufacturer datasheet alone.
RAK3172-T - LoRaWAN Module, 20dBm, TCXO | RAKwireless | IoT
The RAKwireless RAK3172-T is a low-power, long-range LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC RF System-on-Chip, delivering up to 20 dBm output power from a 2 V to 3.6 V supply in a compact 15.5 x 15 mm castellated SMD stamp package. The -T variant integrates a 32 MHz temperature-compensated crystal oscillator (TCXO) for superior RF frequency accuracy over the industrial -40C to +85C operating range. A LoRaWAN module is a complete wireless subsystem that implements the LoRaWAN 1.0.3 MAC protocol on top of LoRa spread-spectrum physical-layer modulation, sitting within the LPWAN (low-power wide-area network) family of radio technologies used across the industrial IoT stack. Unlike a bare LoRa transceiver IC, the RAK3172-T embeds the MCU, radio, and RF matching network, so a host board only needs a UART/SPI link and an antenna. Key features include compliance with LoRaWAN Class A, B, and C, support for both LoRaWAN networks and pure LoRa point-to-point communication, up to 15 km line-of-sight range, and low active current of approximately 5.22 mA RX / 87 mA TX. Interfaces include UART, SPI, and I2C, enabling AT-command operation via RAKwireless RUI3 firmware or custom STM32WL development with STM32CubeIDE. The STM32WLE5CC SoC integrates an Arm Cortex-M4 core with the sub-GHz LoRa radio on a single die, reducing BOM count and board area versus discrete transceiver-plus-MCU designs. Compatibility with The Things Network (TTN), ChirpStack, and Actility server platforms simplifies end-device provisioning. The TCXO reference delivers tighter frequency tolerance than the standard RAK3172 crystal version, improving duty-cycle compliance and link reliability at band edges (863-870 MHz EU868 / 902-928 MHz US915, depending on variant). Typical applications include battery-powered IoT sensors, smart metering, asset trackers, and agricultural or smart-city nodes where multi-kilometer range and multi-year battery life are essential. Design consideration: place the module near the board edge with a keep-out area beneath the antenna feed, and always verify your regional frequency variant (-8 for 868 MHz, -9 for 915 MHz) before ordering. This page synthesizes distributor pricing, drop-in module variants, and practical design notes not found in the manufacturer datasheet.
RAK3172-T-8-SM-I - LoRaWAN 868MHz STM32WLE5 WisDuo Module
The RAKwireless RAK3172-T-8-SM-I is a low-power, long-range LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CC SoC, integrating an Arm Cortex-M4 MCU core and Semtech SX126x LoRa radio in a single die. The -T-8-SM-I variant is the tape-and-reel packaged, 868 MHz EU868 band, SMD castellation module with IPEX antenna connector, operating from a 2V to 3.6V supply and delivering up to +20 dBm transmit power. A LoRaWAN module is a pre-certified, surface-mount wireless subsystem that combines a microcontroller, a sub-GHz radio transceiver, an RF matching network, and an antenna interface into a single reflow-solderable PCB module. Within the broader wireless hierarchy, a LoRaWAN module sits above a bare transceiver IC and below a complete LoRaWAN end-device; the module approach lets product designers skip RF layout certification and reuse already-approved LoRaWAN 1.0.3 stacks. The RAK3172 belongs to the LPWAN family of modules using Chirp Spread Spectrum (CSS) modulation for long range, low data rate, and robust urban penetration. Key specifications of the RAK3172-T-8-SM-I include a +20 dBm maximum TX output power, approximately 5.22 mA average receive current, and up to 87 mA peak current at full +20 dBm transmit output. The module is housed in a 15.5 mm × 15 mm SMD castellation package with an operating temperature range of -40°C to +85°C and an RF range of approximately 15 km line-of-sight. Communication interfaces supporting serial SPI, UART, and I2C peripherals are exposed through the castellated edge pads. The STM32WLE5CC SoC at the heart of the module embeds a Cortex-M4 core running up to 48 MHz with 256 Kbytes of Flash and 64 Kbytes of SRAM, alongside the Semtech SX1262-compatible radio IP. This single-die integration removes the SPI bus between MCU and radio that earlier discrete designs required and reduces BOM cost. The module is pre-certified for the EU868 LoRaWAN band and supports Class A, B, and C end-device classes per LoRaWAN 1.0.3 specification. Typical applications for the RAK3172-T-8-SM-I include battery-powered IoT sensors for smart agriculture soil moisture monitoring, livestock asset tracking, smart metering for gas and water utilities, environmental monitoring stations, and industrial equipment predictive maintenance nodes. The IPEX antenna connector allows external antenna selection per deployment scenario, and the small 15.5 × 15 mm footprint fits inside compact enclosures. When designing with this module, ensure the host PCB exposes the IPEX connector footprint if an external antenna is planned, and add at least 10 µF of bulk decoupling near the module supply pin. The castellation pads are the only electrical connection - hand soldering requires a hot plate or precise iron tip. Confirm regional LoRaWAN band selection before purchasing: the -8- variant is for EU868, while other variants cover US915, AU915, AS923, IN865, and KR920 regions. This page synthesizes distributor pricing, drop-in same-band variants, and practical design considerations beyond the manufacturer datasheet, providing an engineering-grade resource for module selection and PCB integration.
RAK3172-T-9-SM-I - LoRaWAN 9 LoRa Module | RAK3172 WisDuo LPWAN
The RAK3172-T-9-SM-I is a compact, low-power LoRaWAN transceiver module based on the STMicroelectronics STM32WLE5CCU6 SoC, housed in a 15.5 x 15 mm surface-mount package with an integrated IPEX antenna connector. It supports LoRa and FSK modulation across the 9-band (902-928 MHz, US915/AU915/AS923 sub-bands) and operates from a 2 V to 3.6 V supply at 87 mA continuous transmit current and 5.22 mA receive current, with a stated link range of up to 15 km line-of-sight. A LoRa module (LoRaWAN transceiver) is a radio-frequency sub-system that implements the physical layer of the LoRaWAN low-power wide-area networking protocol defined by the LoRa Alliance. Within a wireless IoT node hierarchy, a LoRa module sits below the sensor/MCU logic, above the antenna matching network, and is governed by class-A/B/C MAC behavior for uplink/downlink scheduling on sub-GHz ISM frequencies in unlicensed bands. Key features of the RAK3172-T-9-SM-I include ultra-low-power sleep current suitable for battery-operated nodes, integrated ARM Cortex-M4 application core inside the STM32WLE5, native LoRaWAN 1.0.3 Class A/B/C firmware compatibility, and an SPI/UART/I2C host interface for external sensor integration. The IPEX MHF4 antenna connector simplifies field-replacement antenna selection and supports external high-gain antennas. The architecture combines STMicroelectronics' STM32WLE5 SoC with an on-board TCXO and RF matching network; this delivers improved frequency stability across temperature and reduced phase noise compared with XTAL-only designs. Internal DC-DC and LDO regulation allow the module to operate directly from 2 V to 3.6 V sources including single-cell Li-SoCl2 primary batteries. Typical applications include long-range battery-powered IoT sensors, agricultural and environmental telemetry nodes, smart-metering AMR/AMI endpoints, asset tracking, and industrial SCADA wireless extensions. Engineers choose the RAK3172 family for design-reuse compatibility across global LoRaWAN regional bands (8/EU868, 9/US915, AS923) via the trailing band code in the ordering scheme. When designing with this module, ensure the host PCB reserves a clearance keep-out beneath the IPEX connector, and verify host-MCU UART logic levels are 3.3 V tolerant. Sleep-mode firmware configuration (STM32WL STOP2/STANDBY) is required to meet the uA-class standby current claims needed for multi-year battery life. This page synthesizes distributor stock, regional band ordering variants, and practical design notes that the manufacturer datasheet alone does not compile in a single view.
RC1682-SIG - 868MHz Sigfox Transceiver Module | Radiocrafts
The Radiocrafts RC1682-SIG is a compact surface-mount Sigfox transceiver module operating in the European 868 MHz ISM band, housed in a 12.7 x 25.4 x 3.7 mm castellation package. It integrates a communication controller with embedded SIGFOX protocol software and delivers +14 dBm output power with -126 dBm downlink sensitivity for long-range, ultra-narrowband IoT connectivity. The module operates from a 2.8 V to 3.6 V supply, drawing 31 mA in transmit and 59 mA in receive, and supports 100 bps uplink / 600 bps downlink data rates consistent with the Sigfox RC1/RC2 protocol zones. A UART host interface, integrated reset function, and pre-certified European regulatory compliance simplify end-product certification, while the castellation footprint enables standard SMT reflow assembly. Sigfox is a Low Power Wide Area Network (LPWAN) technology that occupies ultra-narrow bandwidth (typically 100 Hz to 1.5 kHz per channel) in license-exempt sub-1 GHz bands to achieve kilometers of range at sub-milliwatt average power. As an LPWAN transceiver module, the RC1682-SIG belongs to the broader family of radio modules (sub-category: ISM < 1GHz) that sit between a host microcontroller and the antenna, replacing discrete RF design with a pre-certified subsystem and accelerating time-to-market for low-data-rate IoT endpoints such as smart meters, asset trackers, environmental sensors, and agricultural monitors. Key features of the RC1682-SIG include +14 dBm maximum output power (compliant with European ERC 70-03 duty-cycle and ETSI EN 300 220 limits), -126 dBm receiver sensitivity to maximize link budget in challenging RF environments, 100 bps uplink / 600 bps downlink air-data rates, and adaptive frequency hopping across the 868.13 MHz TX / 869.525 MHz RX Sigfox operating channels. The module exposes a UART host interface, a hardware reset pin, and configuration GPIOs, and operates across -30 °C to +85 °C industrial temperature ranges. On-board MCU with embedded SIGFOX stack removes the need for an external protocol library on the host. The module combines a sub-1 GHz radio transceiver, an embedded microcontroller running the SIGFOX protocol stack, and a TCXO-controlled frequency reference in a single shielded package. This integration trades design flexibility for time-to-market, allowing developers to focus on sensor firmware and cloud connectivity rather than RF matching, regulatory pre-compliance, and protocol software ports. Compared with discrete sub-GHz ICs + external MCU implementations, the RC1682-SIG reduces the bill-of-materials, lowers PCB area, and removes the need for in-house RF expertise. Typical applications include smart metering (water, gas, electric utility endpoints), environmental monitoring (air-quality, soil-moisture, weather stations), asset tracking and cold-chain telemetry, agricultural automation (livestock, irrigation), smart city infrastructure (parking sensors, waste-bin level sensing), and industrial alarm/button signaling. The combination of long range (kilometers in line-of-sight), low power consumption during narrow-band transmissions, and European pre-certification makes it well suited to battery-powered IoT endpoints that must operate for years on a single cell. When designing with the RC1682-SIG, follow Radiocrafts reference layout guidelines: place the module over a ground keep-out area on the host PCB, route the antenna feed as a 50 ohm controlled-impedance trace, provide adequate decoupling near the supply pin, and reserve UART access for in-field firmware updates via RCTools-SIG. Designers should also account for transmit duty-cycle limits (typically 1 % per channel per hour under ETSI EN 300 220) when sizing uplink message frequency. This page synthesizes distributor pricing, same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
RC1682-SSM - 868MHz Sigfox Transceiver Module | Radiocrafts
The Radiocrafts RC1682-SSM is a fully integrated, autonomous sensor-enabled surface-mount RF transceiver module operating in the European 868 MHz ISM band with pre-certified Sigfox protocol stack and measuring only 12.7 x 25.4 x 3.7 mm. The module delivers +15 dBm typical output power, supports uplink data rates of 100 bps and downlink at 600 bps, and operates from a 2.8 V to 3.6 V supply while drawing 58 mA in transmit mode. Integrated sensor interface, Sigfox protocol software, and an on-board communication controller eliminate the need for an external MCU on the network side. A Sigfox transceiver module is a compact radio device that implements the Sigfox low-power wide-area network (LPWAN) protocol stack, enabling battery-powered end nodes to transmit small telemetry packets to a base station over distances of several kilometers in the sub-1 GHz spectrum. Sigfox modules sit at the lowest tier of the wireless connectivity hierarchy: wireless module -> LPWAN module -> sub-GHz ISM transceiver -> RF module -> electronic module. Within an IoT system the module typically belongs to the sensor-node layer, between the battery/power-management block and the external sensor(s) being reported. Key features of the RC1682-SSM include a castellated surface-mount land pattern for SMT reflow assembly, an integrated chip antenna interface, pre-compliance with European ETSI EN 300 220 radio regulations, and a UART/SPI host interface for command and payload transfer. The module is intended for sensor-only nodes that transmit on a fixed schedule and do not require bidirectional firmware updates. The architecture combines an integrated sub-GHz transceiver, an 8-bit communication controller running the Sigfox Monarch-ready protocol stack, on-board matching network, and a regulated supply block accepting 2.8-3.6 V. Internally generated timing references and factory-calibrated sigma-delta PLLs reduce external BOM cost and remove the need for crystal sourcing on the customer side. Typical applications include remote battery telemetry, agricultural soil-moisture monitoring, gas-meter and water-meter automatic meter reading (AMR), environmental sensors, and asset-tracking tags where only uplink reporting is needed and downlink receive is occasional. When designing with the RC1682-SSM, keep the antenna keep-out region free of copper on all four PCB layers within the first 5 mm around the RF feed path, and provision a 100 nF decoupling capacitor within 2 mm of the supply pin. Average link budget in line-of-sight conditions reaches +15 dBm TX and a receive sensitivity around -126 dBm at 600 bps. This page synthesizes distributor pricing across DigiKey and global warehouses, drop-in and functional alternatives, and practical RF design notes that are not present on the manufacturer datasheet - giving the engineer a single reference for sourcing, replacement, and evaluation decisions.
RC1692HP-SIG - 25dBm 915MHz Sigfox Transceiver Module | Radiocrafts AS
The Radiocrafts AS RC1692HP-SIG is a high-power, fully integrated Sigfox transceiver module operating in the 902-928 MHz ISM band (FCC/ACMA regions), delivered in a compact 12.7 x 25.4 x 3.3 mm castellation surface-mount package. It delivers up to 25 dBm (316 mW) of output power, supports Sigfox uplink and downlink at 600 bps, and operates from a 2.8 V to 3.6 V supply while drawing approximately 36 mA in receive mode. A Sigfox transceiver module is a wireless radio subsystem that bundles the RF front-end, a microcontroller running the embedded Sigfox protocol stack, and regulatory-certified firmware into a single surface-mount device. Sigfox is a low-power wide-area network (LPWAN) protocol used for ultra-narrow-band IoT telemetry in the sub-1 GHz ISM bands. The RC1692HP-SIG belongs to the Radiocrafts RC1692 family of compact Sigfox modules, which are FCC- and ACMA-pre-certified, allowing end-product designers to skip most RF compliance testing. Key features include an integrated 25 dBm power amplifier for long-range links, on-board antenna matching network with U.FL RF connector option (depending on variant), built-in AES-128 hardware encryption, and a UART host interface for AT-command configuration. The module is pre-loaded with Sigfox library and is shipped with a unique device ID and PAC code for network registration. Low-power sleep modes reduce current consumption to microamp levels for battery-powered deployments. The RC1692HP-SIG uses a Silicon Labs sub-GHz transceiver IC paired with an embedded protocol controller running the Sigfox stack. Internal TCXO provides frequency stability across industrial temperature ranges. The 12.7 x 25.4 x 3.3 mm footprint is a standardized land pattern used across the Radiocrafts RC16xx family, allowing PCB reuse across regional variants (EU868, US915, AU915). Typical applications include wireless IoT sensor nodes for asset tracking, environmental monitoring, smart agriculture soil/moisture telemetry, smart metering backhaul, and industrial equipment monitoring in factories. The 25 dBm output power extends link budget to several kilometers in line-of-sight conditions, making it suitable for rural and wide-area deployments. When designing with this module, host firmware must initialize the UART interface at the correct baud rate and load the Sigfox PAC during onboarding. Engineers should follow the reference layout in the RC1692HP-SIG user manual for RF trace impedance and decoupling to preserve FCC/ACMA certification status. This page synthesizes distributor pricing, drop-in regional variants, and practical RF design notes not consolidated in the manufacturer datasheet, giving engineers a faster procurement and design entry point for Sigfox-enabled IoT products.
RC1692HP-SSM - 915MHz Sigfox HP RF Module | Radiocrafts
The Radiocrafts RC1692HP-SSM is a fully integrated, autonomous, sensor-enabled Sigfox RF transceiver module operating in the 902 to 928 MHz ISM band, housed in a compact 12.7 x 25.4 x 3.7 mm castellation surface-mount package. It delivers 24 dBm output power with a sensitivity of -124 dBm and supports 600 bps uplink (TX) and 600 bps (downlink RX) data rates over the Sigfox low-power wide-area network protocol. The module operates from a 2.8V to 3.6V supply voltage and is intended for long-range, ultra-low-power wireless sensor nodes in remote deployments. A Sigfox module is a pre-certified RF transceiver that bundles a radio IC, matching network, crystal reference, and protocol stack into a single PCB-mounted assembly, eliminating the need for RF design and FCC/ETSI radio certification by the end user. At the system hierarchy level, Sigfox modules sit within the RF & Wireless > RF Modules family, which in turn feeds into wireless IoT subsystems and the broader Industrial Internet of Things (IIoT) infrastructure. These modules typically support class 0u or class 1u Sigfox device classes and integrate antennas or antenna pin interfaces for rapid prototyping of low-throughput telemetry links. Key features include an integrated sensor interface for autonomous sensor readout, autonomous Sigfox protocol operation without an external host MCU for the radio layer, and castellated edge pads for SMT reflow soldering directly onto a host PCB. The module includes built-in radio configuration registers accessible via SPI or UART, and offers pre-loaded Sigfox ID and PAC keys for out-of-the-box connectivity. The compact 12.7 x 25.4 mm footprint allows integration into small sensor enclosures common in smart agriculture, asset tracking, and smart-city deployments. The RC1692HP-SSM uses a high-performance narrowband FSK/OOK transceiver architecture optimized for Sigfox's ultra-narrow-band (UNB) modulation in the 902-928 MHz sub-GHz band. The internal PA delivers +24 dBm conducted output, and the receiver chain achieves -124 dBm sensitivity, enabling multi-kilometer line-of-sight range in typical outdoor deployments. The module's TCXO reference provides tight frequency accuracy needed for Sigfox's regulatory emission masks and interference tolerance under the FCC Part 15.247 / EN 300 220 frameworks. Typical applications include wireless utility metering (gas, water, electric), environmental monitoring stations, agricultural soil and weather sensors, smart-parking sensors, asset-tracking beacons, and industrial control telemetry. The autonomous sensor interface mode allows battery-powered nodes to wake, measure, transmit, and return to deep sleep without host intervention, simplifying firmware and extending battery life to multi-year operation on primary cells. When integrating the RC1692HP-SSM, designers should provide an external antenna matched to 50 ohms at 915 MHz, observe clearances around the antenna feed, and follow Radiocrafts' reference layout for the host PCB ground plane treatment under the module. Decoupling capacitors of at least 1 uF must be placed within 5 mm of the VDD pin. RC1692HP-SSM-DK is the matching development kit for accelerated firmware bring-up and Sigfox backend registration. This page synthesizes distributor pricing tiers, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Prices are referenced as of 2026-10-19 from LCSC, DigiKey India, and YIC distributor listings, providing a consolidated cross-check missing from individual vendor pages.
RDR-80031BKU - Dual-Freq USB Card Reader | RF IDeas
The RF IDeas RDR-80031BKU is a dual-frequency WAVE ID Plus Mini credential reader that combines 125/132 kHz proximity and 13.56 MHz contactless smart-card reading in a compact 2.9 in x 1.7 in x 0.5 in black desktop housing with a 6 ft USB cable. It supports HID iCLASS ID, HID iCLASS SE, HID iCLASS Seos, MIFARE Classic, MIFARE DESFire EV1/EV2/EV3, and most other proximity and contactless smart-card credentials, with keystroke emulation output for plug-and-play enrollment or single-factor logon. A dual-frequency card reader is an RFID peripheral that interrogates both legacy 125/132 kHz proximity badges (used in older physical access systems) and modern 13.56 MHz contactless smart cards (used in logical access, secure print release, and PC login). Within the broader credential-reader taxonomy, the RDR-80031BKU sits between single-frequency desktop readers (limited to one technology) and full-fledged OEM reader modules, occupying the secure-workstation and enrollment tier where a small footprint and broad credential coverage matter most. The reader's key engineering attributes include support for four configurable card profiles, USB HID keystroke output, a 6 ft captive USB cable, and a rugged black plastic enclosure weighing 2.5 oz. The WAVE ID Plus Mini is marketed by RF IDeas as the smallest desktop reader in the dual-frequency category, enabling deployment at the point of use rather than at the door, while still accepting iCLASS Seos cards-the highest-security credential tier in HID's iCLASS family. Typical deployment scenarios include single sign-on (SSO) enrollment for workforce badge readers, secure print release stations, time-and-attendance kiosks, mustering/emergency-roll-call terminals, and Point-of-Sale (POS) age verification. The keystroke output eliminates the need for custom drivers on Windows, macOS, and most Linux distributions, and the iCLASS Seos support lets organizations standardize on a single reader across legacy and modern badge populations. When integrating, note that the keystroke model outputs the card's CSN or UID into the active cursor field. For applications that require signed or encrypted payloads, the SDK variant (RDR-80032BKU) is recommended instead of this keystroke model.
RF-BM-ND02 - BLE 4.2 nRF51822 Module | RF-Star | IoT
The RF-Star RF-BM-ND02 is a Bluetooth 4.2 Low Energy (BLE) RF module built on the Nordic Semiconductor nRF51822QFAA SoC, which integrates an ARM Cortex-M0 32-bit processor, 256 KB flash memory, 16 KB RAM, and AES hardware encryption, with an integrated 16.0 MHz crystal, LC filter, antenna matching network, and meander line inverted-F PCB antenna in a compact surface-mount castellated package. A Bluetooth Low Energy module is a complete short-range wireless subsystem combining a 2.4 GHz radio transceiver, a microcontroller, clock sources, and an antenna into a single pre-certified unit. Within the wireless connectivity hierarchy, BLE modules sit under RF modules, which belong to the broader family of short-range wireless communication devices. Using a module instead of a bare SoC removes RF layout, antenna tuning, and regulatory certification work from the OEM, drastically shortening time to market for connected products. Key features of the RF-BM-ND02 include support for Bluetooth v4.2 Low Energy as well as 2.4 GHz proprietary protocols, low power consumption suited to coin-cell battery operation, a compact footprint, robust connection distance from the inverted-F PCB antenna, and rigid reliability per the manufacturer hardware datasheet. The underlying nRF51822QFAA provides SPI master/slave, I2C master, and UART programming interfaces plus AES hardware encryption, enabling flexible sensor and peripheral designs. The nRF51822 architecture pairs the ARM Cortex-M0 core with a 2.4 GHz transceiver supporting GFSK modulation, programmable output power, and Nordic's SoftDevice BLE stack architecture, which separates protocol firmware from application code. The integrated LC filter and matched antenna network ensure consistent RF performance across production units without external RF components. Typical applications include battery-powered IoT sensors, smart home devices, beacons, medical wearables, and industrial wireless monitoring nodes where a pre-certified BLE link and secondary development capability reduce certification cost and design risk. When designing with this module, keep a clear keep-out area around the PCB antenna, feed it with a clean 2.4 GHz-rated power supply, and verify antenna detuning effects from nearby metal or ground planes. Because the module is BQB and FCC approved, careful layout preserves the certification grant. This page synthesizes verified datasheet parameters, drop-in alternatives, application guidance, and pricing context not found in the manufacturer datasheet alone.
RF-LORA-868-SO - 868MHz LoRa Transceiver Module, 16km | RF Solutions
The RF Solutions RF-LORA-868-SO is an 868 MHz LoRa spread-spectrum transceiver module delivering up to 16 km line-of-sight range, -130 dBm receive sensitivity, and +20 dBm (100 mW) transmit power in a surface-mount, castellated-edge SMT package. It integrates the Semtech SX1272 LoRa long-range transceiver and communicates with a host controller over SPI. A LoRa module is a sub-GHz radio transceiver sub-system that implements LoRa (Long Range) chirp spread spectrum modulation, a technology within the LPWAN (low-power wide-area network) family of radio standards. Unlike short-range protocols such as Bluetooth or Wi-Fi, LoRa trades data rate for link budget, enabling kilometer-scale links at milliamp-level currents - the reason it dominates battery-powered IoT telemetry. Key features of the RF-LORA-868-SO include the Semtech SX1272 chipset with ultra-long-range spread-spectrum communication and high interference immunity at minimal current consumption, receive-mode current of approximately 10 mA, a wide 2.2 V to 3.7 V supply range suitable for single lithium cell operation, and a 16 km maximum range. The module is a plug-and-play design intended to minimize RF design effort for OEM boards. Technically, the SX1272-based architecture supports multiple modulation schemes including LoRa, FSK, GFSK, GMSK, MSK and OOK, giving designers flexibility between raw packet radios and long-range LoRa links. The castellated SMT footprint permits reflow soldering directly onto the host PCB, with the antenna connected via an external feed point (antenna not included). Typical applications include smart metering, agricultural and environmental sensor networks, asset tracking, and general ISM-band (< 1 GHz) telemetry across Europe where the 868 MHz band is licensed-exempt. Design consideration: keep the transmit duty cycle within the 868 MHz band regulations, and provide a proper 50-ohm ground-referenced antenna feed - poor antenna matching is the most common cause of underperforming LoRa links. This page adds value beyond the datasheet by synthesizing distributor pricing (as of 2026-10-19), drop-in alternatives from the same family, and practical RF layout guidance in one reference.
RF1127 - 0.45-3.5GHz GaAs SPDT RF Switch | RFMD/Qorvo
The RF Micro Devices (now Qorvo) RF1127 is a broadband low-power single-pole double throw (SPDT) RF switch manufactured in GaAs (gallium arsenide) process technology, covering 450 MHz to 3500 MHz with a maximum insertion loss of 0.65 dB, housed in a leadless 6-pin QFN package measuring 2 x 1.30 mm with 0.385 mm height. An RF SPDT switch is a type of radio-frequency signal-routing device that alternately connects a single RF common port to one of two switched ports. Within the semiconductor hierarchy it belongs to the family of RF control components (RF switch ICs -> RF front-end components -> RF semiconductors), sitting alongside RF amplifiers, LNAs, and PA modules in the transmitter/receiver chain of wireless systems. GaAs switch ICs are favored over PIN-diode solutions because they switch faster, consume near-zero DC power, and integrate control logic on die. Key features of the RF1127 include very low insertion loss (0.65 dB maximum), good port-to-port isolation, excellent linearity, and exceptionally low DC power consumption. According to Qorvo, these characteristics make the device ideally suited for battery-operated applications that require high-performance switching with very little DC current draw, which is exactly the trade profile demanded by portable wireless products. Technically, the RF1127 uses GaAs FET switch cores with integrated negative-voltage generation or control logic (per the manufacturer datasheet), allowing direct drive from standard CMOS control lines in many designs. The small 2 x 1.30 mm leadless QFN footprint minimizes parasitic inductance, preserving broadband return loss up to 3.5 GHz. Its low power handling rating must be respected; this is a small-signal switch, not a high-power transmit switch. Typical applications include antenna switching between transmit and receive paths in portable wireless devices, band or filter bank selection in multi-band radios, and general-purpose RF signal routing in battery-powered test and telemetry equipment. Design consideration: because the RF1127 is a low-power switch, verify RF input power against the datasheet absolute maximum ratings and provide RF grounding vias close to the QFN ground pads to realize the published insertion loss and isolation. This page synthesizes verified distributor and manufacturer data, EOL replacement guidance, and practical design notes not consolidated in the manufacturer datasheet.
RFM95W-915S2 - 915MHz LoRa Transceiver Module, 20dBm | HOPERF
The HOPERF RFM95W-915S2 is a sub-GHz, low-power, long-range LoRa transceiver module operating in the 915MHz ISM band, providing ultra-long-range spread-spectrum communication with high interference immunity. The module integrates a Semtech SX1276-class LoRa modem, supports FSK/GFSK/GMSK/MSK/OOK modulation, delivers up to +20dBm (100mW) of transmit output power, and offers a maximum air-data rate of 300kbps. Sensitivity extends down to -148dBm in LoRa mode, enabling multi-kilometer line-of-sight links. The module is housed in a compact SMD package and is supplied from a 1.8V to 3.7V rail, making it directly compatible with battery-powered IoT nodes. A LoRa (Long Range) transceiver is a wireless modem that uses Chirp Spread Spectrum (CSS) modulation to achieve very high receiver sensitivity and robust link margins at low data rates. LoRa sits in the sub-GHz ISM radio category, above narrowband FSK radios in range/budget and below cellular LTE in cost/complexity, and it is widely deployed in LPWAN (Low-Power Wide-Area Network) applications under standards such as LoRaWAN. The RFM95W-915S2 brings this LoRa modem together with the matching network and a 915MHz SAW filter inside a single module, eliminating most of the RF design complexity for the host. Key features include +20dBm output power, -148dBm sensitivity (LoRa BW=125kHz, SF=12), 300kbps maximum bit rate, an SPI host interface, and a programmable bit rate on the air interface. Compared with the non-W (RFM95) variant, the W version adds an on-board PA (power amplifier) and LNA chain to support the higher +20dBm output and improved receive performance. The wide 1.8V–3.7V supply range permits direct Li-ion/Li-poly battery operation, while the SPI control port allows simple connection to microcontrollers such as STM32, ESP32, and Arduino-class boards. The module shares the same SPI register set as the Semtech SX1276 transceiver IC, allowing engineers to port existing LoRaWAN and RadioHead drivers without firmware changes. The LoRa modem provides spreading factors from SF6 to SF12, bandwidth settings from 7.8kHz to 500kHz, and an integrated CRC/packet handler. The high receiver sensitivity and high selectivity (typically >60dB adjacent channel rejection) make the part well-suited to dense urban LPWAN deployments as well as long-range agricultural and industrial telemetry. Typical applications include LoRaWAN end nodes, automatic meter reading, agricultural and environmental sensors, home and building automation, wireless alarm/security systems, industrial monitoring and SCADA telemetry, asset tracking, and remote control. The 915MHz variant is approved for use in regions including the US (FCC Part 15), Canada, Australia, and parts of Asia that allocate the 902–928MHz ISM band. When designing with this module, observe PCB layout guidelines for the antenna feed - keep the antenna trace impedance at 50 ohms and place a pi-matching network close to the module's RF pad - and respect the maximum duty cycle limits imposed by regional regulators. The 'W' suffix is required whenever +20dBm output is needed; for shorter links the lower-power RFM95 variant reduces current consumption significantly. This page synthesizes current distributor pricing, drop-in alternatives, and practical RF design notes not found in the manufacturer datasheet alone, helping engineers select and source the correct LoRa transceiver module for 915MHz IoT deployments.
RG255C-GL - 5G RedCap Sub-6GHz LGA Module | Quectel
The Quectel RG255C-GL is an industrial-grade 5G RedCap Sub-6 GHz LGA module based on 3GPP Release 17 RedCap technology, delivering a theoretical peak data rate of 223 Mbps in the downlink and 123 Mbps in the uplink, and supporting LTE Cat 4 and 5G Sub-6 GHz SA mode with backward compatibility to Rel-15 and Rel-16 networks. A 5G RedCap (Reduced Capability) module is a class of cellular IoT transceiver defined in 3GPP Release 17 that provides reduced-bandwidth, power-efficient 5G NR connectivity between full 5G modems and low-power LTE Cat-M/NB-IoT devices. Within the wireless connectivity hierarchy, RedCap sits under 5G NR within cellular wide-area networks, alongside LPWA technologies, making it a middle tier of the power-management and data-rate spectrum for IoT. Key features of the RG255C-GL include 5G LAN, URLLC and network slicing support, an integrated Qualcomm IZat location technology Gen 9VT GNSS receiver covering GPS, GLONASS, NavIC, BDS, QZSS and Galileo, and global band coverage (the GL variant) for wide multi-region deployment. The integrated GNSS receiver simplifies product design and provides quicker, more accurate and more dependable positioning without a separate positioning chip. The module is powered by Qualcomm RedCap platform silicon and supports rich host interfaces including USB, PCIe and UART, allowing integration into both embedded host processors and gateway designs. Support for URLLC and slicing enables industrial-grade latency and QoS segmentation on 5G SA networks, while LTE Cat 4 fallback ensures connectivity where 5G SA coverage is not yet available. Typical applications include industrial gateways and routers, battery- or plug-in-powered IoT devices, video surveillance backhaul, and smart-grid or telematics units that need mid-rate 5G with low power consumption. The GL variant is certified for global deployment, as evidenced by T-Mobile IoT device certification for the US market. Design consideration: the RG255C series is specified for industrial and commercial applications only, and system designers should plan antenna routing and thermal design around the LGA land pattern per the Quectel hardware design guide. This page synthesizes verified datasheet parameters, same-family drop-in variants, and practical design notes not found on the manufacturer product page, with pricing as of 2026-10-20.
RM500U - Quectel 5G Sub-6GHz M.2 Module NSA/SA | Quectel
The Quectel RM500U is an industrial-grade 5G Sub-6 GHz IoT module in an M.2 form factor, based on 3GPP Release 15/Release 16 technology, supporting both 5G NSA and SA modes with backward compatibility to 4G and 3G networks. A cellular IoT module is a self-contained wireless transceiver that integrates a 5G modem, baseband, RF front end, and firmware into a single surface-mount package, sitting at the top of the wireless connectivity hierarchy (IoT module -> cellular modem -> 5G NR transceiver -> wireless communication device). M.2 is a compact edge-connector standard that allows the module to plug into a host socket rather than being soldered, simplifying upgrades and field replacement. Key features include dual-mode 5G NR operation (NSA and SA), TDD and FDD support, multi-mode 5G/4G/3G fallback for worldwide LTE-A coverage, and feature refinements such as DFOTA (delta firmware over the air), VoLTE, and VoNR voice support. The RM500U series is specifically optimized for IoT, eMBB (enhanced Mobile Broadband), and URLLC (Ultra-Reliable Low-Latency Communication) traffic profiles. The series comprises three regional variants - RM500U-CN, RM500U-EA, and RM500U-CNV - each targeting different market band plans. The RM500U-CN adds dual-SIM (dual data cards) support. Designed in M.2, the RM500U series is footprint-compatible with Quectel RM500Q series modules, allowing a single host board design to address multiple 5G module options. Typical applications include industrial gateways and routers, CPE (customer premises equipment), smart city infrastructure, and mobile broadband terminals that need 5G speeds with reliable 4G fallback. Design consideration: verify band support of the chosen regional variant against your target carrier, and provide adequate M.2 socket keying and antenna RF routing for Sub-6 GHz frequencies. This page synthesizes distributor availability data, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
RM520N-EU - 5G Sub-6 M.2 Module EMEA/APAC/Brazil | Quectel
The Quectel RM520N-EU is an industrial-grade 5G NR Sub-6 GHz M.2 module targeted at EMEA, APAC, and Brazil markets, optimized for IoT and eMBB applications. Based on the 3GPP Release 16 specification, the module supports both 5G NSA (Non-Standalone) and SA (Standalone) modes, delivering peak downlink speeds up to 3.2 Gbps in NSA Sub-6 and 2.4 Gbps in SA Sub-6, with uplink rates of 600 Mbps and 900 Mbps respectively. Housed in a standard M.2 form factor (Key B), it provides drop-in compatibility with Quectel's RM50xQ series and LTE-A modules including EM06, EM12/EM12xR/EM120K, and EM160R-GL. A 5G module is a wireless modem subsystem that integrates RF transceiver, baseband processor, power management, and host interface into a single surface-mount module. Within the broader cellular hierarchy, 5G NR modules sit above LTE Cat-12/16 modules and below integrated application processors with embedded modems. They serve as the wireless backbone for fixed wireless access, industrial routers, mobile gateways, and edge-compute terminals where standalone cellular connectivity is required. Key features of the RM520N-EU include Qualcomm's Snapdragon X62 platform, multi-mode 5G NR / LTE-A / WCDMA fallback for forward and backward network compatibility, integrated multi-constellation GNSS (optional), and a Linux/Windows/Android driver stack accessible through AT commands. The module also provides embedded operating system support and voice capability, enabling it to serve gateways that require CSFB or VoLTE. The architecture leverages Release 16 enhancements including improved EN-DC, dynamic spectrum sharing, and 5G LAN features. Compared with the earlier X55-based RM50xQ, the X62 chipset improves power efficiency under Sub-6 carrier aggregation and reduces idle-mode current draw for always-connected industrial deployments. Typical applications include Fixed Wireless Access (FWA) customer-premises equipment, industrial IoT gateways, mobile hotspots and MiFi routers, smart retail terminals, and edge AI gateways requiring low-latency uplink. The EMEA/APAC/Brazil band set specifically covers the n1/n3/n5/n7/n8/n20/n28/n38/n40/n41/n77/n78/n79 Sub-6 bands used by European, Asian, and South American operators. When designing with the RM520N-EU, engineers should evaluate regional band compatibility against target operators - Quectel offers the RM520N-GL variant for global deployments requiring broader band coverage. PCB layout must observe M.2 Key-B mechanical constraints and provide adequate antenna isolation between the four Sub-6 antenna ports. This page synthesizes Quectel product documentation, regional band mapping, drop-in pin-compatible alternatives within the RM520N series, and practical integration guidance not consolidated in a single datasheet.
RM550V-GL - 5G Sub-6GHz M.2 Module 3.2Gbps | Quectel
The Quectel RM550V-GL is a 5G Sub-6 GHz NR cellular module in the standard M.2 (Key B) form factor measuring 30.0 x 52.0 x 2.3 mm, delivering peak downlink speeds of 3.2 Gbps (5G NSA) / 2.4 Gbps (5G SA) and uplink speeds of 900 Mbps (SA) / 600 Mbps (NSA), built on the Qualcomm X72 modem platform. An M.2 cellular module is a surface-mount wireless modem that plugs into a standardized M.2 socket on a host board, providing 5G/LTE connectivity without integrating the radio chain into the host design. Within the wireless product hierarchy, it sits under cellular modems, which in turn belong to RF modules and, more broadly, wireless communication components. The M.2 Key B connector standard allows designers to swap connectivity modules across product generations with minimal PCB redesign. Key features of the RM550V-GL include compliance with 3GPP Release 17, support for both 5G NSA and SA operating modes, up to 3 downlink component carriers with 200 MHz NR bandwidth, and multi-mode fallback to LTE Cat 20 (DL) / Cat 18 (UL) and UMTS WCDMA. This ensures the module maintains connectivity in areas without 5G coverage, a critical requirement for global-market IoT deployments. Technically, the module is built on the Qualcomm Snapdragon X72 platform, one of the most advanced 5G modem RF systems available, supporting global Sub-6 GHz bands. Control is performed via standard AT commands, simplifying integration with host processors running Linux, Android, or RTOS firmware. Community resources also document PCIe RC mode operation with custom firmware for advanced embedded routing applications. Typical applications include industrial IoT gateways, eMBB (enhanced Mobile Broadband) devices such as 5G CPE routers, smart agriculture terminals, and remote monitoring systems, where its high throughput and low latency directly improve data-intensive workloads like video streaming and cloud telemetry. A key design consideration is that the RM550V-GL is currently in the ES1 (Engineering Sample 1) phase according to community documentation, so production designs should plan firmware validation and anticipate commercial-release updates. Verify thermal design for sustained 3.2 Gbps throughput. This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, providing unique engineering value for module selection and second-source planning.
RNBD350PE-I100 - BT 6.0 LE Module w/ PCB Antenna | Microchip
The Microchip Technology RNBD350PE-I100 is a Bluetooth v6.0 (LE) transceiver module based on Microchip's PIC32CX-BZ3 Bluetooth Low Energy System-on-Chip, integrated with an onboard PCB trace antenna and shipped in a surface-mount LGA-30 (13.4 x 18.7 mm) package. Operating in the global 2.4 GHz ISM band, it exposes a Two-Wire or Four-Wire (Flow Control) UART command interface and is supplied from a single 3.3 V rail, simplifying host MCU/MPU integration. A Bluetooth Low Energy (BLE) module is a pre-integrated radio subsystem that bundles the radio transceiver, baseband, protocol stack, antenna and regulatory certification into a single solderable component. BLE modules sit within the broader taxonomy of wireless connectivity modules -> short-range transceivers -> RF modules, allowing designers to bypass RF design, certification, and stack porting. The RNBD350PE family is positioned as a plug-and-play BLE solution for embedded products, prioritizing rapid time-to-market over custom RF tuning. Key features include pre-certification for US (FCC), Canada (ISED), Europe (CE), Taiwan (NCC), China (SRRC), Japan (MIC) and Korea (KC) markets, support for Bluetooth 5.2 LE features such as Data Length Extension (DLE) and LE Secure Connections, an ASCII command set over UART, and a free Microchip mobile app (iOS and Android) plus source code for custom mobile applications. The integrated PCB trace antenna eliminates the need for an external antenna and keeps the BOM to a minimum. Architecturally, the RNBD350PE combines the PIC32CX-BZ3 SoC (Arm Cortex-M4F core with BLE radio and crypto accelerator), onboard LDO/PMU, crystal reference, RF matching network, and an embedded planar inverted-F antenna. Designers communicate with the module via a Microchip-defined ASCII command set, leaving firmware development focused on the application MCU rather than the BLE stack. Typical applications include IoT sensor nodes, industrial asset tracking, smart-home gateways, BLE beaconing for retail and healthcare, wireless HMI/remote-control front ends, and medical device telemetry. The pre-certified footprint lets designers avoid the 8-16 week regulatory lab cycle normally required for unlicensed 2.4 GHz products. When designing with this part, allocate a host-side UART (with optional CTS/RTS) and verify keep-out regions around the antenna per the PCB layout guide in the datasheet. Confirm firmware revision compatibility with the chosen host platform before locking firmware; Microchip regularly issues stack updates.
RNBD350UE-I100 - BLE 5.2 U.FL Module | Microchip Technology
The Microchip Technology RNBD350UE-I100 is a plug-and-play Bluetooth 5.2 Low Energy transceiver module operating in the 2.4 GHz band, with a U.FL connector for an external antenna (antenna not included), supplied from a 1.9 V to 3.6 V rail and housed in a shielded 30-pin surface-mount package measuring 13.4 x 18.7 mm. A Bluetooth Low Energy (BLE) module is a complete radio subsystem that implements the Bluetooth LE protocol stack, RF front end and antenna matching in a certified package, sitting within the hierarchy of wireless connectivity ICs: transceiver module -> RF transceiver -> radio IC -> semiconductor device. Unlike a chip antenna or a discrete radio design, a certified module such as the RNBD350UE requires no RF design work and no additional regulatory certification by the end-product manufacturer. Key features include true plug-and-play operation with no firmware programming required, communication with a host MCU or MPU over a Two-Wire or Four-Wire (flow-control) UART interface using Microchip's simple ASCII command set, and support for Bluetooth 5.2 features including 2 Mbps PHY, Data Length Extension (DLE) and LE Secure Connections, which are enabled by default for encrypted pairing resistance against passive eavesdropping. At its core, the RNBD350 module is based on Microchip's PIC32CX-BZ3 Bluetooth Low Energy System-on-Chip (SoC), which integrates the BLE radio, protocol stack and processing in a single silicon solution, providing a complete connectivity implementation in a pre-certified form factor. This architecture offloads all BLE stack management from the host, so the host processor only needs to parse simple ASCII commands. Typical applications include adding BLE connectivity to industrial sensors and actuators, smart-home and IoT end nodes, and embedded systems where the host MCU has no native radio. Because the module is plug-and-play, a design team can add certified Bluetooth LE connectivity in days rather than months. A key design consideration: since the U.FL antenna connector means the antenna is external, place the U.FL receptacle and its mating cable route away from switching-regulator components to preserve RF sensitivity, and ensure the host UART baud rate matches the module default configuration. This page synthesizes distributor pricing, availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
RS9116N-DB00-CC1-B2A - Dual-Band Wi-Fi + BT5 Module | Silicon Labs
The Silicon Labs RS9116N-DB00-CC1-B2A is a dual-band (2.4 GHz and 5 GHz) multi-protocol wireless connectivity module delivering 802.11 a/b/g/n Wi-Fi and dual-mode Bluetooth 5 in a surface-mount castellated CC1 module package with no external antenna included. A wireless connectivity module is a self-contained RF subsystem that integrates the radio transceiver, RF front end, crystal, and regulatory-certified antenna matching network into one certified unit. Modules sit above discrete SoCs in the system hierarchy (module -> RF subsystem -> connectivity IC -> wireless SoC) because they shorten time to market: the RF design is pre-validated, and FCC, IC, and ETSI/CE certifications carry over to the host product, eliminating costly in-house regulatory testing. Key features include simultaneous 2.4 GHz and 5 GHz band support for 802.11n clients and access points, dual-mode Bluetooth 5 for classic and low-energy links, and host interfacing over SDIO or USB. The module is FCC, IC, and ETSI/CE certified, and Silicon Labs supplies drivers for Linux and other high-level operating systems. Power-optimized performance extends battery life in portable designs while maintaining extended range. The -B2A suffix denotes the factory-preloaded firmware version, per the ordering information in the RS9116 CC1 datasheet; -B2B variants differ only in firmware. The RS9116N targets n-Link deployments, where the networking stack runs on the host Linux application processor and the module handles the wireless PHY/MAC. Operating modes include Wi-Fi Client, Wi-Fi Access Point, and Simultaneous Client plus Access Point, with up to 50 Mbps Wi-Fi application throughput per Silicon Labs n-Link documentation. Typical applications include industrial gateways and routers, Linux-based embedded systems needing certified dual-band connectivity, medical and instrumentation devices streaming data over Wi-Fi with a Bluetooth 5 provisioning path, and smart-building infrastructure. Design consideration: the module does not include an antenna, so an external antenna with matching 50-ohm feed must be selected and placed per the Silicon Labs layout guidance to preserve certification limits. This page adds value beyond the datasheet by synthesizing distributor availability, drop-in firmware-variant alternatives, cross-brand comparison candidates, and practical design notes in one reference.
RTAX4000SL-CQ352PROTO - 4M-Gate Radiation-Tolerant FPGA | Microchip
The Actel (Microchip/Microsemi) RTAX4000SL-CQ352PROTO is a radiation-tolerant, one-time-programmable FPGA with 4,000,000 equivalent system gates, 60,480 logic cells, and 40,320 CLBs, housed in a 352-pin ceramic CQFP (CQ352) metal-sealed cofired package. The PROTO suffix denotes a prototyping-oriented ordering option within the RTAX-S/SL space-flight family. A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) environment encountered in Earth-orbiting and deep-space missions. Within the power-management hierarchy of spacecraft avionics, such devices occupy the top tier of programmable logic, sitting above commercial FPGAs and below full rad-hard ASICs in cost and flexibility. Key differentiating features include true single-chip form factor enabled by antifuse programmability, live-at-power-up operation with no configuration device required, low static power consumption, and embedded SRAM blocks with built-in FIFO control logic. The RTAX-S/SL architecture derives from the commercial Microsemi Axcelerator family, inheriting segmentable clocks, chip-wide highway routing, and dedicated carry logic for arithmetic. Architecturally, each cluster contains logic cells built around register-rich C-cells and R-cells, with a maximum CLB combinatorial delay of 1.1 ns per the Microchip USA product listing. The CMOS process, combined with the ceramic metal-sealed CQFP352 package, supports operation across a military/space temperature range of -55C to +125C in surface-mount assembly. Typical applications include satellite payload data processing, spacecraft bus command and data handling, telecommunication transponder control, and launch-vehicle avionics, where single-chip integration and SEU robustness are decisive. A key design consideration is that antifuse RTAX devices are one-time programmable: engineers typically validate logic on an Aldec flash-based prototyping adaptor (e.g., ACT-H3Ki-CQ352) before committing to flight silicon, which is precisely the role the PROTO ordering option targets. This page synthesizes distributor listings, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
RTL8822CE - 867Mbps 802.11ac + BT5.0 M.2 Combo | Realtek
The Realtek RTL8822CE is a highly integrated dual-band WLAN + Bluetooth 5.0 2T2R combo chipset/module that supports IEEE 802.11a/b/g/n/ac with a maximum PHY data rate up to 867 Mbps, housed in an M.2 2230 form factor with Key A and Key E connectors. A WLAN combo module is a complete wireless connectivity subsystem that integrates the MAC, baseband, RF transceiver, and antenna interface on one card, plugging into a host through a standard M.2 edge connector. In the connectivity hierarchy, the RTL8822CE sits between discrete WLAN NICs and system-on-chip solutions: it is a Wi-Fi 5 (802.11ac Wave-2) plus Bluetooth radio targeting notebooks, mini PCs, and embedded boards. Key features include 2T2R dual-band operation in the 2.4 GHz and 5 GHz bands, 802.11ac Wave-2 MU-MIMO and 802.11n MIMO support, and Bluetooth 5.0 dual mode with backward compatibility to v4.2 and v2.1. Security encryption support covers WEP, WPA, WPA2, WPA3, WPS, and 802.1x. The WLAN subsystem attaches to the host over PCI Express, while the Bluetooth subsystem uses USB, giving designers two independent radio interfaces in one compact card. Technically, the RTL8822CE combines a WLAN MAC, a 2T2R-capable WLAN baseband, and the RF front end in a single chip. MU-MIMO allows simultaneous serving of multiple clients on the downlink, improving aggregate throughput in dense environments, while dual-band concurrency planning lets designers balance range (2.4 GHz) against throughput (5 GHz). Typical applications include notebook and mini PC wireless upgrade or repair, embedded systems and IoT gateways needing reliable dual-band Wi-Fi plus BLE, and industrial host boards using the common M.2 A/E key slot. Because it is a mature, widely whitelisted part, it is a frequent drop-in service replacement in HP, ASUS, and other laptop platforms. One design consideration: many consumer laptop BIOSes enforce a Wi-Fi card whitelist, so verify host compatibility before substituting a different vendor module; also note the RTL8822CE is a Wi-Fi 5 part and does not support Wi-Fi 6 (802.11ax). This page synthesizes distributor availability, module variants, drop-in alternatives, and practical replacement guidance not found in the manufacturer datasheet.