10AX115U3F45E2LG vs 10AX115U3F45E2SG Comparaison
Comparaison détaillée côte à côte de 10AX115U3F45E2LG par Intel et 10AX115U3F45E2SG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AX115U3F45E2LG | 10AX115U3F45E2SG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8 500,00 | $5 800,00 |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Embedded Memory Bits | 68,857,856 | 68,857,856 (≈ 52.99 Mbit) |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | -2 (E2 commercial/extended) |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | Variable-precision, hardened floating-point |
| PCIe Hard IP | Gen3 x8/x16 | — |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | — |
| Température de fonctionnement | 0C to +100C (Industrial, E2 grade) | Industrial (junction -40 °C to +100 °C) – device grade U |
| Type de montage | Surface Mount (BGA) | — |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | FPGA configuration via serial/parallel flash, JTAG |
| Statut RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Number of Transceivers | — | [DATA_NEEDED: per-die transceiver count, F45 package variant] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Hard Memory Controllers | — | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 IP Blocks | — | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| Boîtier | — | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| Process Node | — | 20 nm Tri-Gate (Intel) |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCP core voltage] |
| RoHS Compliance | — | Compliant |
| Niveau MSL | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |