10AX115U3F45E2LG vs 10AX115U3F45E2SG Comparison

Detailed side-by-side comparison of 10AX115U3F45E2LG by Intel and 10AX115U3F45E2SG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AX115U3F45E2LG 10AX115U3F45E2SG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $8,500.00 $5,800.00
Series Arria 10 GX —
Family Arria 10 Arria 10 GX
Logic Elements 1,150,000 —
Embedded Memory Bits 68,857,856 68,857,856 (≈ 52.99 Mbit)
User I/O Count 480 —
Speed Grade U3 (medium-performance, transceiver-focused) -2 (E2 commercial/extended)
Package Code F45 (45 × 45 mm FCBGA) —
Package Type 1932-ball FCBGA (Flip-Chip BGA) —
Process Technology 20 nm TSMC —
Transceiver Data Rate Up to 28.05 Gbps —
DSP Blocks Variable-precision, 1.5 TFLOPs FP32 Variable-precision, hardened floating-point
PCIe Hard IP Gen3 x8/x16 —
Memory Interfaces DDR4, DDR3, QDR IV, RLDRAM 3 —
Operating Temperature 0C to +100C (Industrial, E2 grade) Industrial (junction -40 °C to +100 °C) – device grade U
Mounting Type Surface Mount (BGA) —
Configuration Method SRAM-based, loaded via JTAG / AS / PS FPGA configuration via serial/parallel flash, JTAG
RoHS Status Compliant —
Lead-Free / Halogen-Free Yes / Yes —
Logic Elements (LE) — 1,150,000
Adaptive Logic Modules (ALM) — 427,200
Number of Transceivers — [DATA_NEEDED: per-die transceiver count, F45 package variant]
Maximum Transceiver Data Rate — 17.4 Gbps
Hard Memory Controllers — 2 (DDR4/DDR3/QDRII+/RLDRAM3)
Hard PCIe Gen3 IP Blocks — 2 × PCIe Gen3 (x8/x4/x2/x1)
Package — 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch)
Process Node — 20 nm Tri-Gate (Intel)
Supply Voltage Core — [DATA_NEEDED: VCC/VCCP core voltage]
RoHS Compliance — Compliant
MSL Level — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]

Datasheets & Resources

Browse All Products Create BOM Request Quote