A3PE3000-2FGG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
Référence : A3PE3000-2FGG324 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268 | $2 680,00 |
| 100 | $249 | $24 900,00 |
| 500 | $232 | $116 000,00 |
| 1 000 | $216 | $216 000,00 |
A3PE3000-2FGG324 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, memory blocks, and interconnects that designers program after manufacturing. Unlike SRAM-based FPGAs, the ProASIC3E family uses flash cells for configuration, meaning it is single-chip, instantly-on at power-up, and inherently secure against configuration bitstream copying because no external configuration flash is required.
Key features of the A3PE3000-2FGG324 include reprogrammable flash fabric supporting live design updates, embedded variable-width SRAM blocks for FIFO and dual-port memory implementations, advanced I/O supporting multiple single-ended and differential standards, and low total cost of ownership through elimination of external boot memory. The ProASIC3E family combines high performance with ultra-low-density-class cost structure and small-footprint packaging options.
Technically, the device uses Actel's third-generation flash architecture at 130nm, with speed grade 2 delivering up to 310 MHz system performance. The fabric includes PLLs for clock management, multiple embedded memory arrays totaling dedicated SRAM, and I/O banks that support LVDS-class differential signaling for high-speed board-level interfaces.
Typical applications include industrial automation and control, military and aerospace systems requiring secure instant-on logic, communications infrastructure, test and measurement equipment, and medical instrumentation where single-chip reprogrammability, configuration security, and reliable power-up behavior are required.
When designing with this device, plan power sequencing for the 1.5V core and auxiliary I/O rails, and verify I/O bank voltage compatibility with the board interface standards chosen. Because the fabric is flash-based, configuration corruption from cold-boot radiation or bitstream loss does not apply, simplifying system reliability analysis.
This page synthesizes distributor pricing tiers, verified drop-in alternatives, and engineering design notes not consolidated in the manufacturer datasheet, aiding selection and shortage-risk mitigation.
Alternatives de remplacement direct pour A3PE3000-2FGG324 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000-2FGG324 (même facteur de forme et même empreinte) — différant par Package, Family, RoHS Status, System Gates, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000-FG324
✅ Remplacement direct✓ En stock
$112.3 / unité
Voir la fiche technique →A3PE3000-FGG324I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →A3PE3000-2FGG324I
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →M1A3PE3000-2FGG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE3000L-FGG324I
✅ Remplacement direct✓ En stock
$62.65 / unité
Voir la fiche technique →A3PE3000-FG324I
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →A3PE3000-2FGG324 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| CLBs | 75264 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (single-chip, instant-on) |
| User I/O | 221 |
| Boîtier | 324-ball FBGA (FGG324) |
| Package Dimensions | 19 x 19 mm, 1 mm pitch, 1.63 mm height |
| Type de montage | Surface Mount |
| Speed Grade | 2 |
| Packaging Type | Tray |
| Statut RoHS | Green (RoHS compliant) |
| Automotive Qualification | Not qualified (standard grade) |
Guide de configuration des broches du A3PE3000-2FGG324 19 x 19 mm, 1 mm pitch, 1.63 mm height
Configuration des broches du A3PE3000-2FGG324 (boîtier 19 x 19 mm, 1 mm pitch, 1.63 mm height). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000-2FGG324.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000-2FGG324 convient pour 6 applications: Industrial Automation and Control, Military and Aerospace Secure Logic, Communications Infrastructure, Test and Measurement Equipment, Medical Instrumentation, Embedded System Prototyping and NPI.
Industrial Automation and Control
The A3PE3000-2FGG324 fits industrial automation controllers that need reprogrammable glue logic, motor-control sequencing, and fieldbus interface bridging. Its 3 million gates and 75,264 logic cells accommodate protocol state machines plus deterministic I/O handling, while flash configuration means the controller is operational within microseconds of power-up, eliminating boot delays that PLCs cannot tolerate. The 221 user I/O in a 19 x 19 mm FBGA connect encoders, sensors, and actuators over a compact footprint. Live firmware-style updates are possible through reprogramming without external boot memory, improving field serviceability. Compared with an MCU + CPLD combo, the single-chip ProASIC3E reduces BOM count and total cost of ownership.
Recommandé
Military and Aerospace Secure Logic
Flash-based FPGAs are the architecture of choice for defense electronics because the configuration resides in nonvolatile on-chip flash cells, immune to bitstream readback attacks and requiring no external configuration device that could be intercepted or corrupted. The A3PE3000-2FGG324 provides 3 million gates of secure, instantly-on logic for sensor preprocessing, bus bridging (MIL-STD-class interfaces), and payload control. The 310 MHz speed grade 2 rating supports real-time signal formatting, and the 1.5V core limits dynamic power in constrained platforms. FindIC cross-reference data confirms industrial and alternate-grade variants in the identical 324-ball FBGA, easing long-term supply for multi-year programs.
Recommandé
Communications Infrastructure
In telecom and networking line cards, the A3PE3000-2FGG324 implements framing, deskewing, and control-plane bridging between MACs, PHYs, and backplanes. The 310 MHz system performance at speed grade 2 covers common line-rate processing pipelines, and embedded SRAM blocks build FIFOs for clock-domain crossing. The 221 user I/O with differential signaling support handle LVDS-class high-speed links, while the flash fabric reconfigures for protocol updates in the field. Instant-on behavior matters in redundant systems where a failed line card must restore traffic without a multi-second configuration load. The 324-ball FBGA at 1 mm pitch fits standard 19 x 19 mm footprint card layouts.
Recommandé
Test and Measurement Equipment
Bench and automated test instruments use the A3PE3000-2FGG324 as a reconfigurable timing, trigger, and acquisition engine. Its 3 million gates implement channel state machines, trigger comparators, and data packaging into a common capture memory, while embedded SRAM buffers sample streams before host transfer. The flash-based fabric loads instantly at power-up, so instruments are ready within the warm-up cycle users expect, and the design can be updated across product revisions without board respins. The 1.5V core keeps internal dynamic power manageable inside sealed instrument enclosures. The 324-ball FBGA's 1 mm pitch allows rework-friendly assembly for low-volume instrument production.
Recommandé
Medical Instrumentation
Medical devices such as patient monitors, imaging front ends, and laboratory analyzers benefit from the A3PE3000-2FGG324's deterministic instant-on startup, which ensures the instrument is functional the moment power is applied, a behavior required in safety-conscious designs. The 3 million gate fabric implements acquisition pipelines, filter stages, and interface bridging to host processors, and the flash configuration eliminates an external boot device from the medical BOM, reducing qualification surface. The industrial-temperature drop-in variants in the same 324-ball FBGA support long product lifecycles demanded by regulatory certification timelines, and reprogrammability enables validated field upgrades.
Recommandé
Embedded System Prototyping and NPI
During new product introduction, the A3PE3000-2FGG324 serves as a programmable integration vehicle that absorbs glue logic, bus translation, and interface adaptation while the final ASIC or MCU firmware matures. The flash fabric reprograms in-circuit across design iterations, and single-chip configuration means prototype boards need no JTAG flash or configuration controller. Its 3 million gates cover mid-scale SoC companion logic, and the 310 MHz speed grade supports realistic system-level validation rather than throttled prototyping. When the design freezes, the same 324-ball FBGA footprint accommodates lower-cost alternate speed grades verified as drop-in by FindIC cross-reference data, protecting the PCB investment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000-2FGG324 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000-2FGG324I | M1A3PE3000-2FGG324I | A3PE3000L-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FGG324), 19 x 19 mm | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Temperature Range | Commercial (standard grade) | Standard | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Configuration | Flash, single-chip instant-on | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip | Flash, single-chip |
| Power Profile | Standard ProASIC3E | Standard | Standard | Standard | Standard | Low-power (L) |
Principaux différenciateurs
- Top speed grade in the family (vs A3PE3000-FGG324I)
- Single-chip flash configuration security (vs SRAM-based competitor FPGAs)
- Industrial-temperature drop-in options preserve qualification (vs M1A3PE3000-2FGG324I)
- Trade-off: standard commercial temperature only (vs A3PE3000-2FGG324I)
Notes de conception
The A3PE3000-2FGG324 requires a 1.5V core rail plus auxiliary and I/O bank rails; plan a multi-rail power tree and confirm I/O bank voltages match your signaling standards before layout. Estimated: static and dynamic current scale with clock activity and toggle rates, so run Microchip's power calculator (Libero SoC power analysis) with your actual post-route netlist rather than worst-case family numbers. Decouple each supply rail with bulk capacitance at the regulator plus 0.1 uF ceramics distributed across the 324-ball BGA via field; place at least one decoupling pair per rail corner.
The FGG324 package uses a 1 mm ball pitch on a 19 x 19 mm body, requiring a via-in-pad or dog-bone fanout with 0.5 mm via pads and 0.25 mm vias on standard geometry. Keep signal-length matching for differential pairs within the tolerance of the chosen I/O standard, and route core-adjacent balls first. Follow the ProASIC3E family datasheet ball map exactly when generating the footprint; do not derive the map from third-party summaries. Provide thermal relief via array under the package center since FBGA heat exits primarily through the balls.
Do not assume drop-in interchange without re-running timing: while FindIC confirms same terminals and package across A3PE3000 family variants, speed grades differ (310 MHz for -2 vs 231 MHz-class for others), so designs near timing closure must be re-verified with the substitute's timing model in Libero SoC. Also, the standard -2FGG324 is not industrial-temperature rated; if the end environment exceeds commercial range, order the 2FGG324I or M1A3PE3000-2FGG324I instead. Confirm die revision and security requirements before second-sourcing within the family.
Informations de conformité
Distributor listings describe the package as GREEN (RoHS compliant) per FindIC data for the FGG324 package. REACH, halogen-free, and conflict-minerals status not stated in provided data.
