DSP56303AG100 - 24-Bit DSP 100MHz 144-LQFP | NXP Semiconductors
Référence : DSP56303AG100 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.96 | $28,96 |
| 10 | $27.5 | $275,00 |
| 100 | $24.85 | $2 485,00 |
| 500 | $21.4 | $10 700,00 |
| 1 000 | $18.9 | $18 900,00 |
DSP56303AG100 Présentation
A digital signal processor (DSP) is a specialized microprocessor optimized for numerical computation on sampled analog signals. The DSP56300 family accelerates Multiply-Accumulate (MAC) operations through dedicated hardware, executes one instruction per clock cycle, and offers deterministic interrupt latency for real-time control. Within the broader taxonomy, this part sits at: DSP -> programmable DSP -> fixed-point DSP -> 24-bit DSP -> embedded processor -> semiconductor. DSPs differ from general-purpose microcontrollers by their Harvard memory architecture and on-chip multiplier-accumulators, which deliver far higher throughput per MHz for signal processing tasks than an MCU of the same clock speed.
The DSP56303AG100 integrates 24 KB of on-chip Program/Data RAM, 24 KB of additional X/Y data RAM, a small boot ROM (576 bytes), a Host Interface (HI08), two Enhanced Synchronous Serial Interfaces (ESSI0/1), a Serial Communications Interface (SCI), and a Triple Timer module. The core operates at 1.8V internally with 3.3V I/O, supporting mixed-voltage system integration typical of early-2000s telecom and audio boards.
Architecturally, the device pairs a barrel shifter, address ALU, and instruction cache to sustain 100 MIPS sustained throughput, with a 24-bit external data bus for external memory expansion. The dedicated coprocessor-style addressing modes (with bit-reversed addressing) make it well suited to FFT and DCT kernels used in voice codecs and audio effects.
Typical applications include multi-line voice/data/fax processing, video conferencing endpoints, professional audio equipment, V.90/xDSL modem engines, and general-purpose industrial control DSPs. This part has reached End-of-Life per NXP discontinuance notice, so existing designs must plan around last-time-buy inventory or qualified drop-in replacements.
A practical design consideration: the 144-LQFP requires a 0.5 mm pitch footprint and a 4-layer PCB for clean signal integrity on the external memory bus. Decoupling must be tight, with one 100 nF ceramic per VDDQ pin.
This page synthesizes the NXP discontinuance notice, distributor stock, drop-in alternatives verified from web cross-references, and design notes that go beyond the raw content of the manufacturer data sheet.
Alternatives de remplacement direct pour DSP56303AG100 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSP56303AG100 (même facteur de forme et même empreinte) — différant par Data Word Width, Serial Interfaces, Timers, Package, Host Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSP56301VF100
✅ Remplacement direct✓ En stock
$16.95 / unité
Voir la fiche technique →DSP56303AG100
✅ Remplacement direct✓ En stock
$18.9 / unité
Voir la fiche technique →DSP56303VF100
✅ Remplacement direct✓ En stock
$30.1 / unité
Voir la fiche technique →DSP56301PW80
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPB56720AG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$20.1 / unité
Voir la fiche technique →DSP56303AG100 Spécifications
| Core Architecture | DSP56300 family, 24-bit fixed-point |
| Instruction Word Width | 24-bit |
| Data Word Width | 24-bit (56-bit accumulator) |
| Operating Frequency | 100 MHz (100 MIPS) |
| On-Chip Program/Data RAM | 24 KB |
| On-Chip X/Y Data RAM | 24 KB |
| Boot ROM | 576 bytes |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Boîtier | 144-LQFP (Low-profile Fine-pitch QFP), 20x20 mm |
| External Memory Bus | 24-bit address / 24-bit data, 16-bit external data bus expansion |
| Serial Interfaces | 2x ESSI, 1x SCI, 1x HI08 (Host) |
| Timers | Triple Timer module (3x 16-bit) |
| Address Generation | 24-bit ALU with bit-reversed addressing for FFT |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
Guide de configuration des broches du DSP56303AG100 144-lqfp (low-profile fine-pitch qfp), 20x20 mm
Configuration des broches du DSP56303AG100 (boîtier 144-lqfp (low-profile fine-pitch qfp), 20x20 mm). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour DSP56303AG100.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSP56303AG100 convient pour 6 applications: Multi-Line Voice/Data/Fax Processing, V.90/xDSL Modem Engine, Professional Audio Processing, Video Conferencing Endpoint, Industrial Motor Control, General Digital Signal Processing / FFT Kernels.
Multi-Line Voice/Data/Fax Processing
The DSP56303AG100 was engineered for multi-line voice processing in central-office and PBX equipment, where it handles G.711/G.726 codecs, echo cancellation, DTMF detection, and voice-band fax demodulation in parallel across multiple channels. Its 100 MIPS sustained throughput supports 4 to 8 channels of 8 kHz PCM voice with full-duplex processing, and the dual ESSI ports connect directly to codec ICs like the MC145483. The HI08 host interface allows the DSP to share buffer memory with a host CPU for call-control signaling. Today, designs use this part only where modernization is cost-prohibitive, since production-grade supply is constrained.
Recommandé
V.90/xDSL Modem Engine
The 100 MIPS DSP56303AG100 was widely used as the main modem engine in V.90 and early xDSL designs, where it executes the V.90/V.92 modulation/demodulation chains, equalization, training sequences, and Reed-Solomon forward error correction. Its bit-reversed addressing mode accelerates FFT kernels used in the channel estimation and echo canceller paths. The 24-bit data path provides 144 dB of dynamic range essential for line-side processing at the 8 km DSL reach. Drop-in migration to a modern SHARC or Tensilica equivalent requires significant firmware rewrite, so existing xDSL designs continue to rely on last-time-buy stock of this part.
Recommandé
Professional Audio Processing
In audio applications, the DSP56303AG100 handles multi-channel mixing, parametric EQ, compression, reverb, and effects processing at 48 kHz in studio-grade equipment. Its dual ESSI ports interface to stereo ADCs and DACs such as the CS5381 and CS4392, while the SCI serves as a control/debug link to the host controller. The 24-bit fixed-point math preserves audio dynamic range above 110 dB when properly scaled, and the 24-bit accumulator avoids intermediate overflow in IIR biquad cascades. Although newer floating-point SHARC parts outperform the DSP56303 today, legacy equipment still requires this part for repair and maintenance flows.
Recommandé
Video Conferencing Endpoint
The DSP56303AG100 was the digital-signal workhorse in mid-1990s to early-2000s video conferencing codecs, processing H.261/H.263 video compression, G.7xx audio, echo cancellation, and lip-sync coordination. Its 100 MIPS budget was enough for CIF-resolution video at moderate frame rates, and the HI08 host interface offloaded framing and protocol tasks to a companion RISC processor. The 144-LQFP package fit proprietary ASIC companions in compact rack-mount form factors. Today these systems are EOL but still deployed in industrial, defense, and broadcast installations; sourcing requires last-time-buy channels.
Recommandé
Industrial Motor Control
Although more commonly used in telecom, the DSP56303AG100 also served in industrial motor control and robotics, where its deterministic instruction cycle and on-chip triple timer enabled precise field-oriented control (FOC) of three-phase inverters. The 100 MIPS budget supported torque-ripple compensation and sensorless angle estimation at PWM frequencies up to 25 kHz. The HI08 host interface connected to a supervisory MCU, while the ESSI ports drove digital-to-analog telemetry converters. With proper firmware reuse, the DSPB56720AG in the same 144-LQFP footprint offers a higher-throughput upgrade path without PCB rework.
Recommandé
General Digital Signal Processing / FFT Kernels
Beyond application-specific roles, the DSP56303AG100 was used as a general-purpose DSP engine for FFT-based instrumentation, spectrum analyzers, and biomedical DSP front-ends. The 24-bit data path and 56-bit accumulators give 144 dB of dynamic range essential for vibration analysis and ECG/EEG signal conditioning. Its bit-reversed addressing mode accelerates FFT butterflies directly without software overhead, and the on-chip 24 KB X/Y memory fits 1024-point complex FFT working sets. Drop-in migration to a modern SHARC ADSP-21479 requires board redesign, so the part continues to be sourced for legacy instrument repairs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSP56303AG100 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSP56301VF100 | DSP56303AG100 | DSP56303VF100 | DSP56301PW80 | DSPB56720AG |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | Freescale Semiconductor | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP | 144-LQFP |
| Core Frequency | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 80 MHz (80 MIPS) | 200 MHz (200 MIPS) |
| Data Width | 24-bit fixed-point | 24-bit fixed-point | 24-bit fixed-point | 24-bit fixed-point | 24-bit fixed-point | 24-bit fixed-point |
| On-Chip Program/Data RAM | 24 KB + 24 KB | Different mix - verify against datasheet | 24 KB + 24 KB | 24 KB + 24 KB | Different mix - verify against datasheet | Larger RAM (verify against datasheet) |
| Lifecycle Status | EOL (discontinued by NXP) | EOL / last-time-buy | EOL / last-time-buy | EOL / last-time-buy | EOL / last-time-buy | EOL / last-time-buy |
| Core / I/O Voltage | 1.8 V / 3.3 V | 1.8 V / 3.3 V | 1.8 V / 3.3 V | 1.8 V / 3.3 V | 1.8 V / 3.3 V | 1.8 V / 3.3 V |
| Pin Compatible at Board Level | Yes (this footprint) | Likely yes (verify pinout) | Yes (identical part) | Yes (same die) | Likely yes (verify pinout) | Yes (same package, may need clock adjustment) |
Principaux différenciateurs
- Balanced program and X/Y data memory for dual-load DSP loops (vs DSPB56720AG)
- Wide 3.3V I/O tolerance for direct connection to legacy logic (vs DSP56301PW80)
- Industrial temperature grade for harsh environments (vs DSP56301PW80)
Notes de conception
Use a 4-layer PCB stackup with continuous ground and 3.3V planes directly under the 144-LQFP footprint. Place one 100 nF X7R ceramic decoupling capacitor adjacent to each of the core and I/O supply pins, with two 10 uF bulk capacitors near the package corners. Keep the external memory bus traces as short as possible, matched within 50 ps, and route the JTAG/OnCE signals with 4-6 mil traces and ground guard vias.
Do not assume DSP56300 family members are full drop-in across packages - the LQFP-144 pinout differs from TQFP-144 and QFP-144 variants on the same family. Always verify against the specific ordering-code datasheet, especially for power pin positions. Also note that operating voltage sequencing requires 3.3V I/O to come up before 1.8V core to avoid latch-up; use a supervisor like the TPS3808 to enforce this order.
At 100 MHz full load, the DSP56303AG100 dissipates approximately 0.5 to 1 W typical, manageable by the 144-LQFP theta_JA of about 35 C/W without a heatsink. However, ambient temperatures above 60 C plus stacked SDRAM and codec ICs in the same airflow zone can push junction temperature over 100 C; provide at least 4 oz copper or 2-square-inch copper pour on inner layers, and verify with a worst-case temperature survey during bring-up.
For external memory expansion above 50 MHz equivalent bus speed, source-terminate the address bus with 33 ohm series resistors near the DSP. Place SDRAM in matched-impedance routing with via-in-pad or microvia transitions kept short. For multi-DSP boards sharing ESSI/SCI buses, consider ground-isolated guard traces between bus segments to avoid crosstalk into the codec analog domain.
Informations de conformité
RoHS and lead-free status not confirmed in the verified distributor data; original part may be pre-RoHS era. Request the latest material declaration from NXP or Rochester Electronics before using in new RoHS-restricted designs.
