EP1SGX25DF672C6N - Stratix GX FPGA, 25K LE, 672-FBGA | Intel (Altera)
Référence : EP1SGX25DF672C6N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265.5 | $2 655,00 |
| 100 | $245.75 | $24 575,00 |
| 500 | $228 | $114 000,00 |
| 1 000 | $210 | $210 000,00 |
EP1SGX25DF672C6N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor whose logic fabric, block RAM, DSP blocks, and I/O can be reconfigured after manufacture, allowing engineers to implement arbitrary digital logic, signal-processing pipelines, and high-speed serial interfaces without a custom ASIC. Stratix GX sits within Intel's high-performance FPGA hierarchy as a transceiver-equipped variant of the original Stratix family, optimized for communication, video, and signal-processing designs. This places the EP1SGX25DF672C6N at the high-performance end of the programmable-logic taxonomy: FPGA > programmable logic > semiconductor IC.
Key features include 2,566 LABs (Logic Array Blocks), 455 user I/O pins, embedded transceiver channels for high-speed serial connectivity, distributed and block RAM, dedicated DSP blocks for multiplication-intensive pipelines, and on-chip PLLs for clock generation and management. The 1.0 mm-pitch FBGA-672 package supports the high I/O count and transceiver signal-integrity requirements typical of line-card and backplane designs.
Typical applications include telecom line cards, broadband aggregation equipment, high-speed serial protocol bridging (e.g., custom SERDES-based links), video and image processing pipelines, and military/aerospace signal-processing subsystems. The 1.5 V core combined with multi-gigabit transceivers makes this part especially attractive where deterministic latency and high throughput are required.
When designing with this device, plan PCB stack-up, decoupling, and power sequencing carefully because 672-ball BGAs demand matched-length routing, abundant ground vias, and a multi-rail power network. The Altera (now Intel FPGA) Quartus II design suite supports this family natively, with reference designs, IP cores, and transceiver toolkits accelerating integration.
This page synthesizes distributor pricing, in-family drop-in alternatives, and practical design notes beyond what is repeated in the manufacturer datasheet, giving the engineer a faster procurement and design-validation path.
Alternatives de remplacement direct pour EP1SGX25DF672C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25DF672C6N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Speed Grade, Number of Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25DF672C6
✅ Remplacement direct✓ En stock
$96.5 / unité
Voir la fiche technique →EP1SGX25DF672C5N
✅ Remplacement direct✓ En stock
$1232.25 / unité
Voir la fiche technique →EP1SGX25CF672C7N
✅ Remplacement direct✓ En stock
$338.5 / unité
Voir la fiche technique →EP1SGX25CF672C6N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP1SGX25CF672C5
✅ Remplacement direct✓ En stock
$1304.99 / unité
Voir la fiche technique →EP1SGX25DF672C6N Valeurs maximales et caractéristiques électriques
| Series | Stratix GX |
| Family | Stratix GX (Stratix I GX) |
| Logic Elements / Cells | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/O Count | 455 |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Boîtier | FBGA-672 (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Température de fonctionnement | 0C to 85C (commercial) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| HTSUS Code | 8542.39.0001 |
| Statut RoHS | Lead Free (per part suffix 'N' designator) |
| Nombre de broches | 672 |
Configuration des broches de EP1SGX25DF672C6N
| Broche A1 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file for ball-specific function (FBGA-672 multi-function pins) |
| Broche B1 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A2 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B2 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A3 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B3 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A4 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B4 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A5 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B5 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A6 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B6 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A7 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B7 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A8 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B8 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A9 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B9 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche A10 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
| Broche B10 | I/O / GND / VCC — User I/O, power, or ground - refer to Quartus II pinout file |
Applications typiques
EP1SGX25DF672C6N convient pour 6 applications: Telecom Line Card Aggregation, High-Speed Serial Protocol Bridging, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, Industrial Control and Test Equipment, Legacy Replacement and Long-Life Maintenance.
Telecom Line Card Aggregation
The EP1SGX25DF672C6N's 25,660 logic elements and integrated high-speed transceiver channels make it well suited for telecom line-card aggregation, where multiple SERDES lanes must be bonded, packetized, and forwarded to a framer. With 455 user I/Os, designers can connect parallel SFI buses, tributary framers, and control-plane microcontrollers without external bridging logic. Its 1.5 V core combined with 130 nm CMOS process delivers deterministic latency required for telecom timing budgets. Quartus II IP cores support POS-PHY, SPI-4.2, and UTOPIA interfaces out of the box, accelerating time to market for legacy and next-gen line cards.
Recommandé
High-Speed Serial Protocol Bridging
Stratix GX transceivers let the EP1SGX25DF672C6N bridge between proprietary SERDES rates and standard protocols such as PCIe, XAUI, or custom backplane links. The 25K logic cell budget absorbs protocol stacks, link-training state machines, and DMA controllers on a single die, eliminating the need for a companion protocol ASIC. The FBGA-672 package with 1.0 mm pitch provides the controlled-impedance environment required for multi-gigabit signal integrity. Designers can use Quartus II's Transceiver Toolkit to characterize eye diagrams and tune pre-emphasis on a per-channel basis.
Recommandé
Video and Image Processing Pipelines
With 2,566 LABs and dedicated DSP blocks, the EP1SGX25DF672C6N implements real-time video scaling, deinterlacing, and color-space conversion pipelines for broadcast and surveillance equipment. The 455 user I/Os accept parallel BT.1120, DVI, or LVDS video streams and drive multi-format HDMI/DVI output stages without external bus switches. The 1.5 V core keeps power within a manageable envelope for fan-cooled video appliances, while the 0C-85C operating range supports standard commercial chassis. Reference designs from Altera provide head-start IP for SDI, DisplayPort, and HD-SDI transport.
Recommandé
Military and Aerospace Signal Processing
Although the EP1SGX25DF672C6N is commercial-grade (0C-85C), its high logic density and SERDES resources are commonly used as the development platform for ruggedized signal-processing subsystems that later transition to industrial-temperature Stratix GX parts. The FBGA-672 package supports controlled-impedance routing required by radar, EW, and SIGINT signal chains. Designers prototype the digital front-end on commercial parts and migrate to EP1SGX25 variants with industrial or military temperature grades once the architecture stabilizes, preserving Quartus II project compatibility across the swap.
Recommandé
Industrial Control and Test Equipment
Programmable-logic test platforms for industrial control use the EP1SGX25DF672C6N's 25K LEs to host custom stimulus generators, protocol emulators, and high-speed digitizer interfaces on a single FPGA. The 455 I/Os accept parallel ADC/DAC buses, isolated GPIO, and encoder feedback channels used in motor control and precision test. Quartus II's SignalTap logic analyzer embedded in the silicon allows non-intrusive debug during burn-in, eliminating the need for external logic analyzers in production test racks. The 1.5 V core plus PLLs simplifies multi-clock-domain timing for mixed-rate industrial protocols.
Recommandé
Legacy Replacement and Long-Life Maintenance
Because the EP1SGX25DF672C6N is obsolete, long-life programs in medical, industrial, and transportation infrastructure often must keep equivalent parts available for repair and spare-pool replenishment. Verified drop-in alternates such as EP1SGX25DF672C5N, EP1SGX25CF672C7N, and EP1SGX25CF672C6N share the FBGA-672 footprint, allowing qualified re-work on existing boards. Field engineers can re-spin service stock by sourcing the same Quartus II bitstream across these variants, provided the timing closure is re-validated. This protects multi-decade service commitments on deployed equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25DF672C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25DF672C6 | EP1SGX25DF672C5N | EP1SGX25CF672C7N | EP1SGX25CF672C6N | EP1SGX25CF672C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-672 (33x33 mm, 1.0 mm pitch) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) | FBGA-672 (same) |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O Count | 455 | 455 | 455 | 455 | 455 | 455 |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | C6 | C5 (slower) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead-Free | Yes (lead-free, 'N' suffix) | No (SnPb finish) | Yes | Yes | Yes | No (SnPb finish) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Drop-in interchangeable with full family (vs EP1SGX25DF672C5N)
- Higher-density Stratix GX 25K variant for richer pipelines (vs EP1SGX10DF672C6N)
- Lead-free RoHS variant of the same die (vs EP1SGX25DF672C6)
Notes de conception
FBGA-672 at 1.0 mm pitch requires a 4-to-6 layer PCB stack-up with matched-length differential routing and a continuous ground reference plane beneath every transceiver lane. Place 0.1 uF X7R decoupling capacitors within 2 mm of every VCC ball, with bulk 10-22 uF tantalum or polymer capacitors on each power rail. Route all high-speed SERDES lanes on the top microstrip layer with no more than two vias per TX/RX pair, and stitch ground vias along the lane edges to suppress return-path discontinuities.
Although the 130 nm Stratix GX FPGA is not the highest-power device in its class, a fully populated 25K-LE design with all transceivers active can dissipate 5-8 W. The FC-FBGA-672 package relies on the PCB top-side copper pour and forced airflow for cooling. Provide at least 4 cm^2 of contiguous top copper under the BGA, thermal vias to inner ground planes (0.3 mm drill, 0.6 mm pitch), and a low-velocity (~1 m/s) heatsink or fan in enclosed chassis to keep junction temperature below 100C.
Do not assume pin compatibility with the smaller FBGA-484 or FBGA-1020 Stratix GX parts; the FBGA-672 ball map is unique to this package and the 672-ball family. When migrating to EP1SGX25DF1020 variants, expect a complete BGA re-ball, pin remapping, and Quartus II device re-assignment. Also verify that all configuration pins (MSEL, nCE, nCONFIG, DATA, DCLK) are pulled correctly during power-up - misconfigured MSEL pins are a common cause of silent configuration failure on first prototypes.
Informations de conformité
Lead-free per 'N' suffix; HTSUS 8542.39.0001 confirmed by DigChip listing. REACH, halogen-free, and conflict-minerals declarations not explicitly provided in verified web data.
