EP20K100CF144C9 - APEX-20K FPGA 100K Gates 144-LQFP | Intel
Référence : EP20K100CF144C9 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.4 | $78,40 |
| 10 | $70.56 | $705,60 |
| 100 | $62.72 | $6 272,00 |
| 500 | $55.85 | $27 925,00 |
| 1 000 | $49 | $49 000,00 |
EP20K100CF144C9 Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) category in the broader semiconductor taxonomy: FPGA -> programmable logic device -> logic IC -> integrated circuit. Unlike ASICs, FPGAs are configured post-fabrication via an SRAM-based or antifuse-based configuration bitstream, allowing rapid prototyping and in-system reconfigurability for telecom, industrial control, and DSP applications.
Key features of the EP20K100CF144C9 include four embedded system blocks (ESBs) that can be configured as dual-port RAM, ROM, FIFO, or CAM; 4,160 logic elements (LEs) grouped in Logic Array Blocks (LABs); 53,248 bits of embedded RAM; and 93 user I/O pins compatible with LVTTL, LVCMOS, and other common I/O standards. The device supports in-system programmability (ISP) via the IEEE 1149.1 JTAG interface, allowing configuration bitstream updates in the field without removing the device from the PCB.
The APEX-20K architecture features a MultiCore interconnect routing fabric that links LEs and ESBs across four hierarchical levels (L1-L4), enabling predictable timing closure and high utilization. The die operates from a 2.5 V core supply and supports multi-voltage I/O via separate VCCIO banks. Maximum internal clock frequencies depend on the design's LE utilization and routing but typically reach 100 MHz for combinatorial datapaths and 180 MHz for registered I/O at commercial temperature.
Typical applications for the EP20K100CF144C9 include high-speed glue logic replacement, custom bus interfaces, protocol bridging (PCI to local bus, UART to parallel), industrial control signal conditioning, and prototyping of ASIC-equivalent functions before mask production. The commercial speed grade (-C9) targets moderate-frequency designs where lower-cost packages and the LQFP-144 footprint are preferred over BGA packages for hand-solderable prototyping and field service.
When designing with this device, ensure proper configuration source selection via MSEL pins (EPCS serial configuration devices, JTAG, or CPU-driven passive serial), and provide a clean 2.5 V core rail with adequate decoupling (typically 0.1 µF + 10 µF bulk) near each VCC pin pair. The 144-LQFP package has a 1.0 mm pitch, requiring careful PCB layout to maintain signal integrity at the edge rates typical of APEX-20K I/O.
This page synthesizes distributor stock indicators, drop-in alternatives drawn from the same APEX-20K family and cross-brand pin-compatible equivalents, and practical design notes not found in the manufacturer datasheet. Lifecycle status, parametric values, and pricing references reflect distributor data as of 2026-09-07 and may shift as Intel continues long-term support for the legacy APEX-20K line.
Alternatives de remplacement direct pour EP20K100CF144C9 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100CF144C9 (même facteur de forme et même empreinte) — différant par Speed Grade, Process Technology, Package, Family, Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100CF144C8
✅ Remplacement direct✓ En stock
$36 / unité
Voir la fiche technique →EP20K100CF144C8ES
✅ Remplacement direct✓ En stock
$26.4 / unité
Voir la fiche technique →EP20K100CF144C7
✅ Remplacement direct✓ En stock
$28.4 / unité
Voir la fiche technique →EP20K100CF144C7ES
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP20K100CF144C9 Valeurs maximales et caractéristiques électriques
| Family | APEX-20K |
| Device Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Embedded System Blocks (ESBs) | 4 |
| Maximum User I/O Pins | 93 |
| Embedded RAM Bits | 53,248 |
| Boîtier | 144-LQFP |
| Configuration Method | SRAM / JTAG (IEEE 1149.1) |
| Core Voltage | 2.5 V |
| Speed Grade | C9 (commercial) |
| Operating Temperature (Commercial) | 0C to +85C |
| Type de montage | Surface Mount |
Configuration des broches de EP20K100CF144C9
| Broche 1 | I/O — User I/O (bank 1) |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | I/O — User I/O (bank 1) |
| Broche 6 | I/O — User I/O (bank 1) |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | VCCIO1 — I/O bank 1 supply |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O (bank 1) |
| Broche 14 | I/O — User I/O (bank 1) |
| Broche 15 | I/O — User I/O (bank 1) |
| Broche 16 | I/O — User I/O (bank 1) |
| Broche 17 | I/O — User I/O (bank 1) |
| Broche 18 | I/O — User I/O (bank 1) |
| Broche 19 | I/O — User I/O (bank 1) |
| Broche 20 | I/O — User I/O (bank 1) |
| Broche 21 | I/O — User I/O (bank 1) |
| Broche 22 | I/O — User I/O (bank 1) |
| Broche 23 | GND — Ground |
| Broche 24 | I/O — User I/O (bank 1) |
| Broche 25 | I/O — User I/O (bank 1) |
| Broche 26 | I/O — User I/O (bank 1) |
| Broche 27 | I/O — User I/O (bank 1) |
| Broche 28 | I/O — User I/O (bank 1) |
| Broche 29 | I/O — User I/O (bank 1) |
| Broche 30 | I/O — User I/O (bank 1) |
| Broche 31 | I/O — User I/O (bank 1) |
| Broche 32 | I/O — User I/O (bank 1) |
| Broche 33 | I/O — User I/O (bank 1) |
| Broche 34 | VCCINT — Core supply (2.5 V) |
| Broche 35 | I/O — User I/O (bank 2) |
| Broche 36 | I/O — User I/O (bank 2) |
| Broche 37 | I/O — User I/O (bank 2) |
| Broche 38 | I/O — User I/O (bank 2) |
| Broche 39 | I/O — User I/O (bank 2) |
| Broche 40 | I/O — User I/O (bank 2) |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O (bank 2) |
| Broche 43 | I/O — User I/O (bank 2) |
| Broche 44 | I/O — User I/O (bank 2) |
| Broche 45 | I/O — User I/O (bank 2) |
| Broche 46 | I/O — User I/O (bank 2) |
| Broche 47 | I/O — User I/O (bank 2) |
| Broche 48 | I/O — User I/O (bank 2) |
| Broche 49 | I/O — User I/O (bank 2) |
| Broche 50 | I/O — User I/O (bank 2) |
| Broche 51 | I/O — User I/O (bank 2) |
| Broche 52 | I/O — User I/O (bank 2) |
| Broche 53 | VCCIO2 — I/O bank 2 supply |
| Broche 54 | I/O — User I/O (bank 2) |
| Broche 55 | I/O — User I/O (bank 2) |
| Broche 56 | I/O — User I/O (bank 2) |
| Broche 57 | I/O — User I/O (bank 2) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O (bank 3) |
| Broche 60 | I/O — User I/O (bank 3) |
| Broche 61 | I/O — User I/O (bank 3) |
| Broche 62 | I/O — User I/O (bank 3) |
| Broche 63 | I/O — User I/O (bank 3) |
| Broche 64 | I/O — User I/O (bank 3) |
| Broche 65 | I/O — User I/O (bank 3) |
| Broche 66 | I/O — User I/O (bank 3) |
| Broche 67 | I/O — User I/O (bank 3) |
| Broche 68 | I/O — User I/O (bank 3) |
| Broche 69 | VCCINT — Core supply (2.5 V) |
| Broche 70 | I/O — User I/O (bank 3) |
| Broche 71 | I/O — User I/O (bank 3) |
| Broche 72 | I/O — User I/O (bank 3) |
| Broche 73 | I/O — User I/O (bank 3) |
| Broche 74 | I/O — User I/O (bank 3) |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O (bank 3) |
| Broche 77 | I/O — User I/O (bank 3) |
| Broche 78 | I/O — User I/O (bank 3) |
| Broche 79 | I/O — User I/O (bank 3) |
| Broche 80 | I/O — User I/O (bank 3) |
| Broche 81 | I/O — User I/O (bank 3) |
| Broche 82 | VCCIO3 — I/O bank 3 supply |
| Broche 83 | I/O — User I/O (bank 3) |
| Broche 84 | I/O — User I/O (bank 3) |
| Broche 85 | I/O — User I/O (bank 3) |
| Broche 86 | I/O — User I/O (bank 3) |
| Broche 87 | I/O — User I/O (bank 3) |
| Broche 88 | I/O — User I/O (bank 3) |
| Broche 89 | I/O — User I/O (bank 4) |
| Broche 90 | I/O — User I/O (bank 4) |
| Broche 91 | I/O — User I/O (bank 4) |
| Broche 92 | GND — Ground |
| Broche 93 | I/O — User I/O (bank 4) |
| Broche 94 | I/O — User I/O (bank 4) |
| Broche 95 | I/O — User I/O (bank 4) |
| Broche 96 | I/O — User I/O (bank 4) |
| Broche 97 | I/O — User I/O (bank 4) |
| Broche 98 | I/O — User I/O (bank 4) |
| Broche 99 | I/O — User I/O (bank 4) |
| Broche 100 | I/O — User I/O (bank 4) |
| Broche 101 | I/O — User I/O (bank 4) |
| Broche 102 | I/O — User I/O (bank 4) |
| Broche 103 | VCCIO4 — I/O bank 4 supply |
| Broche 104 | I/O — User I/O (bank 4) |
| Broche 105 | I/O — User I/O (bank 4) |
| Broche 106 | I/O — User I/O (bank 4) |
| Broche 107 | I/O — User I/O (bank 4) |
| Broche 108 | I/O — User I/O (bank 4) |
| Broche 109 | GND — Ground |
| Broche 110 | I/O — User I/O (bank 4) |
| Broche 111 | I/O — User I/O (bank 4) |
| Broche 112 | I/O — User I/O (bank 4) |
| Broche 113 | I/O — User I/O (bank 4) |
| Broche 114 | I/O — User I/O (bank 4) |
| Broche 115 | I/O — User I/O (bank 4) |
| Broche 116 | I/O — User I/O (bank 4) |
| Broche 117 | VCCINT — Core supply (2.5 V) |
| Broche 118 | I/O — User I/O (bank 1) |
| Broche 119 | I/O — User I/O (bank 1) |
| Broche 120 | I/O — User I/O (bank 1) |
| Broche 121 | I/O — User I/O (bank 1) |
| Broche 122 | I/O — User I/O (bank 1) |
| Broche 123 | GND — Ground |
| Broche 124 | MSEL0 — Configuration mode select 0 |
| Broche 125 | MSEL1 — Configuration mode select 1 |
| Broche 126 | nSTATUS — Configuration status (open-drain) |
| Broche 127 | nCONFIG — Configuration control (active-low) |
| Broche 128 | CONF_DONE — Configuration complete (open-drain) |
| Broche 129 | TCK — JTAG test clock |
| Broche 130 | TMS — JTAG test mode select |
| Broche 131 | TDI — JTAG test data in |
| Broche 132 | TDO — JTAG test data out |
| Broche 133 | VCCINT — Core supply (2.5 V) |
| Broche 134 | I/O — User I/O (bank 1) |
| Broche 135 | I/O — User I/O (bank 1) |
| Broche 136 | I/O — User I/O (bank 1) |
| Broche 137 | I/O — User I/O (bank 1) |
| Broche 138 | I/O — User I/O (bank 1) |
| Broche 139 | I/O — User I/O (bank 1) |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O (bank 1) |
| Broche 142 | I/O — User I/O (bank 1) |
| Broche 143 | I/O — User I/O (bank 1) |
| Broche 144 | I/O — User I/O (bank 1) |
Applications typiques
EP20K100CF144C9 convient pour 6 applications: High-Speed Glue Logic Replacement, Custom Bus Interface Bridging, ASIC Prototyping and Emulation, Industrial Control Signal Conditioning, DSP Pipeline Implementation, Telecom Protocol Converter.
High-Speed Glue Logic Replacement
The EP20K100CF144C9 fits glue logic replacement applications because its 4,160 logic elements and 100,000-gate capacity absorb dozens of 74-series TTL parts into a single reconfigurable device. The 93 user I/O pins in the 144-LQFP package comfortably handle the bidirectional buses and control signals typical of legacy board-level glue. Engineers route clock-domain crossings through the ESB dual-port RAM blocks, achieving deterministic timing via the MultiCore interconnect rather than discrete flip-flops and buffers.
Recommandé
Custom Bus Interface Bridging
The EP20K100CF144C9 bridges PCI, VME, or proprietary local buses by mapping bus protocols into the 53,248 bits of embedded ESB RAM, with the LAB fabric handling address decoding and bus arbitration. The 144-LQFP package exposes enough user I/O to drive 32-bit data plus control signals on both sides of the bridge. Its C9 speed grade comfortably supports 33 MHz PCI at commercial temperature, while the JTAG interface enables post-deployment protocol updates.
Recommandé
ASIC Prototyping and Emulation
Engineers prototype ASIC designs on the EP20K100CF144C9 because its 100K-gate capacity emulates mid-complexity ASICs before committing to mask sets. The 4,160 logic elements and 4 ESBs reproduce standard-cell plus compiled-memory designs with predictable timing closure via the MultiCore routing fabric. The 144-LQFP package's 0.5 mm pitch is hand-solderable for prototype boards, and JTAG reprogramming allows rapid RTL iteration between design passes without external programming hardware.
Recommandé
Industrial Control Signal Conditioning
The EP20K100CF144C9 handles industrial control signal conditioning by combining logic-level translation, debouncing, and protocol conversion in a single device. The 93 user I/O pins accept mixed-voltage signals via independent VCCIO banks (3.3 V / 2.5 V / 1.8 V), eliminating external level shifters. ESB blocks implement FIFO buffers for UART-to-parallel bridges, while the LAB fabric runs state machines for motor control timing. Commercial temperature range covers most indoor industrial enclosures.
Recommandé
DSP Pipeline Implementation
The EP20K100CF144C9 implements moderate-complexity DSP pipelines such as FIR filters, FFT pre-processors, and modulation codecs using the 4,160 logic elements for datapath arithmetic and the 4 ESBs for coefficient storage and delay lines. The MultiCore interconnect fabric supports parallel multiplier trees at 80-100 MHz in C9 speed grade. Its 144-LQFP package fits within the 1.0 mm-pitch PCB area typical of embedded DSP cards, with JTAG enabling post-deployment algorithm updates.
Recommandé
Telecom Protocol Converter
The EP20K100CF144C9 fits telecom protocol conversion between legacy TDM and packet networks because its 53,248 bits of embedded RAM store frame buffers and lookup tables for protocol translation. The 93 user I/O pins accommodate serial LVDS or TTL links on both TDM and Ethernet sides. Commercial temperature range suits indoor central-office deployments, while JTAG allows remote firmware upgrades via in-system programming. C9 timing supports standard E1/T1 line rates comfortably.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100CF144C9 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100CF144C8 | EP20K100CF144C8ES | EP20K100CF144C7 | EP20K100CF144C7ES | EP20K100CB356C9 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 356-BGA - different (requires PCB rework) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Speed Grade | C9 (commercial) | C8 (faster) | C8 (faster) | C7 (fastest) | C7 (fastest) | C9 (same as target) |
| Embedded System Blocks (ESBs) | 4 | 4 | 4 | 4 | 4 | 4 |
| Embedded RAM Bits | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 | 53,248 |
| Configuration Method | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG | SRAM / JTAG |
Principaux différenciateurs
- LQFP-144 footprint is hand-solderable for prototyping (vs EP20K100CB356C9 (356-BGA package))
- C9 speed grade is the lowest-cost bin in the family (vs EP20K100CF144C8 (C8 speed grade))
- Embedded System Blocks (ESBs) replace external SRAM/FIFO chips (vs EP20K100CF144C7 with external memory)
Notes de conception
The APEX-20K EP20K100 requires a clean 2.5 V ±5% core supply (VCCINT) plus separate VCCIO rails per I/O bank (typically 3.3 V, 2.5 V, or 1.8 V). Place a 0.1 µF X7R ceramic decoupling capacitor within 5 mm of every VCCINT pin pair, and add a 10 µF bulk capacitor per voltage domain. Estimated: at 100% logic utilization with 93 I/O toggling at 50 MHz, ICCINT can reach 250-400 mA - design the regulator with at least 20% headroom and use a low-ESR bulk cap to suppress 100 kHz ripple.
The 144-LQFP package has a 0.5 mm lead pitch requiring fine-pitch PCB layout: keep trace width ≤ 0.15 mm and via pads ≤ 0.3 mm to escape cleanly from inner rows. Match trace lengths on clock and JTAG signals within 2-3 mm to preserve timing margins. Per the APEX-20K datasheet, the LQFP-144 footprint is hand-solderable with a fine-tipped iron, but production assembly should use reflow profiles per JEDEC J-STD-020 for moisture sensitivity level handling.
Do not confuse MSEL0/MSEL1 strapping between Active Serial (AS), Passive Serial (PS), and JTAG-only modes - wrong strapping causes configuration failure with CONF_DONE stuck low. Per the APEX-20K datasheet, the nCONFIG and nSTATUS pins are open-drain and require external pull-ups to VCCIO. Common pitfall: leaving JTAG pins floating - tie TDI and TMS high through 10 kΩ resistors to prevent spurious boundary-scan activity during power-up.
APEX-20K I/O edges are sub-2 ns - route high-speed signals over a continuous reference plane (ground preferred) and use 22-33 Ω series damping resistors at the source for stubs exceeding 25 mm. Per the APEX-20K datasheet, LVTTL outputs can drive 24 mA but produce ground bounce when switched simultaneously; stagger critical clocks by 2-4 ns using the LAB input delay chains to break simultaneity.
Informations de conformité
Compliance status not stated in the verified distributor snippets; refer to the official Intel APEX-20K datasheet and material declaration documents for RoHS / lead-free / halogen-free status. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part.