EP2SGX60EF1152C3N - 60K LEs Stratix II GX FPGA | Intel | 1152-BBGA
Référence : EP2SGX60EF1152C3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 5 | $2710 | $13 550,00 |
| 10 | $2580 | $25 800,00 |
| 25 | $2410 | $60 250,00 |
| 100 | $2195 | $219 500,00 |
EP2SGX60EF1152C3N Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect via a hardware description language (HDL). FPGAs occupy a tier in the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They offer parallel processing, deterministic timing, and hardware-level reprogrammability that microcontrollers and DSPs cannot match for high-throughput, low-latency signal processing.
The EP2SGX60EF1152C3N integrates 3022 logic array blocks (LABs) with 534 user I/Os, four phase-locked loops (PLLs), and embedded multiplier blocks (18x18) for DSP arithmetic. The device is offered in the C3 speed grade (commercial, -3 speed bin) and ships in a 35 mm x 35 mm 1152-pin FC-FBGA with 1.0 mm ball pitch, providing ample I/O for high-bandwidth memory interfaces and parallel data acquisition. The GX suffix denotes integrated multi-gigabit transceivers.
Stratix II GX transceivers support serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI at up to 3.125 Gbps. The combination of high logic density, embedded memory, hard IP for DSP, and serial transceivers makes the EP2SGX60EF1152C3N a single-chip solution for protocol bridging, high-speed data aggregation, and signal processing. The 90 nm CMOS process delivers a balance of speed and power for telecom, military, and high-end industrial systems.
Typical applications include 10G Ethernet line card aggregation, wireless baseband processing, radar and SIGINT front ends, high-speed test instrumentation, and military secure communications. Design flow uses the Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation for the device.
When designing with the EP2SGX60EF1152C3N, ensure PCB layout follows Intel's 1152-BGA flip-chip escape rules with via-in-pad or microvia stack-ups for signal-integrity. Thermal management requires an adequate thermal pad connection to the PCB inner copper plane to keep junction temperature within the 100C commercial limit. The C3 speed grade is one step below the fastest C4 and C5 bins; verify timing closure against your target fMAX before committing to the bin.
This page consolidates distributor pricing, same-brand Stratix II GX alternates, and practical Quartus II design notes not found in the device datasheet alone.
Alternatives de remplacement direct pour EP2SGX60EF1152C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX60EF1152C3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Package Type, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2SGX60EF1152C5N
✅ Remplacement direct✓ En stock
$3300 / unité
Voir la fiche technique →EP2SGX60EF1152C4N
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2SGX60EF1152I4N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2SGX60CF1152C5N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP2S60F1020C5N
✅ Remplacement direct✓ En stock
$143.75 / unité
Voir la fiche technique →EP2SGX60EF1152C3N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Series | Stratix II |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 |
| Logic Array Blocks (LABs) | 3022 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/Os | 534 |
| Process Technology | 90 nm CMOS |
| Core Voltage (Vcc) | 1.2 V |
| Maximum Internal Frequency | 717 MHz |
| Propagation Delay | 0.40 ns |
| PLLs | 4 |
| Transceiver Data Rate | 3.125 Gbps per channel |
| Boîtier | 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch |
| Speed Grade | C3 (commercial, -3 bin) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP2SGX60EF1152C3N 1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch
Configuration des broches du EP2SGX60EF1152C3N (boîtier 1152-bbga (fc-fbga) 35 x 35 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX60EF1152C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX60EF1152C3N convient pour 6 applications: 10 Gigabit Ethernet Line Card Aggregation, Wireless Baseband Processing (WCDMA/LTE), Military Radar and SIGINT Front End, High-Speed Test and Measurement Instrumentation, Medical Imaging (Ultrasound Beamforming), Secure Military Communications Encryptor.
10 Gigabit Ethernet Line Card Aggregation
The EP2SGX60EF1152C3N integrates multi-gigabit transceivers supporting 3.125 Gbps per channel, enabling direct XAUI (4 x 3.125 Gbps) and 10 Gigabit Ethernet connectivity without external PHYs. The 60,440 logic elements plus 2,544,192 bits of embedded memory allow aggregation of multiple 1G/10G ports, packet buffering, and classification logic on a single device. In line card designs, the FPGA sits between network processors and SFP+/XFP optical modules, performing traffic shaping and protocol bridging. The 534 user I/Os support parallel connection to TCAMs, RLDRAM II, and backplane SERDES, making it ideal for legacy terabit-class switches and routers.
Recommandé
Wireless Baseband Processing (WCDMA/LTE)
The EP2SGX60EF1152C3N provides DSP-grade performance for wireless baseband signal processing, with embedded 18x18 multipliers and thousands of logic elements for FFT, channel estimation, and turbo decoder cores. At 1.2 V core and 90 nm CMOS, it sustains multi-antenna (MIMO) processing for WCDMA, WiMAX, and early LTE base stations. The 3.125 Gbps transceivers interface with CPRI/OBSAI fronthaul links to remote radio heads, while 534 user I/Os support parallel ADC/DAC data capture. The 1152-BGA package enables dense PCB layouts for baseband units where board area is constrained.
Recommandé
Military Radar and SIGINT Front End
The EP2SGX60EF1152C3N is widely used in military radar and signals-intelligence (SIGINT) systems where high logic density, embedded memory, and hardened transceivers are required for digital receiver channelization, pulse compression, and direction-finding algorithms. The 60K logic elements support 16+ channel digital down-conversion (DDC) chains, while 2.5 Mbits of embedded memory buffer raw ADC samples. The industrial temperature variant EP2SGX60EF1152I4N extends the same architecture to -40C to +100C for airborne and ground-mobile platforms. The 534 user I/Os handle multi-board analog-to-digital interfaces, and 3.125 Gbps links connect to backplane recorders.
Recommandé
High-Speed Test and Measurement Instrumentation
The EP2SGX60EF1152C3N serves as the central processing engine in high-speed oscilloscopes, logic analyzers, and protocol testers. Its 60,440 logic elements and 2.5 Mbits of memory enable real-time trigger logic, pattern generation, and statistics collection on multi-channel data streams. The integrated transceivers support up to 3.125 Gbps channels for serial protocol analysis (PCIe Gen 1, SATA, XAUI). The 534 user I/Os accommodate parallel LVDS data capture from front-end ADCs, and the 1152-BGA package provides the routing density required for 8-16 layer PCBs in benchtop instruments.
Recommandé
Medical Imaging (Ultrasound Beamforming)
In medical ultrasound systems, the EP2SGX60EF1152C3N performs real-time digital beamforming across 64 to 128 channels, summing echo signals with sub-microsecond delay precision. The 60K logic elements implement FIR filters, envelope detection, and harmonic imaging algorithms, while the 2.5 Mbit embedded memory holds channel data and lookup tables. The 534 user I/Os accept parallel LVDS streams from front-end ADCs, and the 3.125 Gbps transceivers offload processed images to host processors. The commercial 0C to +85C temperature range suits cart-based ultrasound systems; the I4 industrial variant is preferred for portable point-of-care devices.
Recommandé
Secure Military Communications Encryptor
The EP2SGX60EF1152C3N provides the FPGA fabric for Type-1 encrypted military communications, implementing high-speed cryptographic algorithms and protocol framing for tactical radios and satellite links. The 60,440 logic elements run AES-256, KG-84, and key-management state machines, while the 3.125 Gbps transceivers handle link-side encryption on Sonet, Fibre Channel, or custom serial interfaces. With 2.5 Mbits of memory for key tables and packet buffering, the device supports continuous encrypted traffic at line rate. The I4 industrial variant extends deployment to -40C tactical environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX60EF1152C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60EF1152I4N | EP2SGX60CF1152C5N | EP2S60F1020C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA (FC-FBGA) 35x35mm | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1152-BBGA - same | 1020-FBGA - different |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C3 (commercial) | C5 (faster) | C4 (faster) | I4 (industrial) | C5 (faster) | C5 (faster) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
| Transceivers | 3.125 Gbps GX (yes) | 3.125 Gbps GX | 3.125 Gbps GX | 3.125 Gbps GX | No transceivers (logic only) | No transceivers (Stratix II non-GX) |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| Process / Core Voltage | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V | 90 nm / 1.2 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Hardened 3.125 Gbps transceivers in the same 1152-BGA package (vs EP2SGX60CF1152C5N (logic-only Stratix II, 1152-BGA))
- C3 speed grade vs industrial I4 temperature range (vs EP2SGX60EF1152I4N)
- 60,440 logic elements in 1152-BGA - same silicon as other 1152-BGA GX variants (vs EP2SGX60EF1152C5N)
Notes de conception
Estimated: The 1152-ball FC-FBGA at 1.0 mm pitch requires a 4-1-4 or 5-1-5 HDI stack-up with micro-vias to escape the inner rows. Use via-in-pad (VIP) for transceiver balls to maintain signal integrity at 3.125 Gbps, with controlled-impedance differential traces of 100 ohms. Follow Intel's Stratix II GX High-Speed Board Design Guidelines for length-matching tolerances; typical Tx/Rx pair length matching is within 20 mil. BGA decoupling requires 0402/0201 capacitors placed within 100 mil of each power pin, totaling 60-80 capacitors per device.
Estimated: At full transceiver utilization (12-16 channels at 3.125 Gbps) and 80% logic utilization, total power dissipation can reach 15-20 W. The 1152-BGA package has a theta-JA of approximately 8-10 C/W with 16 thermal balls in a 4x4 array. Provide a thermal pad with 9-12 thermal vias to inner copper planes, and ensure chassis airflow of at least 200 LFM for the commercial 0C to +85C temperature range. For sealed enclosures, derate to 70% transceiver utilization or specify the I4 industrial variant.
Three common pitfalls when using the EP2SGX60EF1152C3N: (1) Confusing the GX (transceiver) part with the C-only (logic-only) variant - the CF/DF part numbers lack the embedded transceivers; (2) Using C3 speed grade for designs targeting fMAX above 250 MHz - migrate to C4 or C5; (3) Ignoring the 1.2 V core sequencing requirement - the FPGA needs VCCINT to ramp before VCCPD to avoid latch-up. Always use Quartus II 13.0 or earlier; later Quartus versions dropped Stratix II support.
Estimated: For 3.125 Gbps transceiver channels, maintain differential impedance at 100 ohms +/-10% with intra-pair skew below 5 mil. Use Acrylate or low-loss PCB material (e.g., Isola FR408HR) for the top layers; the per-inch loss at 3.125 Gbps is roughly 0.5 dB for standard FR-4 versus 0.3 dB for low-loss. Reference clock distribution to MGTs requires a 100 MHz or 125 MHz low-jitter oscillator with phase noise below -110 dBc/Hz at 100 kHz offset, distributed through a 1:4 zero-delay buffer for multi-channel synchronization.
Informations de conformité
Compliance status not stated in the verified distributor data. Intel/legacy Altera products are typically RoHS-compliant for the industrial part number suffix N, but the C3N was manufactured prior to 2010 and full material disclosure may not be available. The I4N industrial variant is typically lead-free. Verify with the manufacturer's material declaration for aerospace/defense applications.
