EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
Référence : EP2SGX90EF1152C4N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $950 | $950,00 |
| 10 | $880 | $8 800,00 |
| 50 | $820 | $41 000,00 |
| 100 | $760 | $76 000,00 |
| 250 | $695 | $173 750,00 |
EP2SGX90EF1152C4N Présentation
An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and routing interconnects. In the wider hierarchy, FPGAs sit above microcontrollers and ASICs in reconfigurability, and below ASICs in performance-per-watt. The Stratix II GX family is positioned as a transceiver-rich, DSP-capable platform used in telecom, video processing, and high-speed serial-link designs.
Key features of the EP2SGX90EF1152C4N include 90,960 logic elements, 4.5 Mbit embedded memory, embedded DSP blocks for high-throughput signal processing, and up to 20 full-duplex CDR-based transceivers reaching 6.375 Gbps per channel. The 1152-ball FC-FBGA package supports high pin counts for parallel and serial I/O simultaneously, and the C4 speed grade balances Fmax and timing closure across industrial temperature ranges. The device is built on a 90 nm process node with a 1.2 V core.
The Stratix II GX architecture uses adaptive logic modules (ALMs) rather than older 4-input LUTs, with each ALM capable of implementing any 7-input function or multiple smaller functions for finer logic packing. Embedded transceivers support CPRI, OBSAI, Serial RapidIO, PCIe, and custom serial protocols up to 6.375 Gbps, while the dedicated DSP blocks deliver up to 18x18-bit signed multiplication per cycle. TriMatrix memory blocks (MLABs, M512, M4K, M-RAM) are interleaved across the fabric to optimize both small and large memory buffering.
Typical applications include high-end telecom baseband and packet processing, broadcast video bridge and router designs, high-speed serial protocol test equipment, defense and aerospace signal processing, and PCI Express endpoint/root port cards. Designers also use this device for ASIC prototyping due to its high LE count and abundant I/O bandwidth. Engineering trade-offs to consider include the 90 nm power profile (higher static leakage versus newer 40/28/20 nm Stratix IV/V/A10 families), the large 1152-ball BGA which demands 8+ layer PCB with controlled-impedance routing, and the C4 speed grade's timing margin relative to C5 or I-grade variants.
Alternatives de remplacement direct pour EP2SGX90EF1152C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2SGX90EF1152C4N (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Total RAM Bits, Speed Grade, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
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Voir la fiche technique →EP2SGX90EF1152C4ES
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Voir la fiche technique →EP2SGX90EF1152C4N Valeurs maximales et caractéristiques électriques
| Family | Stratix II GX |
| Logic Elements (LE) | 90,960 |
| LABs/CLBs | 4,548 |
| Total RAM Bits | 4,520,448 bits |
| User I/O Count | 558 |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Transceivers | Up to 20 channels, 6.375 Gbps per channel |
| Speed Grade | C4 |
| Température de fonctionnement | Commercial (0C to +85C) |
| Boîtier | 1152-BBGA / FC-FBGA-1152 |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | MSL-3 / MS-034AAR-1 (per package outline) |
| Lead-Free / RoHS | Lead free; RoHS compliance per JEDEC |
Guide de configuration des broches du EP2SGX90EF1152C4N 1152-bbga / fc-fbga-1152
Configuration des broches du EP2SGX90EF1152C4N (boîtier 1152-bbga / fc-fbga-1152). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2SGX90EF1152C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2SGX90EF1152C4N convient pour 7 applications: Telecom Baseband Processing, Broadcast Video Bridge and Router, ASIC Prototyping Platform, PCI Express Endpoint Card, High-Speed Serial Protocol Test Equipment, Defense and Aerospace Signal Processing, Medical Imaging and Diagnostics.
Telecom Baseband Processing
The EP2SGX90EF1152C4N is a strong fit for telecom baseband and packet processing cards: its 90,960 logic elements, 4.5 Mbit embedded TriMatrix memory, and 6.375 Gbps transceivers handle CPRI/OBSAI fronthaul and Serial RapidIO backhaul. With 558 user I/O and 20 high-speed serial channels, a single device can terminate multiple antenna streams while running PHY and MAC layer logic in fabric. Designers typically build CPRI v4.2 + 10G Ethernet bridges, LTE PHY pre/post-processing, and LTE/WCDMA baseband modems on this part.
Recommandé
Broadcast Video Bridge and Router
The EP2SGX90EF1152C4N is widely used in broadcast video bridges, routers, and multiviewer systems: SDI (SMPTE 259M/292M/424M) and DVB-ASI interfaces aggregate through its 558 user I/O, while SD/HD/3G-SDI switching and processing run in fabric. The 4.5 Mbit embedded memory is enough for line buffers and frame synchronization FIFOs without external SRAM. Embedded transceivers route SDI over coax or fiber via external cable drivers, and the C4 speed grade easily closes timing for 148.5 MHz and 297 MHz video paths.
Recommandé
ASIC Prototyping Platform
ASIC prototyping on EP2SGX90EF1152C4N takes advantage of 90,960 logic elements, abundant TriMatrix memory, and 558 user I/O for partitioning large ASIC RTL into multiple FPGAs. The device's 90 nm core plus C4 speed grade gives deterministic timing for multi-FPGA partition boundaries. Embedded transceivers connect daughter boards at 6.375 Gbps, replacing expensive board-to-board parallel buses. Quartus II's LogicLock and TimeQuest closure flows let ASIC teams partition, route, and verify 5-10M ASIC-gate designs on a 4-board stack.
Recommandé
PCI Express Endpoint Card
The EP2SGX90EF1152C4N is well-suited for PCI Express Gen1 (and soft-Gen2) endpoint cards in server and instrumentation: its embedded transceivers implement the PCIe PHY, and the hard PCIe IP block handles MAC/data link layers. With 90,960 LE available, designers can host a DMA engine, MSI-X interrupt controller, user logic, and application-specific processing fabric in a single device. The C4 speed grade meets PCIe Gen1 timing at 2.5 Gbps with margin, and 558 user I/O expose expansion buses, DDR2/QDR II interfaces, and GPIO.
Recommandé
High-Speed Serial Protocol Test Equipment
The EP2SGX90EF1152C4N is frequently used in protocol analyzers and BERT testers for CPRI, OBSAI, Serial RapidIO, and custom serial standards: 20 transceivers at 6.375 Gbps allow simultaneous multi-channel monitoring at line rate. On-chip logic elements implement error counters, protocol decoders, and timestamp logic without external ASICs. The 4.5 Mbit memory holds packet capture buffers, and 558 user I/O expose triggers, front-panel interfaces, and high-speed parallel test buses.
Recommandé
Defense and Aerospace Signal Processing
The EP2SGX90EF1152C4N fits defense signal processing subsystems: radar digitizers, electronic warfare front ends, and software-defined radio baseband all benefit from 90,960 LE for FFT/filters, 6.375 Gbps transceivers for digital IF, and the wide operating-temperature screening options available on the Stratix II GX family. Embedded DSP blocks accelerate FIR filters and FFT butterflies, while TriMatrix memory provides window buffers and overlap-save storage. The FC-FBGA-1152 package supports ruggedized module assembly with underfill and lid options.
Recommandé
Medical Imaging and Diagnostics
The EP2SGX90EF1152C4N is used in ultrasound beamforming, CT reconstruction, and MRI receiver chains: 90,960 LE handle DSP pipelines, 4.5 Mbit TriMatrix memory holds line buffers, and 6.375 Gbps transceivers stream digitized RF/IF data between ADCs and the host processor. The 558 user I/O connect to LVDS ADC banks and LVDS-to-FPGA bridges. Designers achieve sub-100 mW per channel on receive beamforming with optimized DSP block usage, and the C4 speed grade easily closes timing for 80 MHz beamformer clocks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2SGX90EF1152C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2SGX90EF1152C4 | EP2SGX90EF1152C3N | EP2SGX90EF1152C3 | EP2SGX90EF1152C4ES | EP2SGX60EF1152C4N |
|---|---|---|---|---|---|---|
| Package | FC-FBGA-1152 | FC-FBGA-1152 - same | FC-FBGA-1152 - same | FC-FBGA-1152 - same | FC-FBGA-1152 - same | FC-FBGA-1152 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE | 90,960 LE | 56,880 LE (-37%) |
| Speed Grade | C4 | C4 | C3 (slower) | C3 (slower) | C4 ES | C4 |
| RoHS / Lead-Free | Lead-free, RoHS | Lead-bearing, non-RoHS | Lead-free, RoHS | Lead-bearing, non-RoHS | RoHS | Lead-free, RoHS |
| Transceiver Channels | Up to 20 @ 6.375 Gbps | Up to 20 @ 6.375 Gbps | Up to 20 @ 6.375 Gbps | Up to 20 @ 6.375 Gbps | Up to 20 @ 6.375 Gbps | Up to 20 @ 6.375 Gbps (some may be no-connects at lower density) |
| User I/O | 558 | 558 | 558 | 558 | 558 | 558 |
Principaux différenciateurs
- Highest-density Stratix II GX with C4 grade availability in FC-FBGA-1152 (vs EP2SGX60EF1152C4N)
- RoHS-compliant lead-free termination (vs EP2SGX90EF1152C4)
- C4 speed grade balances Fmax and power for commercial temperature (vs EP2SGX90EF1152C3N)
Notes de conception
Estimated: the Stratix II GX family typically dissipates 4-9 W quiescent and 10-18 W peak in FC-FBGA-1152 packages under full fabric utilization. With the C4 speed grade and 90 nm core, theta_JA on a 4-layer JEDEC test board is roughly 12-15 C/W; the bottom thermal pad must be soldered to a 4x4 grid of thermal vias connecting to an internal copper plane. Add a heat spreader or heatsink for industrial (-40C to +100C) or military-grade screening.
Route the FC-FBGA-1152 on a minimum 8-layer PCB with stacked microvias or HDI build-up: the 1.0 mm BGA pitch escapes through 4-5 inner routing layers. Maintain 50 ohm single-ended and 100 ohm differential impedance for transceiver channels; place AC-coupling caps within 100 mils of the FPGA TX pins. Decouple the 1.2 V core with a 100 uF bulk plus 0.1 uF / 0.01 uF / 0.001 uF network per VCC pin pair, and provide separate analog supplies for PLL and transceiver blocks.
Do not assume speed grades are interchangeable - the C4 timing margin differs from C3 or C5 by 10-20% on critical paths. Verify MSL handling because the FC-FBGA-1152 is moisture-sensitive (MSL-3/4) and requires dry-pack storage. Confirm configuration scheme (Fast Passive Parallel, AS, JTAG) before board layout because MODE pins select the configuration mode and cannot be changed in-system.
The 6.375 Gbps transceivers demand strict PCB stack-up: use low-loss FR-4 (Df < 0.015) or Megtron 6, with controlled-impedance striplines for TX/RX pairs. Reference each transceiver differential pair to a continuous ground plane; never split the reference plane beneath a SerDes pair. Calibrate transmitter pre-emphasis and receiver equalization via the Quartus II Transceiver Toolkit during board bring-up.
Informations de conformité
RoHS-compliant lead-free finish per JEDEC J-STD-020 MSL classification. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive qualified). REACH compliance per Intel/Altera product declarations.
