EP3SE260F1152C3N vs EP3SE260F1152C4N Comparaison
Comparaison détaillée côte à côte de EP3SE260F1152C3N par Intel et EP3SE260F1152C4N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ Actif
Comparaison des spécifications
| Paramètre | EP3SE260F1152C3N | EP3SE260F1152C4N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $7 500,00 | $1 620,00 |
| Series | Stratix III E | Stratix III E |
| Logic Elements / Cells | 255,000 | — |
| Embedded Memory Bits | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| User I/O Count | 744 | — |
| Boîtier | 1152-BBGA, FCBGA | 1152-ball FC-FBGA (flip-chip) |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Température de fonctionnement | 0 C to +85 C (Commercial) | 0C to +85C (commercial, 'C' suffix) |
| Transceivers | Integrated high-speed transceivers | — |
| DSP Blocks | Yes (dedicated multiplier/accumulator) | — |
| Embedded Memory Type | TriMatrix (true dual-port, FIFO, ROM, RAM) | — |
| External Memory Support | DDR3, DDR2, QDR II+, RLDRAM II | — |
| Configuration Modes | AS, AP, PS, FPP, JTAG | — |
| Partial Reconfiguration | Supported | — |
| Programmable Power Technology | Yes (up to 50% dynamic power reduction) | — |
| Statut RoHS | Compliant | — |
| Family | — | Stratix III (Enhanced) |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Maximum Operating Frequency | — | 450 MHz |
| Speed Grade | — | -4 (commercial temperature) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| Type de mémoire | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |