EP3SE260F1152C3N vs EP3SE260F1152C4N 对比

详细并排对比 EP3SE260F1152C3N 出自 Intel 和 EP3SE260F1152C4N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260F1152C3N EP3SE260F1152C4N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $7,500.00 $1,620.00
Series Stratix III E Stratix III E
Logic Elements / Cells 255,000 —
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 —
封装 1152-BBGA, FCBGA 1152-ball FC-FBGA (flip-chip)
安装类型 Surface Mount Surface Mount (BGA)
Process Technology 65 nm 65 nm CMOS
Core Voltage 1.1 V 1.1 V
工作温度 0 C to +85 C (Commercial) 0C to +85C (commercial, 'C' suffix)
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
RoHS 状态 Compliant —
Family — Stratix III (Enhanced)
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Maximum Operating Frequency — 450 MHz
Speed Grade — -4 (commercial temperature)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
存储器类型 — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

数据手册与资源

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