EP3SE260H780C3N vs EP3SE260F1152C3N Comparaison
Comparaison détaillée côte à côte de EP3SE260H780C3N par Intel et EP3SE260F1152C3N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SE260H780C3N - Stratix III E FPGA, 255K LE, 780-BGA | Intel / Altera
EP3SE260H780C3N ✓ ActifIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ ActifComparaison des spécifications
| Paramètre | EP3SE260H780C3N | EP3SE260F1152C3N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 325,00 | $7 500,00 |
| Series | Stratix® III E | Stratix III E |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory (bits) | 16,672,768 | — |
| Number of LABs/CLBs | 10,200 | — |
| User I/Os | 488 | — |
| Number of Pins / Balls | 780 | — |
| Boîtier | 780-BBGA, FCBGA (H780) | 1152-BBGA, FCBGA |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | 0 °C to +85 °C (C grade, commercial) | 0 C to +85 C (Commercial) |
| Process Technology | 40 nm CMOS | 65 nm |
| Maximum Core Frequency | [DATA_NEEDED: maximum core frequency MHz] | — |
| Supply Voltage (VCCINT) | [DATA_NEEDED: VCCINT nominal V] | — |
| Transceivers | [DATA_NEEDED: number of embedded transceivers and max data rate] | Integrated high-speed transceivers |
| DSP Blocks | [DATA_NEEDED: number of DSP blocks and precision] | Yes (dedicated multiplier/accumulator) |
| Statut RoHS | Compliant (lead-free 'N' suffix) | Compliant |
| Niveau de sensibilité à l'humidité (MSL) | [DATA_NEEDED: MSL level per JEDEC J-STD-020] | — |
| Configuration Method | SRAM-based, configured via JTAG / passive / active serial / fast passive parallel | — |
| Design Toolchain | Altera Quartus II (legacy); Intel Quartus Prime | — |
| Logic Elements / Cells | — | 255,000 |
| Embedded Memory Bits | — | 16,672,768 bits |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |