EP3SE260H780C3N vs EP3SE260F1152C3N 对比

详细并排对比 EP3SE260H780C3N 出自 Intel 和 EP3SE260F1152C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE260H780C3N EP3SE260F1152C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $1,325.00 $7,500.00
Series Stratix® III E Stratix III E
Logic Elements (LE) 255,000 —
Embedded Memory (bits) 16,672,768 —
Number of LABs/CLBs 10,200 —
User I/Os 488 —
Number of Pins / Balls 780 —
封装 780-BBGA, FCBGA (H780) 1152-BBGA, FCBGA
安装类型 Surface Mount Surface Mount
工作温度 0 °C to +85 °C (C grade, commercial) 0 C to +85 C (Commercial)
Process Technology 40 nm CMOS 65 nm
Maximum Core Frequency [DATA_NEEDED: maximum core frequency MHz] —
Supply Voltage (VCCINT) [DATA_NEEDED: VCCINT nominal V] —
Transceivers [DATA_NEEDED: number of embedded transceivers and max data rate] Integrated high-speed transceivers
DSP Blocks [DATA_NEEDED: number of DSP blocks and precision] Yes (dedicated multiplier/accumulator)
RoHS 状态 Compliant (lead-free 'N' suffix) Compliant
湿敏等级(MSL) [DATA_NEEDED: MSL level per JEDEC J-STD-020] —
Configuration Method SRAM-based, configured via JTAG / passive / active serial / fast passive parallel —
Design Toolchain Altera Quartus II (legacy); Intel Quartus Prime —
Logic Elements / Cells — 255,000
Embedded Memory Bits — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
User I/O Count — 744
Core Voltage — 1.1 V
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

数据手册与资源

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