EP3SL340F1760C4 vs EP3SL340F1760I3 Comparaison
Comparaison détaillée côte à côte de EP3SL340F1760C4 par Intel et EP3SL340F1760I3 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Dernier achatIntel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Dernier achatComparaison des spécifications
| Paramètre | EP3SL340F1760C4 | EP3SL340F1760I3 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9 750,00 | $1 450,00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 LE |
| Embedded Memory Bits | 18,821,144 | 18,822,144 bit |
| User I/O Count | 1,120 | — |
| Boîtier | 1760-BBGA, FCBGA (Flip-Chip) | — |
| Process Node | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Core Frequency | 450 MHz | — |
| Speed Grade | C4 (commercial) | I3 (Industrial, mid-speed bin) |
| Température de fonctionnement | 0C to +85C (commercial) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | [DATA_NEEDED: number of embedded transceiver channels] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG | — |
| Statut RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Lead-Free | Yes | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| LABs (Logic Array Blocks) | — | 13,500 |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| Niveau MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |