EP3SL340F1760C4 vs EP3SL340F1760I3 Сравнение
Подробное сравнение бок о бок EP3SL340F1760C4 от Intel и EP3SL340F1760I3 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Последняя закупкаIntel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP3SL340F1760C4 | EP3SL340F1760I3 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | Последняя закупка |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $9.750,00 | $1.450,00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 LE |
| Embedded Memory Bits | 18,821,144 | 18,822,144 bit |
| User I/O Count | 1,120 | — |
| Корпус | 1760-BBGA, FCBGA (Flip-Chip) | — |
| Process Node | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Core Frequency | 450 MHz | — |
| Speed Grade | C4 (commercial) | I3 (Industrial, mid-speed bin) |
| Рабочая температура | 0C to +85C (commercial) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | [DATA_NEEDED: number of embedded transceiver channels] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG | — |
| Статус RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Lead-Free | Yes | — |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| LABs (Logic Array Blocks) | — | 13,500 |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| Уровень MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |