EP3SL340F1760C4 vs EP3SL340F1760I3 Comparison
Detailed side-by-side comparison of EP3SL340F1760C4 by Intel and EP3SL340F1760I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 β Last Time BuyIntel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 β Last Time BuySpecification Comparison
| Parameter | EP3SL340F1760C4 | EP3SL340F1760I3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9,750.00 | $1,450.00 |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 LE |
| Embedded Memory Bits | 18,821,144 | 18,822,144 bit |
| User I/O Count | 1,120 | β |
| Package | 1760-BBGA, FCBGA (Flip-Chip) | β |
| Process Node | 65 nm | β |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Core Frequency | 450 MHz | β |
| Speed Grade | C4 (commercial) | I3 (Industrial, mid-speed bin) |
| Operating Temperature | 0C to +85C (commercial) | -40 Β°C to 100 Β°C (Industrial grade, I3 suffix) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X | β |
| Transceivers | [DATA_NEEDED: number of embedded transceiver channels] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG | β |
| RoHS Status | Compliant | Compliant (Pb-free BGA balls) |
| Lead-Free | Yes | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| LABs (Logic Array Blocks) | β | 13,500 |
| User I/Os | β | 1120 |
| Number of Pins / Balls | β | 1760 |
| Package Type | β | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | β | BGA1760, 42x42, 40 |
| Process Technology | β | 65 nm |
| Configuration Memory | β | SRAM-based, volatile (requires external configuration device) |
| MSL Level | β | MSL3 (JEDEC J-STD-020, reflow 245 Β°C peak) |