EPF10K100EBC356-1X vs EPF10K100EBC356-2 Comparaison
Comparaison détaillée côte à côte de EPF10K100EBC356-1X par Intel et EPF10K100EBC356-2 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteComparaison des spécifications
| Paramètre | EPF10K100EBC356-1X | EPF10K100EBC356-2 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $165,00 | $59,95 |
| Series | FLEX 10KE | FLEX-10KE |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Température de fonctionnement | 0 C to +70 C (Commercial) | 0 C to 70 C (Commercial) |
| Package Type | 356-LBGA (BGA-356) | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -2 |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | SRAM, JTAG (IEEE 1149.1) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Process Technology | — | CMOS, SRAM-based |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |