EPF10K100EBC356-1X vs EPF10K100EBC356-2 비교
다음의 상세 나란히 비교: EPF10K100EBC356-1X 제조: Intel 및 EPF10K100EBC356-2 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 Obsolete사양 비교
| 파라미터 | EPF10K100EBC356-1X | EPF10K100EBC356-2 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $165.00 | $59.95 |
| Series | FLEX 10KE | FLEX-10KE |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| 동작 온도 | 0 C to +70 C (Commercial) | 0 C to 70 C (Commercial) |
| Package Type | 356-LBGA (BGA-356) | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -2 |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | SRAM, JTAG (IEEE 1149.1) |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Process Technology | — | CMOS, SRAM-based |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |