EPF10K100EBC356-1X vs EPF10K100EBC356-2 Comparison

Detailed side-by-side comparison of EPF10K100EBC356-1X by Intel and EPF10K100EBC356-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-1X EPF10K100EBC356-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Series FLEX 10KE FLEX-10KE
Logic Elements 4,992 —
Typical Gates 100,000 100,000
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 12
Total RAM Bits 49,152 49,152
User I/O Count 274 —
Propagation Delay 0.6 ns —
Logic Family CMOS —
Core Process Technology 0.22 um CMOS, 5 metal layers —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) —
I/O Supply Voltage 3.3 V (multi-volt tolerant to 5 V) —
Operating Temperature 0 C to +70 C (Commercial) 0 C to 70 C (Commercial)
Package Type 356-LBGA (BGA-356) 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Package Dimensions 35 x 35 mm, 1.27 mm ball pitch —
Speed Grade -1X -2
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) SRAM, JTAG (IEEE 1149.1)
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
MSL Level [DATA_NEEDED: MSL rating] —
Family — Embedded Programmable Logic Device (PLD)
Maximum System Gates — 158,000
Logic Elements (LEs) — 4,992
Number of LABs/CLBs — 624
User I/O Pins — 274
Supply Voltage (Core) — 2.375 V to 2.625 V (2.5 V nominal)
Propagation Delay (tPD) — 0.5 ns
Internal Operating Frequency — up to 250 MHz
Process Technology — CMOS, SRAM-based
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

Browse All Products Create BOM Request Quote