EPF10K100EBC356-1X vs EPF10K100EBC356-2 Comparação
Comparação detalhada lado a lado de EPF10K100EBC356-1X por Intel e EPF10K100EBC356-2 por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteComparação de especificações
| Parâmetro | EPF10K100EBC356-1X | EPF10K100EBC356-2 |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | NRND | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $165,00 | $59,95 |
| Series | FLEX 10KE | FLEX-10KE |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Temperatura de operação | 0 C to +70 C (Commercial) | 0 C to 70 C (Commercial) |
| Package Type | 356-LBGA (BGA-356) | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -2 |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | SRAM, JTAG (IEEE 1149.1) |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Nível MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Process Technology | — | CMOS, SRAM-based |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |