M1AFS600-2FG256 vs AFS600-FG256I Comparaison
Comparaison détaillée côte à côte de M1AFS600-2FG256 par Microchip Technology et AFS600-FG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS600-2FG256 - Fusion FPGA 600K Gates ARM Cortex-M1 | Microchip
M1AFS600-2FG256 ✓ ActifMicrochip Technology
AFS600-FG256I - 600K-Gate Mixed-Signal FPGA | Microchip Technology
AFS600-FG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS600-2FG256 | AFS600-FG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Series | M1AFS600 (Fusion) | — |
| System Gates | 600000 gates | 600,000 gates |
| Logic Elements | 110592 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Number of I/Os | 119 I/O | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm flash-based | — |
| Boîtier / Format | 256-LBGA (FBGA-256) | — |
| Style de montage | SMD/SMT | — |
| Operating Temperature - Minimum | 0 C | — |
| Operating Temperature - Maximum | +70 C | — |
| Packaging | Tray | — |
| Analog Peripherals | Configurable analog block (Fusion mixed-signal) | — |
| On-chip Memory | Large flash memory blocks | — |
| Clock Management | On-chip clock generation and management (PLL) | — |
| Configuration | Flash-based, live at power-up, no external config PROM required | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Maximum Operating Frequency | [DATA_NEEDED: maximum fabric operating frequency] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Blocks | — | 13,824 CLBs |
| User I/O | — | 119 I/O |
| Tension d'alimentation | — | 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash memory |
| Power-Up Feature | — | Live at Power-Up (LAPU) |
| Logic Family | — | CMOS |
| Package Type | — | 256-LBGA |
| Package Pitch | — | 1.0 mm |
| Number of Package Balls | — | 256 balls |
| Package Shape | — | Square |
| Type de montage | — | Surface mount |
| Température de fonctionnement | — | 0 C to 70 C |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |